TW200718347A - Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil - Google Patents

Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil

Info

Publication number
TW200718347A
TW200718347A TW095125642A TW95125642A TW200718347A TW 200718347 A TW200718347 A TW 200718347A TW 095125642 A TW095125642 A TW 095125642A TW 95125642 A TW95125642 A TW 95125642A TW 200718347 A TW200718347 A TW 200718347A
Authority
TW
Taiwan
Prior art keywords
copper foil
blackening
treated copper
surface treated
blackening surface
Prior art date
Application number
TW095125642A
Other languages
English (en)
Inventor
Tsutomu Higuchi
Mitsuyoshi Matsuda
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200718347A publication Critical patent/TW200718347A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW095125642A 2005-07-14 2006-07-13 Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil TW200718347A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005205445 2005-07-14

Publications (1)

Publication Number Publication Date
TW200718347A true TW200718347A (en) 2007-05-01

Family

ID=37637246

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125642A TW200718347A (en) 2005-07-14 2006-07-13 Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil

Country Status (5)

Country Link
JP (1) JPWO2007007870A1 (zh)
KR (1) KR20080025143A (zh)
CN (1) CN101223839A (zh)
TW (1) TW200718347A (zh)
WO (1) WO2007007870A1 (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462662B (zh) * 2013-02-06 2014-11-21 Nanya Plastics Corp 複合式雙面黑色銅箔及其製造方法
TWI580818B (zh) * 2014-06-24 2017-05-01 Okuno Chemical Industries Co Ltd And a composition for blackening a copper-based metal or a silver-based metal
TWI688973B (zh) * 2015-04-28 2020-03-21 日商住友金屬礦山股份有限公司 導電性基板
TWI751111B (zh) * 2015-06-26 2022-01-01 日商住友金屬礦山股份有限公司 導電性基板
US11373589B1 (en) 2021-03-08 2022-06-28 Lextar Electronics Corporation Display with pixel devices emitting light simultaneously
TWI782401B (zh) * 2020-09-18 2022-11-01 隆達電子股份有限公司 發光陣列結構及顯示器
US11961951B2 (en) 2020-07-29 2024-04-16 Lextar Electronics Corporation Light emitting diode device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5104015B2 (ja) * 2007-04-26 2012-12-19 凸版印刷株式会社 電磁波遮蔽用の金属メッシュシートおよびその製造方法
JP5497808B2 (ja) * 2012-01-18 2014-05-21 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた銅張積層板
CN102618902B (zh) * 2012-04-24 2015-04-01 山东金宝电子股份有限公司 一种挠性覆铜板用铜箔的表面处理工艺
JP5816230B2 (ja) * 2012-05-11 2015-11-18 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
TWI539032B (zh) * 2013-08-01 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil, cleaning fluid composition and cleaning copper foil method
JP6539281B2 (ja) 2014-09-02 2019-07-03 三井金属鉱業株式会社 黒色化表面処理銅箔及びキャリア箔付銅箔
KR102402300B1 (ko) * 2014-12-08 2022-05-27 미쓰이금속광업주식회사 프린트 배선판의 제조 방법
JP6970025B2 (ja) * 2018-01-10 2021-11-24 タツタ電線株式会社 電磁波シールドフィルム
TWI776168B (zh) * 2019-06-19 2022-09-01 金居開發股份有限公司 進階反轉電解銅箔及應用其的銅箔基板
JP7392996B2 (ja) * 2019-06-19 2023-12-06 金居開發股▲分▼有限公司 アドバンスド電解銅箔及びそれを適用した銅張積層板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3782250B2 (ja) * 1999-03-31 2006-06-07 共同印刷株式会社 電磁波シールド基材の製造方法
JP2003201597A (ja) * 2002-01-09 2003-07-18 Nippon Denkai Kk 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体
JP3756852B2 (ja) * 2002-07-01 2006-03-15 日本電解株式会社 電解銅箔の製造方法
JP4573254B2 (ja) * 2002-10-25 2010-11-04 Ｊｘ日鉱日石金属株式会社 プラズマディスプレーパネル用銅箔及びその製造方法
JP4120806B2 (ja) * 2002-10-25 2008-07-16 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
JP4458519B2 (ja) * 2003-07-28 2010-04-28 三井金属鉱業株式会社 黒色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462662B (zh) * 2013-02-06 2014-11-21 Nanya Plastics Corp 複合式雙面黑色銅箔及其製造方法
US8957326B2 (en) 2013-02-06 2015-02-17 Nan Ya Plastics Corporation Composite dual blackened copper foil and method of manufacturing the same
TWI580818B (zh) * 2014-06-24 2017-05-01 Okuno Chemical Industries Co Ltd And a composition for blackening a copper-based metal or a silver-based metal
TWI688973B (zh) * 2015-04-28 2020-03-21 日商住友金屬礦山股份有限公司 導電性基板
TWI751111B (zh) * 2015-06-26 2022-01-01 日商住友金屬礦山股份有限公司 導電性基板
US11961951B2 (en) 2020-07-29 2024-04-16 Lextar Electronics Corporation Light emitting diode device
TWI782401B (zh) * 2020-09-18 2022-11-01 隆達電子股份有限公司 發光陣列結構及顯示器
US11610875B2 (en) 2020-09-18 2023-03-21 Lextar Electronics Corporation Light emitting array structure and display
US11373589B1 (en) 2021-03-08 2022-06-28 Lextar Electronics Corporation Display with pixel devices emitting light simultaneously

Also Published As

Publication number Publication date
KR20080025143A (ko) 2008-03-19
WO2007007870A1 (ja) 2007-01-18
JPWO2007007870A1 (ja) 2009-01-29
CN101223839A (zh) 2008-07-16

Similar Documents

Publication Publication Date Title
TW200718347A (en) Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil
WO2008140007A1 (ja) 導電性基板、プラズマディスプレイ用電磁波シールド基板および導電性基板の製造方法
MX2008016433A (es) Empaque de blindaje contra las ondas electromagneticas que tienen elasticidad y adhesividad.
PH12019000429A1 (en) Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
PH12014000344B1 (en) Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board
TW200639441A (en) PDP filter and manufacturing method thereof
TW200740641A (en) Capacitive sensor and method for manufacturing the same
TW200641187A (en) Plated treatment method, transmittancy electroconductive film and electromagnetic shielding film
WO2003104884A3 (en) ELECTRO-OPTICAL DISPLAY COMPONENTS AND METHODS
TW200701043A (en) Mounting structure of re-peelable protective panel and mounting sheet using the same
MY182166A (en) Copper foil, copper foil with carrier foil, and copper-clad laminate
TW200724640A (en) Heat-transferring adhesive tape with improved functionality
ATE526151T1 (de) Leitfähiger laminierter körper, folie zur abschirmung von elektromagnetischen wellen für plasmaanzeige und schutzplatte für plasmaanzeige
EP1434248A3 (en) Method for producing light-transmitting electromagnetic wave-shielding film, light-transmitting eletromagnetic wave-shielding film and plasma display panel using the shielding film
WO2006115528A3 (en) Flame retardant emi shields
TW200625346A (en) Conductive film
TW200619434A (en) Multilayer body with differently microstructured areas provided with an electroconductive coating
EP1876876A4 (en) TRANSPARENT ELECTRICALLY CONDUCTIVE FILM AND PROCESS FOR ITS MANUFACTURE
TW200703376A (en) Touch panel
TW200700221A (en) Copper clad laminated sheet and its manufacturing method
WO2008108400A1 (ja) 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子
SG153797A1 (en) Circuit board
WO2010045397A3 (en) Emi-shielding solutions for electronics enclosures using opposing three-dimensional shapes and channels formed in sheet metal
TWI462662B (zh) 複合式雙面黑色銅箔及其製造方法
EP1940205A3 (en) Microwave circuit board