TW200715435A - Die pickup apparatus, method for using the same and die pickup method - Google Patents

Die pickup apparatus, method for using the same and die pickup method

Info

Publication number
TW200715435A
TW200715435A TW095129296A TW95129296A TW200715435A TW 200715435 A TW200715435 A TW 200715435A TW 095129296 A TW095129296 A TW 095129296A TW 95129296 A TW95129296 A TW 95129296A TW 200715435 A TW200715435 A TW 200715435A
Authority
TW
Taiwan
Prior art keywords
push
die pickup
linking
contact
outermost
Prior art date
Application number
TW095129296A
Other languages
English (en)
Other versions
TWI345280B (zh
Inventor
Hideji Nishio
Yasushi Sato
Shinichi Sasaki
Yutaka Odaka
Takashi Nobe
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200715435A publication Critical patent/TW200715435A/zh
Application granted granted Critical
Publication of TWI345280B publication Critical patent/TWI345280B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
TW095129296A 2005-10-11 2006-08-10 Die pickup apparatus, method for using the same and die pickup method TW200715435A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005295810A JP4616748B2 (ja) 2005-10-11 2005-10-11 ダイピックアップ装置

Publications (2)

Publication Number Publication Date
TW200715435A true TW200715435A (en) 2007-04-16
TWI345280B TWI345280B (zh) 2011-07-11

Family

ID=37911519

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129296A TW200715435A (en) 2005-10-11 2006-08-10 Die pickup apparatus, method for using the same and die pickup method

Country Status (4)

Country Link
US (1) US20070082529A1 (zh)
JP (1) JP4616748B2 (zh)
KR (1) KR100825274B1 (zh)
TW (1) TW200715435A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108346585A (zh) * 2017-01-25 2018-07-31 捷进科技有限公司 半导体制造装置及半导体器件的制造方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008141068A (ja) * 2006-12-04 2008-06-19 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2009064938A (ja) 2007-09-06 2009-03-26 Shinkawa Ltd 半導体ダイのピックアップ装置及びピックアップ方法
JP5075013B2 (ja) * 2008-05-27 2012-11-14 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP5227117B2 (ja) * 2008-08-29 2013-07-03 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及びピックアップ方法
JP5214421B2 (ja) * 2008-12-04 2013-06-19 キヤノンマシナリー株式会社 剥離装置及び剥離方法
JP5284144B2 (ja) * 2009-03-11 2013-09-11 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及びピックアップ方法
KR101344367B1 (ko) 2012-08-22 2013-12-24 주식회사 쎄크 다이 이젝팅 장치
JP5888455B1 (ja) 2015-04-01 2016-03-22 富士ゼロックス株式会社 半導体製造装置および半導体片の製造方法
TWI674168B (zh) * 2015-07-27 2019-10-11 美商應用材料股份有限公司 升降杆致動器、基板材支撐組件、及利用基板材支撐組件的方法
TWI641070B (zh) * 2018-01-09 2018-11-11 力成科技股份有限公司 晶片頂針裝置
KR102009922B1 (ko) * 2018-03-19 2019-08-12 세메스 주식회사 다이 이젝팅 장치
JP7217605B2 (ja) * 2018-09-21 2023-02-03 ファスフォードテクノロジ株式会社 半導体製造装置、突上げ治具および半導体装置の製造方法
KR102220339B1 (ko) * 2019-05-29 2021-02-25 세메스 주식회사 다이 이젝팅 장치
KR102220344B1 (ko) * 2019-09-06 2021-02-25 세메스 주식회사 다이 이젝터 및 이를 포함하는 다이 픽업 장치
KR102221707B1 (ko) * 2019-09-20 2021-03-02 세메스 주식회사 다이 이젝터 및 이를 포함하는 다이 픽업 장치
KR102244580B1 (ko) * 2019-11-08 2021-04-26 세메스 주식회사 다이 이젝터 및 이를 포함하는 다이 픽업 장치
KR102304258B1 (ko) * 2020-03-06 2021-09-23 세메스 주식회사 다이 이젝터 및 이를 포함하는 다이 픽업 장치
KR102635493B1 (ko) 2020-11-04 2024-02-07 세메스 주식회사 본딩 설비에서 다이를 이송하기 위한 장치 및 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4850780A (en) * 1987-09-28 1989-07-25 Kulicke And Soffa Industries Inc. Pre-peel die ejector apparatus
JPH0637169A (ja) * 1992-07-16 1994-02-10 Hitachi Ltd 半導体製造装置におけるペレット突き上げ機構
JP3817894B2 (ja) * 1998-04-06 2006-09-06 三菱電機株式会社 チップ突き上げ装置及びそれを用いたダイボンディング装置
TW451372B (en) * 1999-06-17 2001-08-21 Shinkawa Kk Die-holding mechanism, die-packing device and die-bonding device
US6616031B2 (en) * 2001-07-17 2003-09-09 Asm Assembly Automation Limited Apparatus and method for bond force control
JP3976541B2 (ja) * 2001-10-23 2007-09-19 富士通株式会社 半導体チップの剥離方法及び装置
ES2286208T3 (es) * 2001-11-07 2007-12-01 Hitachi Tool Engineering, Ltd. Herramienta revestida de una capa dura.
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108346585A (zh) * 2017-01-25 2018-07-31 捷进科技有限公司 半导体制造装置及半导体器件的制造方法
CN108346585B (zh) * 2017-01-25 2021-06-29 捷进科技有限公司 半导体制造装置及半导体器件的制造方法

Also Published As

Publication number Publication date
JP2007109680A (ja) 2007-04-26
TWI345280B (zh) 2011-07-11
JP4616748B2 (ja) 2011-01-19
US20070082529A1 (en) 2007-04-12
KR20070040293A (ko) 2007-04-16
KR100825274B1 (ko) 2008-04-25

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