TW200711858A - Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus - Google Patents

Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus

Info

Publication number
TW200711858A
TW200711858A TW095129939A TW95129939A TW200711858A TW 200711858 A TW200711858 A TW 200711858A TW 095129939 A TW095129939 A TW 095129939A TW 95129939 A TW95129939 A TW 95129939A TW 200711858 A TW200711858 A TW 200711858A
Authority
TW
Taiwan
Prior art keywords
device mounting
droplet ejection
liquid droplet
mounting structure
electronic apparatus
Prior art date
Application number
TW095129939A
Other languages
English (en)
Inventor
Tsuyoshi Yoda
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200711858A publication Critical patent/TW200711858A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW095129939A 2005-08-19 2006-08-15 Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus TW200711858A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005238337A JP4483738B2 (ja) 2005-08-19 2005-08-19 デバイス実装構造、デバイス実装方法、電子装置、液滴吐出ヘッド、及び液滴吐出装置

Publications (1)

Publication Number Publication Date
TW200711858A true TW200711858A (en) 2007-04-01

Family

ID=37736802

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129939A TW200711858A (en) 2005-08-19 2006-08-15 Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus

Country Status (4)

Country Link
US (1) US7390079B2 (zh)
JP (1) JP4483738B2 (zh)
CN (1) CN100579782C (zh)
TW (1) TW200711858A (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009255516A (ja) * 2008-03-18 2009-11-05 Seiko Epson Corp 液体噴射ヘッド及びその製造方法並びに液体噴射装置
JP5341688B2 (ja) * 2009-09-10 2013-11-13 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP5937778B2 (ja) * 2010-09-29 2016-06-22 株式会社小糸製作所 電子部品および電子部品の接続構造
JP6056328B2 (ja) * 2012-09-27 2017-01-11 セイコーエプソン株式会社 液滴吐出ヘッドおよび印刷装置
JP6056329B2 (ja) * 2012-09-27 2017-01-11 セイコーエプソン株式会社 液滴吐出ヘッド、印刷装置および液滴吐出ヘッドの製造方法
JP6163782B2 (ja) 2013-02-26 2017-07-19 セイコーエプソン株式会社 配線構造体、配線構造体の製造方法、液滴吐出ヘッドおよび液滴吐出装置
JP6160119B2 (ja) 2013-02-26 2017-07-12 セイコーエプソン株式会社 配線構造体、配線構造体の製造方法、液滴吐出ヘッドおよび液滴吐出装置
JP6123992B2 (ja) * 2013-03-05 2017-05-10 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子及びその製造方法
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
JP6168281B2 (ja) 2013-03-13 2017-07-26 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、液体噴射ヘッドの製造方法
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
CN105050814B (zh) 2013-03-26 2016-08-17 京瓷株式会社 液体喷出头以及使用了该液体喷出头的记录装置
CN203275842U (zh) * 2013-06-09 2013-11-06 合肥京东方光电科技有限公司 一种阵列基板及显示装置
JP6314519B2 (ja) 2014-02-10 2018-04-25 セイコーエプソン株式会社 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置
JP6354188B2 (ja) * 2014-02-10 2018-07-11 セイコーエプソン株式会社 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置
JP2016083861A (ja) * 2014-10-27 2016-05-19 セイコーエプソン株式会社 液体噴射ヘッドおよび液体噴射装置
CN104934438A (zh) * 2015-04-24 2015-09-23 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
USD864968S1 (en) * 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
JP6711048B2 (ja) * 2016-03-17 2020-06-17 セイコーエプソン株式会社 圧電デバイス、液体噴射ヘッド及び液体噴射装置
JP6711047B2 (ja) * 2016-03-17 2020-06-17 セイコーエプソン株式会社 圧電デバイス、液体噴射ヘッド及び液体噴射装置
JP6269794B2 (ja) * 2016-12-06 2018-01-31 セイコーエプソン株式会社 液滴吐出ヘッド、印刷装置および液滴吐出ヘッドの製造方法
JP7037334B2 (ja) * 2017-02-17 2022-03-16 キヤノン株式会社 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置
US11849545B2 (en) * 2018-10-16 2023-12-19 Fuji Corporation Circuit formation method
CN111016434B (zh) * 2019-12-25 2021-07-27 西安交通大学 一种基于挤压模式的薄膜式喷墨打印头
US11372177B2 (en) * 2020-04-21 2022-06-28 Ii-Vi Delaware, Inc. Pluggable transceiver retainer
TWI741581B (zh) 2020-04-30 2021-10-01 研能科技股份有限公司 微流體致動器之異質整合晶片
CN113594148B (zh) * 2020-04-30 2024-05-10 研能科技股份有限公司 微流体致动器的异质整合芯片

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000127404A (ja) 1998-10-27 2000-05-09 Canon Inc インクジェット記録ヘッド
US6497477B1 (en) * 1998-11-04 2002-12-24 Matsushita Electric Industrial Co., Ltd. Ink-jet head mounted with a driver IC, method for manufacturing thereof and ink-jet printer having the same
EP1322476A1 (en) * 2000-09-26 2003-07-02 Xaar Technology Limited Droplet deposition apparatus
JP2002103614A (ja) 2000-10-03 2002-04-09 Konica Corp インクジェットヘッド
JP2003025593A (ja) 2001-07-17 2003-01-29 Sharp Corp インクジェットヘッドの電極接続構造及びその電極接続方法とインクジェットヘッドの製造方法
JP2003159800A (ja) 2001-09-13 2003-06-03 Seiko Epson Corp 液体噴射ヘッド及び液体噴射装置
KR100438836B1 (ko) * 2001-12-18 2004-07-05 삼성전자주식회사 압전 방식의 잉크젯 프린트 헤드 및 그 제조방법
US6796640B2 (en) * 2001-12-20 2004-09-28 Seiko Epson Corporation Liquid-jet head and liquid-jet apparatus
US7121651B2 (en) * 2002-05-09 2006-10-17 Brother Kogyo Kabushiki Kaisha Droplet-jetting device with pressure chamber expandable by elongation of pressure-generating section
GB0229655D0 (en) * 2002-12-20 2003-01-22 Xaar Technology Ltd Droplet deposition apparatus
JP2004284176A (ja) 2003-03-20 2004-10-14 Seiko Epson Corp 液体噴射ヘッドの製造方法
JP2006044225A (ja) * 2004-06-29 2006-02-16 Fuji Xerox Co Ltd 液滴吐出ヘッド及び液滴吐出装置
JP4661120B2 (ja) * 2004-07-29 2011-03-30 ブラザー工業株式会社 インクジェットヘッドの製造方法

Also Published As

Publication number Publication date
JP4483738B2 (ja) 2010-06-16
US20070042613A1 (en) 2007-02-22
JP2007050638A (ja) 2007-03-01
CN1915668A (zh) 2007-02-21
US7390079B2 (en) 2008-06-24
CN100579782C (zh) 2010-01-13

Similar Documents

Publication Publication Date Title
TW200711858A (en) Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus
CN202231957U (zh) 带有射频屏蔽盒的装置和电子设备
TW200731494A (en) Circuit component, manufacturing method of circuit component, semiconductor device and multilayer structure on surface of circuit component
CN102123561B (zh) 用于电子设备的电子子组件
TW200741914A (en) Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
TW200731900A (en) Method for producing a circuit substrate and a circuit board and a method for producing the same
WO2009075160A1 (ja) 電気部品の実装方法及び実装装置
TW200635461A (en) Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment
TW200706076A (en) Printed wiring board
CN101727576A (zh) 接触式传感器单元及其制造方法和电子设备
WO2007122516A3 (en) Apparatus and method for use in mounting electronic elements
TW200704326A (en) Multilayer wiring structure and method of manufacturing the same
ATE313434T1 (de) Tintenpatrone und bildaufzeichnungsvorrichtung
TW200620502A (en) Semiconductor device, circuit board, electro-optic device, electronic device
WO2009044863A1 (ja) モジュール、配線板、及びモジュールの製造方法
EP1848036A3 (en) Power module
SG153797A1 (en) Circuit board
TW200628878A (en) Display apparatus
WO2008008581A3 (en) An electronics package with an integrated circuit device having post wafer fabrication integrated passive components
EP1978792A4 (en) SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE
WO2009075159A1 (ja) 電気部品の実装方法及び実装装置
WO2005089166A3 (en) Ink jet printer with extend nozzle plate and method
TWI266391B (en) Electronic circuit device
CN105260707A (zh) 一种指纹传感器模组及电子设备
WO2006012397A3 (en) Information display on a vehicle