TW200711858A - Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus - Google Patents
Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatusInfo
- Publication number
- TW200711858A TW200711858A TW095129939A TW95129939A TW200711858A TW 200711858 A TW200711858 A TW 200711858A TW 095129939 A TW095129939 A TW 095129939A TW 95129939 A TW95129939 A TW 95129939A TW 200711858 A TW200711858 A TW 200711858A
- Authority
- TW
- Taiwan
- Prior art keywords
- device mounting
- droplet ejection
- liquid droplet
- mounting structure
- electronic apparatus
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 1
- 239000013528 metallic particle Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005238337A JP4483738B2 (ja) | 2005-08-19 | 2005-08-19 | デバイス実装構造、デバイス実装方法、電子装置、液滴吐出ヘッド、及び液滴吐出装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200711858A true TW200711858A (en) | 2007-04-01 |
Family
ID=37736802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095129939A TW200711858A (en) | 2005-08-19 | 2006-08-15 | Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US7390079B2 (zh) |
JP (1) | JP4483738B2 (zh) |
CN (1) | CN100579782C (zh) |
TW (1) | TW200711858A (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009255516A (ja) * | 2008-03-18 | 2009-11-05 | Seiko Epson Corp | 液体噴射ヘッド及びその製造方法並びに液体噴射装置 |
JP5341688B2 (ja) * | 2009-09-10 | 2013-11-13 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
JP5937778B2 (ja) * | 2010-09-29 | 2016-06-22 | 株式会社小糸製作所 | 電子部品および電子部品の接続構造 |
JP6056328B2 (ja) * | 2012-09-27 | 2017-01-11 | セイコーエプソン株式会社 | 液滴吐出ヘッドおよび印刷装置 |
JP6056329B2 (ja) * | 2012-09-27 | 2017-01-11 | セイコーエプソン株式会社 | 液滴吐出ヘッド、印刷装置および液滴吐出ヘッドの製造方法 |
JP6163782B2 (ja) | 2013-02-26 | 2017-07-19 | セイコーエプソン株式会社 | 配線構造体、配線構造体の製造方法、液滴吐出ヘッドおよび液滴吐出装置 |
JP6160119B2 (ja) | 2013-02-26 | 2017-07-12 | セイコーエプソン株式会社 | 配線構造体、配線構造体の製造方法、液滴吐出ヘッドおよび液滴吐出装置 |
JP6123992B2 (ja) * | 2013-03-05 | 2017-05-10 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置、圧電素子及びその製造方法 |
USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
JP6168281B2 (ja) | 2013-03-13 | 2017-07-26 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置、液体噴射ヘッドの製造方法 |
USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
CN105050814B (zh) | 2013-03-26 | 2016-08-17 | 京瓷株式会社 | 液体喷出头以及使用了该液体喷出头的记录装置 |
CN203275842U (zh) * | 2013-06-09 | 2013-11-06 | 合肥京东方光电科技有限公司 | 一种阵列基板及显示装置 |
JP6314519B2 (ja) | 2014-02-10 | 2018-04-25 | セイコーエプソン株式会社 | 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置 |
JP6354188B2 (ja) * | 2014-02-10 | 2018-07-11 | セイコーエプソン株式会社 | 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置 |
JP2016083861A (ja) * | 2014-10-27 | 2016-05-19 | セイコーエプソン株式会社 | 液体噴射ヘッドおよび液体噴射装置 |
CN104934438A (zh) * | 2015-04-24 | 2015-09-23 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
USD864968S1 (en) * | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
JP6711048B2 (ja) * | 2016-03-17 | 2020-06-17 | セイコーエプソン株式会社 | 圧電デバイス、液体噴射ヘッド及び液体噴射装置 |
JP6711047B2 (ja) * | 2016-03-17 | 2020-06-17 | セイコーエプソン株式会社 | 圧電デバイス、液体噴射ヘッド及び液体噴射装置 |
JP6269794B2 (ja) * | 2016-12-06 | 2018-01-31 | セイコーエプソン株式会社 | 液滴吐出ヘッド、印刷装置および液滴吐出ヘッドの製造方法 |
JP7037334B2 (ja) * | 2017-02-17 | 2022-03-16 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
US11849545B2 (en) * | 2018-10-16 | 2023-12-19 | Fuji Corporation | Circuit formation method |
CN111016434B (zh) * | 2019-12-25 | 2021-07-27 | 西安交通大学 | 一种基于挤压模式的薄膜式喷墨打印头 |
US11372177B2 (en) * | 2020-04-21 | 2022-06-28 | Ii-Vi Delaware, Inc. | Pluggable transceiver retainer |
TWI741581B (zh) | 2020-04-30 | 2021-10-01 | 研能科技股份有限公司 | 微流體致動器之異質整合晶片 |
CN113594148B (zh) * | 2020-04-30 | 2024-05-10 | 研能科技股份有限公司 | 微流体致动器的异质整合芯片 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000127404A (ja) | 1998-10-27 | 2000-05-09 | Canon Inc | インクジェット記録ヘッド |
US6497477B1 (en) * | 1998-11-04 | 2002-12-24 | Matsushita Electric Industrial Co., Ltd. | Ink-jet head mounted with a driver IC, method for manufacturing thereof and ink-jet printer having the same |
EP1322476A1 (en) * | 2000-09-26 | 2003-07-02 | Xaar Technology Limited | Droplet deposition apparatus |
JP2002103614A (ja) | 2000-10-03 | 2002-04-09 | Konica Corp | インクジェットヘッド |
JP2003025593A (ja) | 2001-07-17 | 2003-01-29 | Sharp Corp | インクジェットヘッドの電極接続構造及びその電極接続方法とインクジェットヘッドの製造方法 |
JP2003159800A (ja) | 2001-09-13 | 2003-06-03 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
KR100438836B1 (ko) * | 2001-12-18 | 2004-07-05 | 삼성전자주식회사 | 압전 방식의 잉크젯 프린트 헤드 및 그 제조방법 |
US6796640B2 (en) * | 2001-12-20 | 2004-09-28 | Seiko Epson Corporation | Liquid-jet head and liquid-jet apparatus |
US7121651B2 (en) * | 2002-05-09 | 2006-10-17 | Brother Kogyo Kabushiki Kaisha | Droplet-jetting device with pressure chamber expandable by elongation of pressure-generating section |
GB0229655D0 (en) * | 2002-12-20 | 2003-01-22 | Xaar Technology Ltd | Droplet deposition apparatus |
JP2004284176A (ja) | 2003-03-20 | 2004-10-14 | Seiko Epson Corp | 液体噴射ヘッドの製造方法 |
JP2006044225A (ja) * | 2004-06-29 | 2006-02-16 | Fuji Xerox Co Ltd | 液滴吐出ヘッド及び液滴吐出装置 |
JP4661120B2 (ja) * | 2004-07-29 | 2011-03-30 | ブラザー工業株式会社 | インクジェットヘッドの製造方法 |
-
2005
- 2005-08-19 JP JP2005238337A patent/JP4483738B2/ja not_active Expired - Fee Related
-
2006
- 2006-08-11 US US11/502,962 patent/US7390079B2/en not_active Expired - Fee Related
- 2006-08-15 TW TW095129939A patent/TW200711858A/zh unknown
- 2006-08-16 CN CN200610114888A patent/CN100579782C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP4483738B2 (ja) | 2010-06-16 |
US20070042613A1 (en) | 2007-02-22 |
JP2007050638A (ja) | 2007-03-01 |
CN1915668A (zh) | 2007-02-21 |
US7390079B2 (en) | 2008-06-24 |
CN100579782C (zh) | 2010-01-13 |
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