TW200711006A - Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device - Google Patents

Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device

Info

Publication number
TW200711006A
TW200711006A TW095111955A TW95111955A TW200711006A TW 200711006 A TW200711006 A TW 200711006A TW 095111955 A TW095111955 A TW 095111955A TW 95111955 A TW95111955 A TW 95111955A TW 200711006 A TW200711006 A TW 200711006A
Authority
TW
Taiwan
Prior art keywords
semiconductor device
device manufacturing
manufacturing apparatus
information
drawing pattern
Prior art date
Application number
TW095111955A
Other languages
English (en)
Other versions
TWI303088B (en
Inventor
Kazuhiro Shimizu
Hajime Akiyama
Naoki Yasuda
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW200711006A publication Critical patent/TW200711006A/zh
Application granted granted Critical
Publication of TWI303088B publication Critical patent/TWI303088B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW095111955A 2005-08-26 2006-04-04 Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device TWI303088B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005245832A JP4914589B2 (ja) 2005-08-26 2005-08-26 半導体製造装置、半導体製造方法および半導体装置

Publications (2)

Publication Number Publication Date
TW200711006A true TW200711006A (en) 2007-03-16
TWI303088B TWI303088B (en) 2008-11-11

Family

ID=37715688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111955A TWI303088B (en) 2005-08-26 2006-04-04 Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device

Country Status (6)

Country Link
US (4) US7481885B2 (zh)
JP (1) JP4914589B2 (zh)
KR (1) KR100778353B1 (zh)
CN (2) CN101826508A (zh)
DE (3) DE102006032730B4 (zh)
TW (1) TWI303088B (zh)

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CN103377954B (zh) * 2012-04-28 2016-12-14 无锡华润上华科技有限公司 栅极焊盘和源极焊盘的形成方法
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CN103886113A (zh) * 2014-04-04 2014-06-25 东莞铭丰集团有限公司 晶片盒内晶片的数据的采集与处理的方法及装置
CN104977518B (zh) * 2014-04-09 2018-05-01 中芯国际集成电路制造(上海)有限公司 一种晶圆出货检验方法
JP6428564B2 (ja) 2015-10-28 2018-11-28 株式会社ダイフク 搬送台車
DE102017103310A1 (de) * 2016-02-19 2017-08-24 Infineon Technologies Ag Substrat einer elektronischen vorrichtung und verfahren zum herstellen desselben
US10269635B2 (en) 2016-02-19 2019-04-23 Infineon Technologies Ag Integrated circuit substrate and method for manufacturing the same
US9786568B2 (en) 2016-02-19 2017-10-10 Infineon Technologies Ag Method of manufacturing an integrated circuit substrate
CN107799432B (zh) * 2016-09-06 2020-05-05 中芯国际集成电路制造(上海)有限公司 管芯分拣装置
US10580753B2 (en) 2017-07-21 2020-03-03 Infineon Technologies Ag Method for manufacturing semiconductor devices
CN110376504B (zh) * 2019-06-27 2022-06-17 瑞芯微电子股份有限公司 一种关于ic高压损伤模拟系统及方法
CN111632794B (zh) * 2020-05-12 2021-02-19 杭州沃镭智能科技股份有限公司 一种igbt模块导热硅脂涂覆装置及其使用方法
TWI786459B (zh) * 2020-11-03 2022-12-11 研能科技股份有限公司 晶圓結構
CN115295476B (zh) * 2022-10-08 2023-01-10 四川洪芯微科技有限公司 一种芯片脱膜装置

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Also Published As

Publication number Publication date
CN1921071A (zh) 2007-02-28
DE102006032730B4 (de) 2017-06-29
JP4914589B2 (ja) 2012-04-11
JP2007059785A (ja) 2007-03-08
KR20070024349A (ko) 2007-03-02
US7481885B2 (en) 2009-01-27
TWI303088B (en) 2008-11-11
DE102006062913B4 (de) 2017-04-06
CN1921071B (zh) 2010-05-12
US20130056791A1 (en) 2013-03-07
US7977787B2 (en) 2011-07-12
CN101826508A (zh) 2010-09-08
US20110254049A1 (en) 2011-10-20
DE102006062990B3 (de) 2018-10-11
US20090096091A1 (en) 2009-04-16
DE102006032730A1 (de) 2007-03-01
US20070072394A1 (en) 2007-03-29
US8324657B2 (en) 2012-12-04
US8609443B2 (en) 2013-12-17
KR100778353B1 (ko) 2007-11-22

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees