TW200710932A - Baseplate processing equipment, heating device used on the baseplate processing equipment and method for manufacturing semiconductors therewith - Google Patents

Baseplate processing equipment, heating device used on the baseplate processing equipment and method for manufacturing semiconductors therewith

Info

Publication number
TW200710932A
TW200710932A TW095131065A TW95131065A TW200710932A TW 200710932 A TW200710932 A TW 200710932A TW 095131065 A TW095131065 A TW 095131065A TW 95131065 A TW95131065 A TW 95131065A TW 200710932 A TW200710932 A TW 200710932A
Authority
TW
Taiwan
Prior art keywords
processing equipment
baseplate
heating element
heating device
therewith
Prior art date
Application number
TW095131065A
Other languages
English (en)
Other versions
TWI315080B (en
Inventor
Toshimitsu Miyata
Akira Hayashida
Masakazu Shimada
Kimio Kitamura
Kenji Tanaka
Original Assignee
Hitachi Int Electric Inc
Teitokusha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Int Electric Inc, Teitokusha Co Ltd filed Critical Hitachi Int Electric Inc
Publication of TW200710932A publication Critical patent/TW200710932A/zh
Application granted granted Critical
Publication of TWI315080B publication Critical patent/TWI315080B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/62—Heating elements specially adapted for furnaces
    • H05B3/64—Heating elements specially adapted for furnaces using ribbon, rod, or wire heater

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW095131065A 2005-08-24 2006-08-23 Baseplate processing equipment, heating device used on the baseplate processing equipment and method for manufacturing semiconductors with those apparatus, and heating element supporting structure TWI315080B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005243175 2005-08-24

Publications (2)

Publication Number Publication Date
TW200710932A true TW200710932A (en) 2007-03-16
TWI315080B TWI315080B (en) 2009-09-21

Family

ID=37771598

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131065A TWI315080B (en) 2005-08-24 2006-08-23 Baseplate processing equipment, heating device used on the baseplate processing equipment and method for manufacturing semiconductors with those apparatus, and heating element supporting structure

Country Status (5)

Country Link
US (1) US7863204B2 (zh)
JP (1) JP5049128B2 (zh)
KR (1) KR100933765B1 (zh)
TW (1) TWI315080B (zh)
WO (1) WO2007023855A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI611529B (zh) * 2015-12-28 2018-01-11 尤金科技有限公司 基板處理裝置

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4445519B2 (ja) 2007-06-01 2010-04-07 東京エレクトロン株式会社 熱処理炉及びその製造方法
KR101001331B1 (ko) 2007-06-25 2010-12-14 데이또꾸샤 가부시키가이샤 가열 장치, 기판처리장치 및 반도체장치의 제조 방법
KR100969696B1 (ko) 2007-06-25 2010-07-14 가부시키가이샤 히다치 고쿠사이 덴키 가열 장치, 이것을 이용한 기판 처리 장치 및 반도체장치의 제조 방법 및 관통 부재
KR101012082B1 (ko) 2007-06-25 2011-02-07 데이또꾸샤 가부시키가이샤 가열 장치 및 이것을 채용한 기판 처리 장치 및 반도체장치의 제조 방법 및 절연체
JP5364314B2 (ja) * 2008-08-28 2013-12-11 東京応化工業株式会社 熱処理装置
JP5463031B2 (ja) * 2008-12-26 2014-04-09 貞徳舎株式会社 ヒーターユニット及び発熱体の製造方法
JP5544121B2 (ja) * 2009-07-21 2014-07-09 株式会社日立国際電気 加熱装置、基板処理装置、及び半導体装置の製造方法
JP5525248B2 (ja) * 2009-12-03 2014-06-18 貞徳舎株式会社 電気ヒーター及び電気ヒーターの製造方法並びに加熱装置
JP5580689B2 (ja) * 2010-08-09 2014-08-27 富士インパルス株式会社 発熱体及びフィルムシール装置
JP5565188B2 (ja) * 2010-08-10 2014-08-06 東京エレクトロン株式会社 ヒータ装置
US20140117005A1 (en) * 2010-10-27 2014-05-01 Tangteck Equipment Inc. Diffusion furnace
US20130153201A1 (en) * 2010-12-30 2013-06-20 Poole Ventura, Inc. Thermal diffusion chamber with cooling tubes
US20120168143A1 (en) * 2010-12-30 2012-07-05 Poole Ventura, Inc. Thermal Diffusion Chamber With Heat Exchanger
JP5770042B2 (ja) * 2011-08-04 2015-08-26 東京エレクトロン株式会社 熱処理装置
US10204806B2 (en) * 2011-09-06 2019-02-12 Arsalan Emami Modular heater
JP2014082014A (ja) * 2012-10-12 2014-05-08 Tokyo Electron Ltd ヒータ装置及び熱処理装置
JP2015028924A (ja) * 2013-06-27 2015-02-12 貞徳舎株式会社 電気ヒーター及びこれを備えた加熱装置
CN104253064A (zh) * 2013-06-28 2014-12-31 上海华虹宏力半导体制造有限公司 一种半导体熔炉加热器固定装置
US9702627B2 (en) * 2014-05-16 2017-07-11 William R. Jones High temperature vacuum furnace heater element support assembly
US10375901B2 (en) 2014-12-09 2019-08-13 Mtd Products Inc Blower/vacuum
KR101684929B1 (ko) * 2015-02-03 2016-12-21 국제엘렉트릭코리아 주식회사 발열체 및 히터 어셈블리 그리고 그것을 갖는 클러스터 설비
WO2017156503A1 (en) 2016-03-10 2017-09-14 Arsalan Emami Improved industrial heater
JP6158400B2 (ja) * 2016-06-15 2017-07-05 貞徳舎株式会社 電気ヒーター及び電気ヒーターの製造方法並びにこれを備えた加熱装置
CN108950502B (zh) * 2018-07-23 2022-12-13 张家港康得新光电材料有限公司 一种面板成膜设备

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Publication number Priority date Publication date Assignee Title
US5506389A (en) * 1993-11-10 1996-04-09 Tokyo Electron Kabushiki Kaisha Thermal processing furnace and fabrication method thereof
US6005225A (en) * 1997-03-28 1999-12-21 Silicon Valley Group, Inc. Thermal processing apparatus
JP3848442B2 (ja) 1997-08-20 2006-11-22 株式会社日立国際電気 ヒータ支持装置及び半導体製造装置及び半導体装置の製造方法
JPH11297627A (ja) * 1998-04-06 1999-10-29 Kokusai Electric Co Ltd 熱処理炉のヒータ構造
US6228174B1 (en) * 1999-03-26 2001-05-08 Ichiro Takahashi Heat treatment system using ring-shaped radiation heater elements
MXPA01008255A (es) * 1999-12-16 2002-04-24 Asahi Glass Co Ltd Estructura de soporte para calentador y horno de calentamiento para doblar una lamina de vidrio.
JP3484387B2 (ja) * 2000-01-13 2004-01-06 株式会社第一機電 電気炉
JP3404674B2 (ja) * 2000-01-21 2003-05-12 株式会社真空技研 超高温熱処理装置
JP4539895B2 (ja) * 2000-04-27 2010-09-08 日鉱金属株式会社 ＭｏＳｉ２を主成分とするヒーターの取付け方法
JP4646592B2 (ja) * 2003-10-21 2011-03-09 貞徳舎株式会社 電気ヒーター及びこれを備えた炉

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI611529B (zh) * 2015-12-28 2018-01-11 尤金科技有限公司 基板處理裝置
US10364494B2 (en) 2015-12-28 2019-07-30 Eugene Technology Co., Ltd. Substrate processing apparatus

Also Published As

Publication number Publication date
KR100933765B1 (ko) 2009-12-24
WO2007023855A1 (ja) 2007-03-01
TWI315080B (en) 2009-09-21
US7863204B2 (en) 2011-01-04
KR20080005980A (ko) 2008-01-15
JPWO2007023855A1 (ja) 2009-02-26
US20090035948A1 (en) 2009-02-05
JP5049128B2 (ja) 2012-10-17

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