TW200710411A - Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing - Google Patents

Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing

Info

Publication number
TW200710411A
TW200710411A TW095122992A TW95122992A TW200710411A TW 200710411 A TW200710411 A TW 200710411A TW 095122992 A TW095122992 A TW 095122992A TW 95122992 A TW95122992 A TW 95122992A TW 200710411 A TW200710411 A TW 200710411A
Authority
TW
Taiwan
Prior art keywords
testing
contact
under test
unit under
production
Prior art date
Application number
TW095122992A
Other languages
English (en)
Other versions
TWI302204B (en
Inventor
Gunther Boehm
Original Assignee
Feinmetall Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE200510030496 external-priority patent/DE102005030496B4/de
Priority claimed from DE102006028141A external-priority patent/DE102006028141A1/de
Application filed by Feinmetall Gmbh filed Critical Feinmetall Gmbh
Publication of TW200710411A publication Critical patent/TW200710411A/zh
Application granted granted Critical
Publication of TWI302204B publication Critical patent/TWI302204B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Connecting Device With Holders (AREA)
TW095122992A 2005-06-30 2006-06-26 Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing TWI302204B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510030496 DE102005030496B4 (de) 2005-06-30 2005-06-30 Kontaktiervorrichtung und Verfahren
DE102006028141A DE102006028141A1 (de) 2005-06-30 2006-06-16 Verfahren und Vorrichtung zum elektrischen Prüfen eines Prüflings sowie Verfahren zur Herstellung einer beim Prüfen eingesetzten Kontaktiervorrichtung

Publications (2)

Publication Number Publication Date
TW200710411A true TW200710411A (en) 2007-03-16
TWI302204B TWI302204B (en) 2008-10-21

Family

ID=37588678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122992A TWI302204B (en) 2005-06-30 2006-06-26 Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing

Country Status (4)

Country Link
US (1) US7977957B2 (zh)
EP (1) EP1739440A3 (zh)
JP (1) JP2007010671A (zh)
TW (1) TWI302204B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113108704A (zh) * 2021-04-12 2021-07-13 渭南高新区木王科技有限公司 一种测试探针用外径检测装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6043246B2 (ja) * 2013-07-11 2016-12-14 株式会社アドバンテスト デバイスインターフェイス装置、試験装置、および試験方法
DE102015206000A1 (de) * 2014-04-04 2015-10-08 Feinmetall Gmbh Kontakt-Abstandstransformer, elektrische Prüfeinrichtung sowie Verfahren zur Herstellung eines Kontakt-Abstandstransformers
WO2018063251A1 (en) * 2016-09-29 2018-04-05 Cummins Inc. Systems and methods for accommodating loss of battery charge history
KR102600623B1 (ko) 2017-02-08 2023-11-08 삼성전자주식회사 프로브 카드 어셈블리
JP2019102640A (ja) * 2017-12-01 2019-06-24 東京エレクトロン株式会社 プローブ針の針先位置調整方法および検査装置
JP7227067B2 (ja) * 2019-05-08 2023-02-21 株式会社日本マイクロニクス 検査用接続装置

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US3990689A (en) * 1975-08-11 1976-11-09 Eklund Sr Ralph H Adjustable holder assembly for positioning a vacuum chuck
US4929893A (en) * 1987-10-06 1990-05-29 Canon Kabushiki Kaisha Wafer prober
JPH04364054A (ja) * 1991-06-11 1992-12-16 Toshiba Corp 検査装置およびその方法
JP3219844B2 (ja) * 1992-06-01 2001-10-15 東京エレクトロン株式会社 プローブ装置
JPH06151532A (ja) * 1992-11-13 1994-05-31 Tokyo Electron Yamanashi Kk プローブ装置
JPH0792479B2 (ja) * 1993-03-18 1995-10-09 東京エレクトロン株式会社 プローブ装置の平行度調整方法
JP2963603B2 (ja) * 1993-05-31 1999-10-18 東京エレクトロン株式会社 プローブ装置のアライメント方法
US5550482A (en) * 1993-07-20 1996-08-27 Tokyo Electron Kabushiki Kaisha Probe device
KR0138618B1 (ko) * 1993-08-04 1998-06-15 이노우에 아끼라 프로브카드, 프로브카드용 동축 프로브빔 및 그 제조방법
JPH11154694A (ja) * 1997-11-21 1999-06-08 Matsushita Electric Ind Co Ltd ウェハ一括型測定検査用アライメント方法およびプローブカードの製造方法
FR2772921B1 (fr) * 1997-12-24 2000-01-28 Sgs Thomson Microelectronics Carte a pointes pour le test de composants semi-conducteurs
US6078186A (en) * 1997-12-31 2000-06-20 Micron Technology, Inc. Force applying probe card and test system for semiconductor wafers
JP4405607B2 (ja) * 1998-09-04 2010-01-27 キヤノン株式会社 スキャニングプローブ、走査装置、露光装置、および近接場顕微鏡
JP2000164655A (ja) * 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd アライメント装置及びアライメント方法
US6429671B1 (en) 1998-11-25 2002-08-06 Advanced Micro Devices, Inc. Electrical test probe card having a removable probe head assembly with alignment features and a method for aligning the probe head assembly to the probe card
JP2001330626A (ja) * 2000-05-22 2001-11-30 Micronics Japan Co Ltd プローブカード及びこれにアライメントマークを形成する方法
JP4455733B2 (ja) * 2000-05-30 2010-04-21 株式会社日本マイクロニクス プローブシート及びこれを用いたプローブ装置
JP4134503B2 (ja) * 2000-10-11 2008-08-20 松下電器産業株式会社 回路形成基板の製造方法
JP4109028B2 (ja) * 2002-07-15 2008-06-25 山一電機株式会社 プローブユニット及びその製造方法
US6871307B2 (en) * 2001-10-10 2005-03-22 Tower Semiconductorltd. Efficient test structure for non-volatile memory and other semiconductor integrated circuits
JP2003149296A (ja) * 2001-11-15 2003-05-21 Everett Charles Japan Ltd プリント基板の検査治具
JP2003149299A (ja) * 2001-11-16 2003-05-21 Oht Inc 位置決め装置及び位置決め方法
DE10220343B4 (de) * 2002-05-07 2007-04-05 Atg Test Systems Gmbh & Co. Kg Reicholzheim Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde
JP3639828B2 (ja) * 2002-10-30 2005-04-20 東芝テリー株式会社 Ｌｃｄ検査プローブの位置合わせ方法及び装置
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
JP4187718B2 (ja) * 2004-12-20 2008-11-26 松下電器産業株式会社 プローブカード

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113108704A (zh) * 2021-04-12 2021-07-13 渭南高新区木王科技有限公司 一种测试探针用外径检测装置

Also Published As

Publication number Publication date
EP1739440A2 (de) 2007-01-03
EP1739440A3 (de) 2009-05-13
US7977957B2 (en) 2011-07-12
US20070001707A1 (en) 2007-01-04
TWI302204B (en) 2008-10-21
JP2007010671A (ja) 2007-01-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees