TW200723415A - TCP handling apparatus - Google Patents

TCP handling apparatus

Info

Publication number
TW200723415A
TW200723415A TW095130793A TW95130793A TW200723415A TW 200723415 A TW200723415 A TW 200723415A TW 095130793 A TW095130793 A TW 095130793A TW 95130793 A TW95130793 A TW 95130793A TW 200723415 A TW200723415 A TW 200723415A
Authority
TW
Taiwan
Prior art keywords
handling apparatus
tcp handling
retest
tcps
faulty
Prior art date
Application number
TW095130793A
Other languages
Chinese (zh)
Other versions
TWI321818B (en
Inventor
Takeshi Onishi
Hisashi Murano
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200723415A publication Critical patent/TW200723415A/en
Application granted granted Critical
Publication of TWI321818B publication Critical patent/TWI321818B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A TCP handling apparatus (2) wherein when TCPs determined to be faulty in a first test are brought into contact, for use in a retest, with a probe (81) different from a probe (81) which was brought into contact with an external terminal when it was determined to be faulty, acceptable products can be picked up by the retest, the yielding of the TCPs can be increased, and the retest can be automatically performed without stopping the TCP handling apparatus (2). As a result, the throughput of the test can be increased.
TW095130793A 2005-08-25 2006-08-22 TCP handling apparatus TW200723415A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/015479 WO2007023556A1 (en) 2005-08-25 2005-08-25 Tcp handling apparatus

Publications (2)

Publication Number Publication Date
TW200723415A true TW200723415A (en) 2007-06-16
TWI321818B TWI321818B (en) 2010-03-11

Family

ID=37771314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130793A TW200723415A (en) 2005-08-25 2006-08-22 TCP handling apparatus

Country Status (3)

Country Link
JP (1) JP4829889B2 (en)
TW (1) TW200723415A (en)
WO (1) WO2007023556A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG146468A1 (en) * 2007-03-16 2008-10-30 Teradyne Asia Pte Ltd A material handler for devices on a reel
US8059547B2 (en) * 2008-12-08 2011-11-15 Advantest Corporation Test apparatus and test method
US8666691B2 (en) 2008-12-08 2014-03-04 Advantest Corporation Test apparatus and test method
JP5323621B2 (en) * 2009-09-09 2013-10-23 日置電機株式会社 Contact probe probing method and probing apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2512032B2 (en) * 1987-11-10 1996-07-03 東京エレクトロン株式会社 Inspection methods
JPH0262971A (en) * 1988-08-29 1990-03-02 Teru Tohoku Kk Method for inspecting tape carrier
JP3191790B2 (en) * 1999-01-08 2001-07-23 日本電気株式会社 Handler with search function
JP2001099891A (en) * 1999-09-28 2001-04-13 Ando Electric Co Ltd Autohandler for tab and processing method thereof
JP2004271428A (en) * 2003-03-11 2004-09-30 Matsushita Electric Ind Co Ltd Test system for multi chip module, and manufacturing method therefor
DE60318124T2 (en) * 2003-06-04 2008-12-04 Advantest Corp. DEVICE FOR HANDLING ELECTRONIC COMPONENTS AND METHOD FOR TEMPERATURE APPLICATION IN A HANDLING DEVICE FOR ELECTRONIC COMPONENTS

Also Published As

Publication number Publication date
WO2007023556A1 (en) 2007-03-01
JP4829889B2 (en) 2011-12-07
TWI321818B (en) 2010-03-11
JPWO2007023556A1 (en) 2009-02-26

Similar Documents

Publication Publication Date Title
TW200735246A (en) Test handler and operation method thereof
WO2009102502A3 (en) Apparatus and method for batch non-contact material characterization
WO2014049371A3 (en) Test device and sample carrier
MY149779A (en) Processing storage devices
EP1732120A4 (en) Probe apparatus, wafer inspecting apparatus provided with the probe apparatus and wafer inspecting method
WO2007103591A3 (en) Method and apparatus for testing a data processing system
MY169817A (en) General purpose protocol engine
TW200732671A (en) Probe card transfer assist apparatus and inspection equipment using the same
TW200734665A (en) Electronic component testing apparatus and electronic component testing method
MX2016005435A (en) Device for cleaning a stylus of a measuring probe.
PL2097175T3 (en) Test method and test device for functional testing of a painting device
TW200706874A (en) Test apparatus capable of accurately connecting a test object to a substrate
EP2520937A3 (en) Sample processing apparatus
WO2007090672A3 (en) Method and device for the fully automatic final inspection of components and/or their functional units
WO2011032012A3 (en) Electrical terminal test point and methods of use
MY180937A (en) Apparatus for object processing
MY163406A (en) Device and method for drying separated electronic components
TW200633313A (en) Probe member for wafer inspection, probe card for wafer inspection and wafer inspection equipment
TW200723415A (en) TCP handling apparatus
TW200631070A (en) Method of inspecting substrate processing apparatus, and storage medium storing inspection program for executing the method
WO2008139579A1 (en) Electronic part testing apparatus, electronic part testing system and method of testing electronic part
EP1684446A3 (en) A method and apparatus for testing optical network equipment
TW363131B (en) Test device, test assembly, method for testing and method for calibrating a test device
TWI346212B (en) Electrical test apparatus for the testing of an electrical test specimen and corresponding method
WO2008033971A3 (en) Device test and debug using power and ground terminals

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees