TW200709459A - Photo diode, solid imaging device, and their fabrication method - Google Patents

Photo diode, solid imaging device, and their fabrication method

Info

Publication number
TW200709459A
TW200709459A TW094129859A TW94129859A TW200709459A TW 200709459 A TW200709459 A TW 200709459A TW 094129859 A TW094129859 A TW 094129859A TW 94129859 A TW94129859 A TW 94129859A TW 200709459 A TW200709459 A TW 200709459A
Authority
TW
Taiwan
Prior art keywords
region
silicon substrate
photo diode
conduction type
imaging device
Prior art date
Application number
TW094129859A
Other languages
English (en)
Other versions
TWI270216B (en
Inventor
Masaya Katayama
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TWI270216B publication Critical patent/TWI270216B/zh
Publication of TW200709459A publication Critical patent/TW200709459A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier
    • H01L31/103—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PN homojunction type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW094129859A 2005-08-31 2005-08-31 Photo diode, solid imaging device, and their fabrication method TWI270216B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/015838 WO2007026409A1 (ja) 2005-08-31 2005-08-31 フォトダイオード、固体撮像装置、およびその製造方法

Publications (2)

Publication Number Publication Date
TWI270216B TWI270216B (en) 2007-01-01
TW200709459A true TW200709459A (en) 2007-03-01

Family

ID=37808513

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129859A TWI270216B (en) 2005-08-31 2005-08-31 Photo diode, solid imaging device, and their fabrication method

Country Status (7)

Country Link
US (1) US7768087B2 (zh)
EP (1) EP1921685A4 (zh)
JP (1) JP4751395B2 (zh)
KR (1) KR100949753B1 (zh)
CN (1) CN100550437C (zh)
TW (1) TWI270216B (zh)
WO (1) WO2007026409A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479598B (zh) * 2011-09-07 2015-04-01 Omnivision Tech Inc 介於具有額外作用區域之半導體裝置之間之隔離區域

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100860141B1 (ko) * 2007-09-10 2008-09-24 주식회사 동부하이텍 이미지센서 및 그 제조방법
JP2010080666A (ja) * 2008-09-26 2010-04-08 Fujitsu Microelectronics Ltd 固体撮像素子
JP5387212B2 (ja) 2009-07-31 2014-01-15 富士通セミコンダクター株式会社 半導体装置及びその製造方法
KR101330270B1 (ko) * 2010-01-29 2013-11-15 이화여자대학교 산학협력단 소비전력 및 암전류가 감소된 실리콘 광전자 증배관
JP2015056651A (ja) * 2013-09-13 2015-03-23 株式会社東芝 受光素子と光結合型絶縁装置
US9373655B2 (en) * 2014-01-21 2016-06-21 Sony Corporation Imaging device and electronic apparatus
JP6800610B2 (ja) * 2016-05-24 2020-12-16 キヤノン株式会社 光電変換装置及び画像読み取り装置
DE102018105752B4 (de) * 2018-03-13 2019-10-24 X-Fab Semiconductor Foundries Gmbh Elektrisch modulierte Fotodiode und Verfahren zu deren Herstellung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864796A (ja) * 1994-08-26 1996-03-08 Olympus Optical Co Ltd 固体撮像装置の製造方法
US5859450A (en) * 1997-09-30 1999-01-12 Intel Corporation Dark current reducing guard ring
US6639261B2 (en) * 1998-12-08 2003-10-28 Micron Technology, Inc. Method for forming a low leakage contact in a CMOS imager
TW484235B (en) 1999-02-25 2002-04-21 Canon Kk Light-receiving element and photoelectric conversion device
JP4241527B2 (ja) 1999-02-25 2009-03-18 キヤノン株式会社 光電変換素子
JP3584196B2 (ja) * 1999-02-25 2004-11-04 キヤノン株式会社 受光素子及びそれを有する光電変換装置
JP2001094094A (ja) * 1999-09-21 2001-04-06 Hitachi Ltd 半導体装置およびその製造方法
US6504194B1 (en) * 1999-12-01 2003-01-07 Innotech Corporation Solid state imaging device, method of manufacturing the same, and solid state imaging system
US6545331B1 (en) 1999-12-10 2003-04-08 Innotech Corporation Solid state imaging device, manufacturing method thereof, and solid state imaging apparatus
JP2002050753A (ja) * 2000-08-04 2002-02-15 Innotech Corp 固体撮像素子、その製造方法及び固体撮像装置
JP2002164566A (ja) 2000-11-27 2002-06-07 Matsushita Electric Works Ltd 光電素子アレイ
JP2002237614A (ja) * 2000-11-28 2002-08-23 Canon Inc 光電変換装置及びその駆動方法並びに情報処理装置
JP4578792B2 (ja) * 2003-09-26 2010-11-10 富士通セミコンダクター株式会社 固体撮像装置
US7323731B2 (en) * 2003-12-12 2008-01-29 Canon Kabushiki Kaisha Photoelectric conversion device, method of manufacturing photoelectric conversion device, and image pickup system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479598B (zh) * 2011-09-07 2015-04-01 Omnivision Tech Inc 介於具有額外作用區域之半導體裝置之間之隔離區域

Also Published As

Publication number Publication date
CN100550437C (zh) 2009-10-14
EP1921685A1 (en) 2008-05-14
WO2007026409A1 (ja) 2007-03-08
KR100949753B1 (ko) 2010-03-25
CN101253635A (zh) 2008-08-27
KR20080040744A (ko) 2008-05-08
JPWO2007026409A1 (ja) 2009-03-26
US20090001496A1 (en) 2009-01-01
US7768087B2 (en) 2010-08-03
EP1921685A4 (en) 2014-12-17
JP4751395B2 (ja) 2011-08-17
TWI270216B (en) 2007-01-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees