TW200707905A - Semiconductor device, power supply device, and information processing device - Google Patents

Semiconductor device, power supply device, and information processing device

Info

Publication number
TW200707905A
TW200707905A TW095121738A TW95121738A TW200707905A TW 200707905 A TW200707905 A TW 200707905A TW 095121738 A TW095121738 A TW 095121738A TW 95121738 A TW95121738 A TW 95121738A TW 200707905 A TW200707905 A TW 200707905A
Authority
TW
Taiwan
Prior art keywords
region
semiconductor device
power supply
information processing
back gate
Prior art date
Application number
TW095121738A
Other languages
English (en)
Inventor
Kiyotaka Umemoto
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200707905A publication Critical patent/TW200707905A/zh

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/02Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/761PN junctions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823481MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Dc-Dc Converters (AREA)
TW095121738A 2005-06-17 2006-06-16 Semiconductor device, power supply device, and information processing device TW200707905A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005177417 2005-06-17

Publications (1)

Publication Number Publication Date
TW200707905A true TW200707905A (en) 2007-02-16

Family

ID=37532414

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121738A TW200707905A (en) 2005-06-17 2006-06-16 Semiconductor device, power supply device, and information processing device

Country Status (5)

Country Link
US (1) US20090128219A1 (zh)
JP (1) JP5057973B2 (zh)
CN (1) CN101171678A (zh)
TW (1) TW200707905A (zh)
WO (1) WO2006135062A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5438470B2 (ja) * 2009-11-05 2014-03-12 ルネサスエレクトロニクス株式会社 電力供給制御回路
JP5438469B2 (ja) * 2009-11-05 2014-03-12 ルネサスエレクトロニクス株式会社 負荷駆動装置
JP5636235B2 (ja) * 2010-05-07 2014-12-03 スパンション エルエルシー Dcdc変換装置
WO2011155295A1 (en) * 2010-06-10 2011-12-15 Semiconductor Energy Laboratory Co., Ltd. Dc/dc converter, power supply circuit, and semiconductor device
US9294080B2 (en) * 2013-04-26 2016-03-22 Fairchild Semiconductor Corporation Reverse current blocking comparator
JP6460592B2 (ja) 2013-07-31 2019-01-30 株式会社半導体エネルギー研究所 Dcdcコンバータ、及び半導体装置
FR3011700B1 (fr) 2013-10-03 2017-05-26 Continental Automotive France Systeme de regulation de tension
CN105227166B (zh) * 2014-05-26 2018-06-26 中航(重庆)微电子有限公司 一种mos管背栅电压控制电路
TWI829663B (zh) 2018-01-19 2024-01-21 日商半導體能源研究所股份有限公司 半導體裝置以及其工作方法
DE112019005845T5 (de) 2018-11-22 2021-08-12 Semiconductor Energy Laboratory Co., Ltd. Vorrichtung zur Erkennung von Anomalien in einer Sekundärbatterie und Halbleitervorrichtung
CN113014094B (zh) * 2019-12-20 2022-07-12 圣邦微电子(北京)股份有限公司 一种升压转换器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725813A (en) * 1985-04-22 1988-02-16 Nec Corporation MOS type circuit device
JP3439506B2 (ja) * 1992-11-24 2003-08-25 セイコーインスツルメンツ株式会社 充放電制御回路と充電式電源装置
JP2000261304A (ja) * 1999-03-11 2000-09-22 Mitsubishi Electric Corp 半導体装置
JP4572018B2 (ja) * 2000-04-27 2010-10-27 富士通株式会社 電池パックおよび電子機器システム
JP2002315201A (ja) * 2001-04-12 2002-10-25 Nec Miyagi Ltd 放電防止回路
EP1320168A1 (en) * 2001-12-12 2003-06-18 Dialog Semiconductor GmbH Power switch for battery protection
TW578321B (en) * 2002-10-02 2004-03-01 Topro Technology Inc Complementary metal-oxide semiconductor structure for a battery protection circuit and battery protection circuit therewith
US7385433B2 (en) * 2005-03-18 2008-06-10 Stmicroelectronics, Inc. Analog switch with reduced parasitic bipolar transistor injection

Also Published As

Publication number Publication date
JPWO2006135062A1 (ja) 2009-01-08
WO2006135062A1 (ja) 2006-12-21
US20090128219A1 (en) 2009-05-21
JP5057973B2 (ja) 2012-10-24
CN101171678A (zh) 2008-04-30

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