TW200706707A - Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution - Google Patents

Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution

Info

Publication number
TW200706707A
TW200706707A TW095108414A TW95108414A TW200706707A TW 200706707 A TW200706707 A TW 200706707A TW 095108414 A TW095108414 A TW 095108414A TW 95108414 A TW95108414 A TW 95108414A TW 200706707 A TW200706707 A TW 200706707A
Authority
TW
Taiwan
Prior art keywords
tin plating
plating solution
tin
solution
preparing
Prior art date
Application number
TW095108414A
Other languages
English (en)
Chinese (zh)
Other versions
TWI325022B (enrdf_load_stackoverflow
Inventor
Satoshi Kawashima
Hiroyuki Tashiro
Shigenori Emura
Takamitsu Nashiyama
Hideyuki Sampei
Original Assignee
Meltex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meltex Inc filed Critical Meltex Inc
Publication of TW200706707A publication Critical patent/TW200706707A/zh
Application granted granted Critical
Publication of TWI325022B publication Critical patent/TWI325022B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW095108414A 2005-04-28 2006-03-13 Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution TW200706707A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005132092 2005-04-28

Publications (2)

Publication Number Publication Date
TW200706707A true TW200706707A (en) 2007-02-16
TWI325022B TWI325022B (enrdf_load_stackoverflow) 2010-05-21

Family

ID=37307726

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108414A TW200706707A (en) 2005-04-28 2006-03-13 Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution

Country Status (4)

Country Link
JP (1) JP3878959B2 (enrdf_load_stackoverflow)
KR (1) KR100934401B1 (enrdf_load_stackoverflow)
TW (1) TW200706707A (enrdf_load_stackoverflow)
WO (1) WO2006117920A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104593835A (zh) * 2015-02-04 2015-05-06 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
CN105525312A (zh) * 2015-12-11 2016-04-27 广州市精利表面处理技术有限公司 一种镀锡溶液及其制备方法

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JP4632186B2 (ja) * 2007-08-01 2011-02-16 太陽化学工業株式会社 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品
CN101748425B (zh) * 2008-12-05 2014-07-09 宜兴方晶科技有限公司 甲基磺酸亚锡制备方法
JP6127289B2 (ja) * 2012-03-02 2017-05-17 国立大学法人信州大学 リチウムイオン電池用負極材料およびその製造方法
CN103014786B (zh) * 2013-01-22 2016-01-20 广州博泉环保材料科技有限公司 电镀液、其制备方法及应用此电镀液的镀锡工艺
CN104109885B (zh) * 2013-04-22 2017-02-01 广东致卓精密金属科技有限公司 一种弱碱性焦磷酸盐电镀光亮锡溶液及工艺
CN105899714B (zh) * 2013-12-05 2018-09-21 霍尼韦尔国际公司 具有经调节的pH的甲基磺酸亚锡溶液
JP6401310B2 (ja) 2014-07-07 2018-10-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． イオンスカベンジャーを有する熱界面材料
KR102470083B1 (ko) 2014-12-05 2022-11-23 허니웰 인터내셔널 인코포레이티드 저열 임피던스를 갖는 고성능 열 계면 재료
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
MX393621B (es) 2016-03-08 2025-03-24 Honeywell Int Inc Material de camibo de fase.
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11686007B2 (en) * 2017-12-18 2023-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
JP7598552B2 (ja) 2020-10-02 2024-12-12 メルテックス株式会社 バレルめっき用スズめっき液
CN113430592A (zh) * 2021-06-30 2021-09-24 广东德浩化工新材料有限公司 一种中性镀锡稳定剂及其制备方法
KR102664806B1 (ko) * 2021-11-18 2024-05-10 주식회사 에이엔씨코리아 적층세라믹 콘덴서용 주석도금액

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3858241B2 (ja) * 2002-04-09 2006-12-13 石原薬品株式会社 中性スズメッキ浴を用いたバレルメッキ方法
JP4224698B2 (ja) 2003-10-24 2009-02-18 株式会社村田製作所 めっき浴の作製方法、めっき浴、めっき方法、及び電子部品の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104593835A (zh) * 2015-02-04 2015-05-06 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
CN105525312A (zh) * 2015-12-11 2016-04-27 广州市精利表面处理技术有限公司 一种镀锡溶液及其制备方法
CN105525312B (zh) * 2015-12-11 2017-12-29 广州市精利表面处理技术有限公司 一种镀锡溶液及其制备方法

Also Published As

Publication number Publication date
JP3878959B2 (ja) 2007-02-07
WO2006117920A1 (ja) 2006-11-09
TWI325022B (enrdf_load_stackoverflow) 2010-05-21
JP2006328528A (ja) 2006-12-07
KR20070116654A (ko) 2007-12-10
KR100934401B1 (ko) 2009-12-29

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