TW200705481A - Method of production of multilayer ceramic electronic device - Google Patents
Method of production of multilayer ceramic electronic deviceInfo
- Publication number
- TW200705481A TW200705481A TW095114111A TW95114111A TW200705481A TW 200705481 A TW200705481 A TW 200705481A TW 095114111 A TW095114111 A TW 095114111A TW 95114111 A TW95114111 A TW 95114111A TW 200705481 A TW200705481 A TW 200705481A
- Authority
- TW
- Taiwan
- Prior art keywords
- dielectric
- paste
- main ingredient
- electronic device
- production
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000003989 dielectric material Substances 0.000 abstract 5
- 239000000463 material Substances 0.000 abstract 5
- 230000002401 inhibitory effect Effects 0.000 abstract 4
- 239000002075 main ingredient Substances 0.000 abstract 4
- 238000005245 sintering Methods 0.000 abstract 4
- 239000002003 electrode paste Substances 0.000 abstract 1
- 238000010304 firing Methods 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
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- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/76—Crystal structural characteristics, e.g. symmetry
- C04B2235/761—Unit-cell parameters, e.g. lattice constants
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/79—Non-stoichiometric products, e.g. perovskites (ABO3) with an A/B-ratio other than 1
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005133079A JP4385381B2 (ja) | 2005-04-28 | 2005-04-28 | 積層セラミック電子部品の製造方法 |
JP2005133083A JP2006310646A (ja) | 2005-04-28 | 2005-04-28 | 積層セラミック電子部品の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200705481A true TW200705481A (en) | 2007-02-01 |
Family
ID=36691388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095114111A TW200705481A (en) | 2005-04-28 | 2006-04-20 | Method of production of multilayer ceramic electronic device |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060254693A1 (zh) |
EP (1) | EP1717829A3 (zh) |
KR (1) | KR100822110B1 (zh) |
TW (1) | TW200705481A (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1988586B1 (en) * | 2003-09-25 | 2010-11-10 | Kyocera Corporation | Multi-layer piezoelectric device |
JP4970318B2 (ja) * | 2007-06-12 | 2012-07-04 | Tdk株式会社 | 積層型ptcサーミスタ及びその製造方法 |
EP2015318B1 (en) | 2007-06-12 | 2012-02-29 | TDK Corporation | Stacked PTC thermistor and process for its production |
JP5587793B2 (ja) * | 2008-01-23 | 2014-09-10 | エプコス アクチエンゲゼルシャフト | 圧電多層構成要素 |
WO2009092584A1 (de) | 2008-01-23 | 2009-07-30 | Epcos Ag | Piezoelektrisches vielschichtbauelement |
WO2009092583A1 (de) * | 2008-01-23 | 2009-07-30 | Epcos Ag | Piezoelektrisches vielschichtbauelement |
JP4851554B2 (ja) * | 2009-03-25 | 2012-01-11 | パナソニック株式会社 | プラズマディスプレイパネルの製造方法 |
KR101197787B1 (ko) * | 2010-10-29 | 2012-11-05 | 삼성전기주식회사 | 적층형 세라믹 캐패시터 및 이의 제조방법 |
KR101581925B1 (ko) | 2011-02-14 | 2015-12-31 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 콘덴서 및 적층 세라믹 콘덴서의 제조방법 |
KR101761940B1 (ko) * | 2012-05-04 | 2017-07-26 | 삼성전기주식회사 | 적층형 전자 부품 및 이의 제조방법 |
CN104508772B (zh) * | 2012-08-07 | 2017-09-01 | 株式会社村田制作所 | 层叠陶瓷电容器以及层叠陶瓷电容器的制造方法 |
US9324931B2 (en) | 2013-05-14 | 2016-04-26 | Tdk Corporation | Piezoelectric device |
US20140339458A1 (en) * | 2013-05-14 | 2014-11-20 | Tdk Corporation | Piezoelectric ceramic and piezoelectric device containing the same |
JP2014212349A (ja) * | 2014-08-13 | 2014-11-13 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
JP2018037473A (ja) * | 2016-08-30 | 2018-03-08 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP2019134098A (ja) * | 2018-01-31 | 2019-08-08 | Tdk株式会社 | 積層セラミックコンデンサ |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4954926A (en) * | 1989-07-28 | 1990-09-04 | E. I. Du Pont De Nemours And Company | Thick film conductor composition |
JPH04260315A (ja) * | 1991-02-15 | 1992-09-16 | Taiyo Yuden Co Ltd | セラミック積層体 |
US5335139A (en) * | 1992-07-13 | 1994-08-02 | Tdk Corporation | Multilayer ceramic chip capacitor |
JP3391269B2 (ja) * | 1998-01-20 | 2003-03-31 | 株式会社村田製作所 | 誘電体セラミックおよびその製造方法、ならびに、積層セラミック電子部品およびその製造方法 |
DE19902151B4 (de) * | 1998-01-20 | 2005-03-10 | Murata Manufacturing Co | Verfahren zur Herstellung einer dielektrischen Keramik sowie Bariumtitanatpulver für ein solches Verfahren |
JP3934352B2 (ja) * | 2000-03-31 | 2007-06-20 | Tdk株式会社 | 積層型セラミックチップコンデンサとその製造方法 |
JP2002187770A (ja) * | 2000-12-15 | 2002-07-05 | Toho Titanium Co Ltd | 誘電体磁器組成物及びこれを用いた積層セラミックコンデンサ |
DE60232958D1 (de) * | 2001-04-12 | 2009-08-27 | Tdk Corp | Produktionsverfahren für ein keramisches elektronisches mehrschicht-bauteil |
JP3807257B2 (ja) * | 2001-06-25 | 2006-08-09 | 松下電器産業株式会社 | セラミック部品の製造方法 |
EP1327616B9 (en) * | 2002-01-15 | 2011-04-13 | TDK Corporation | Dielectric ceramic composition and electronic device |
JP2004002923A (ja) * | 2002-05-31 | 2004-01-08 | Murata Mfg Co Ltd | ニッケル粉末の製造方法、及びニッケル粉末 |
JP2004296857A (ja) * | 2003-03-27 | 2004-10-21 | Tdk Corp | 電子部品の特性を予測する方法および製造方法 |
JP2005159224A (ja) * | 2003-11-28 | 2005-06-16 | Tdk Corp | 積層セラミックコンデンサ |
-
2006
- 2006-04-20 TW TW095114111A patent/TW200705481A/zh unknown
- 2006-04-27 US US11/411,867 patent/US20060254693A1/en not_active Abandoned
- 2006-04-27 EP EP06008787A patent/EP1717829A3/en not_active Withdrawn
- 2006-04-28 KR KR1020060038693A patent/KR100822110B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US20060254693A1 (en) | 2006-11-16 |
EP1717829A2 (en) | 2006-11-02 |
EP1717829A3 (en) | 2008-10-22 |
KR20060113535A (ko) | 2006-11-02 |
KR100822110B1 (ko) | 2008-04-15 |
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