TW200702951A - Photomask, manufacturing method thereof, and manufacturing method of electronic device - Google Patents

Photomask, manufacturing method thereof, and manufacturing method of electronic device

Info

Publication number
TW200702951A
TW200702951A TW095107663A TW95107663A TW200702951A TW 200702951 A TW200702951 A TW 200702951A TW 095107663 A TW095107663 A TW 095107663A TW 95107663 A TW95107663 A TW 95107663A TW 200702951 A TW200702951 A TW 200702951A
Authority
TW
Taiwan
Prior art keywords
manufacturing
light
photomask
electronic device
substrate
Prior art date
Application number
TW095107663A
Other languages
English (en)
Other versions
TWI302230B (en
Inventor
Hirotsuna Miura
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200702951A publication Critical patent/TW200702951A/zh
Application granted granted Critical
Publication of TWI302230B publication Critical patent/TWI302230B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G03F1/56—Organic absorbers, e.g. of photo-resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
TW095107663A 2005-03-09 2006-03-07 Photomask, manufacturing method thereof, and manufacturing method of electronic device TWI302230B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005066091A JP4337746B2 (ja) 2005-03-09 2005-03-09 フォトマスクおよびその製造方法、電子機器の製造方法

Publications (2)

Publication Number Publication Date
TW200702951A true TW200702951A (en) 2007-01-16
TWI302230B TWI302230B (en) 2008-10-21

Family

ID=36970367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107663A TWI302230B (en) 2005-03-09 2006-03-07 Photomask, manufacturing method thereof, and manufacturing method of electronic device

Country Status (5)

Country Link
US (1) US7776492B2 (zh)
JP (1) JP4337746B2 (zh)
KR (1) KR100749976B1 (zh)
CN (1) CN1831642A (zh)
TW (1) TWI302230B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7615483B2 (en) * 2006-12-22 2009-11-10 Palo Alto Research Center Incorporated Printed metal mask for UV, e-beam, ion-beam and X-ray patterning
JP2009202400A (ja) * 2008-02-27 2009-09-10 Seiko Epson Corp 印刷装置
JP4798185B2 (ja) 2008-08-05 2011-10-19 パナソニック電工株式会社 積層造形装置
JP5448639B2 (ja) * 2009-08-19 2014-03-19 ローランドディー．ジー．株式会社 電子回路基板の製造装置
CN103037976B (zh) * 2010-06-30 2015-11-25 联邦科学与工业研究组织 液滴产生系统和方法
CN107825886B (zh) * 2013-12-12 2020-04-14 科迪华公司 制造电子设备的方法
CN104793468B (zh) * 2014-01-20 2017-07-14 中芯国际集成电路制造(上海)有限公司 图形化装置和形成抗刻蚀图形的方法
TWI563890B (en) * 2014-12-19 2016-12-21 T Top Technology Optical Co Ltd Solder mask manufacturing method for substrates
ES2902854T3 (es) * 2015-12-16 2022-03-30 Yuhua Youchuang Shanghai Biotechnology Co Ltd Impresora láser para casetes de inclusión patológica y procedimiento de impresión de los mismos
CN107393850A (zh) * 2017-08-16 2017-11-24 君泰创新（北京）科技有限公司 太阳能电池浆料的干燥方法及系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60152027A (ja) 1984-01-20 1985-08-10 Hitachi Ltd パタ−ン欠陥修正方法
JPS60196942A (ja) * 1984-03-21 1985-10-05 Hitachi Ltd フオトマスク欠陥修正方法
JPS60254729A (ja) 1984-05-31 1985-12-16 Toppan Printing Co Ltd マスク基板上のマスクパタ−ンの修正方法
JPS61264344A (ja) 1985-05-20 1986-11-22 Hitachi Ltd 修正液の塗布方法
JPH02963A (ja) 1988-06-03 1990-01-05 Toshiba Corp パターン修正方法及び装置
JP2877200B2 (ja) 1995-06-29 1999-03-31 日本電気株式会社 露光用フォトマスクおよびその製造方法
JP4003273B2 (ja) 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
US5981110A (en) * 1998-02-17 1999-11-09 International Business Machines Corporation Method for repairing photomasks
JP4741045B2 (ja) 1998-03-25 2011-08-03 セイコーエプソン株式会社 電気回路、その製造方法および電気回路製造装置
JPH11323410A (ja) 1998-05-14 1999-11-26 Fujitsu Ltd クロム微粒子の生成方法、フォトマスクの製造方法及びフォトマスクの修正方法
JP2000328252A (ja) 1999-05-24 2000-11-28 Hyper Photon System:Kk 金属パターン形成方法
DE10043315C1 (de) 2000-09-02 2002-06-20 Zeiss Carl Projektionsbelichtungsanlage
JP3794406B2 (ja) * 2003-01-21 2006-07-05 セイコーエプソン株式会社 液滴吐出装置、印刷装置、印刷方法および電気光学装置
JP4296943B2 (ja) 2003-01-28 2009-07-15 ソニー株式会社 露光用マスクの製造方法および露光方法ならびに３次元形状の製造方法
JP4244382B2 (ja) * 2003-02-26 2009-03-25 セイコーエプソン株式会社 機能性材料定着方法及びデバイス製造方法
JP2004342716A (ja) 2003-05-14 2004-12-02 Konica Minolta Holdings Inc バンプ形成方法及びバンプ形成装置
JP3673263B2 (ja) 2003-05-30 2005-07-20 株式会社東芝 露光マスク基板製造方法、露光マスク製造方法、及び半導体装置製造方法

Also Published As

Publication number Publication date
TWI302230B (en) 2008-10-21
KR100749976B1 (ko) 2007-08-16
US7776492B2 (en) 2010-08-17
JP2006251231A (ja) 2006-09-21
US20060203064A1 (en) 2006-09-14
CN1831642A (zh) 2006-09-13
KR20060097614A (ko) 2006-09-14
JP4337746B2 (ja) 2009-09-30

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