TWI563890B - Solder mask manufacturing method for substrates - Google Patents
Solder mask manufacturing method for substratesInfo
- Publication number
- TWI563890B TWI563890B TW103144408A TW103144408A TWI563890B TW I563890 B TWI563890 B TW I563890B TW 103144408 A TW103144408 A TW 103144408A TW 103144408 A TW103144408 A TW 103144408A TW I563890 B TWI563890 B TW I563890B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrates
- solder mask
- mask manufacturing
- manufacturing
- solder
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103144408A TWI563890B (en) | 2014-12-19 | 2014-12-19 | Solder mask manufacturing method for substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103144408A TWI563890B (en) | 2014-12-19 | 2014-12-19 | Solder mask manufacturing method for substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201524295A TW201524295A (en) | 2015-06-16 |
TWI563890B true TWI563890B (en) | 2016-12-21 |
Family
ID=53935899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103144408A TWI563890B (en) | 2014-12-19 | 2014-12-19 | Solder mask manufacturing method for substrates |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI563890B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115696773A (en) * | 2022-11-28 | 2023-02-03 | 精捷科技光学股份有限公司 | Laser welding-proof layer removing process method for substrate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI302230B (en) * | 2005-03-09 | 2008-10-21 | Seiko Epson Corp | Photomask, manufacturing method thereof, and manufacturing method of electronic device |
TWI455669B (en) * | 2009-12-07 | 2014-10-01 | San Ei Kagaku Co | Printed wiring board and method for producing the same |
-
2014
- 2014-12-19 TW TW103144408A patent/TWI563890B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI302230B (en) * | 2005-03-09 | 2008-10-21 | Seiko Epson Corp | Photomask, manufacturing method thereof, and manufacturing method of electronic device |
TWI455669B (en) * | 2009-12-07 | 2014-10-01 | San Ei Kagaku Co | Printed wiring board and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
TW201524295A (en) | 2015-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |