TW200702657A - Visual inspection apparatus, visual inspection method, and circumference inspection unit attachable to visual inspection apparatus - Google Patents

Visual inspection apparatus, visual inspection method, and circumference inspection unit attachable to visual inspection apparatus

Info

Publication number
TW200702657A
TW200702657A TW095114943A TW95114943A TW200702657A TW 200702657 A TW200702657 A TW 200702657A TW 095114943 A TW095114943 A TW 095114943A TW 95114943 A TW95114943 A TW 95114943A TW 200702657 A TW200702657 A TW 200702657A
Authority
TW
Taiwan
Prior art keywords
visual inspection
inspection
circumference
inspection apparatus
visual
Prior art date
Application number
TW095114943A
Other languages
English (en)
Other versions
TWI411773B (zh
Inventor
Atsutoshi Yokota
Hiroyasu Hebiishi
Shinichi Dosaka
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200702657A publication Critical patent/TW200702657A/zh
Application granted granted Critical
Publication of TWI411773B publication Critical patent/TWI411773B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
TW095114943A 2005-04-27 2006-04-26 外觀檢查裝置及外觀檢查方法、以及可安裝於外觀檢查裝置之周圍部檢查單元 TWI411773B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005129403 2005-04-27
JP2005202015 2005-07-11

Publications (2)

Publication Number Publication Date
TW200702657A true TW200702657A (en) 2007-01-16
TWI411773B TWI411773B (zh) 2013-10-11

Family

ID=37307951

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114943A TWI411773B (zh) 2005-04-27 2006-04-26 外觀檢查裝置及外觀檢查方法、以及可安裝於外觀檢查裝置之周圍部檢查單元

Country Status (4)

Country Link
US (2) US7684031B2 (zh)
JP (1) JPWO2006118152A1 (zh)
TW (1) TWI411773B (zh)
WO (1) WO2006118152A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451077B (zh) * 2007-03-27 2014-09-01 Olympus Corp 外觀檢查裝置
TWI809110B (zh) * 2018-05-23 2023-07-21 義大利商馬普斯公司 檢查機械部件尺寸的方法及設備

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EP1921502B1 (de) * 2006-11-08 2011-02-02 Integrated Dynamics Engineering GmbH Kombiniertes Motion-Control-System
DE102007047935A1 (de) * 2007-03-19 2008-09-25 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Inspektion von Defekten am Randbereich eines Wafers und Verwendung der Vorrichtung in einer Inspektionseinrichtung für Wafer
JP5120018B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置
JP5410212B2 (ja) * 2009-09-15 2014-02-05 株式会社Ｓｏｋｕｄｏ 基板処理装置、基板処理システムおよび検査周辺露光装置
JP5532850B2 (ja) * 2009-11-24 2014-06-25 株式会社Ｓｕｍｃｏ 半導体ウェーハの形状測定方法およびそれに用いる形状測定装置
US9392931B2 (en) * 2010-03-22 2016-07-19 Brainlab Ag Controlling a surgical microscope
JP5706515B2 (ja) 2010-04-13 2015-04-22 カスケード マイクロテック インコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ プローブ先端を接点面の配列に接触させる方法及び装置
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
JP2012073155A (ja) * 2010-09-29 2012-04-12 Hitachi High-Technologies Corp 磁気ディスク検査装置及び検査方法
US8501503B2 (en) * 2011-04-28 2013-08-06 Nanda Technologies Gmbh Methods of inspecting and manufacturing semiconductor wafers
FR2981160A1 (fr) * 2011-10-10 2013-04-12 Altatech Semiconductor Dispositif et procede d'inspection et de controle de plaquettes semi-conductrices.
JP5796870B2 (ja) * 2011-12-05 2015-10-21 株式会社日本マイクロニクス 半導体デバイスの検査装置とそれに用いるチャックステージ
US9110252B2 (en) * 2012-08-29 2015-08-18 Lightel Technologies, Inc. Adaptive device for inspecting endfaces of fiber-optic connector having multiple rows of fibers
WO2015040206A1 (en) * 2013-09-23 2015-03-26 Tyco Electronics Uk Ltd. Adapter for inspection of fiber optic cables
CN107543824B (zh) * 2016-06-23 2022-03-22 中国科学院长春光学精密机械与物理研究所 平面光学元件表面疵病的检测装置及其检测方法
US10101570B1 (en) * 2017-06-01 2018-10-16 Lightel Technologies, Inc. Optical fiber connector inspector with two-dimensional scanning function
US10254196B2 (en) * 2017-06-01 2019-04-09 Lightel Technologies, Inc. Optical fiber connector inspector with two-dimensional scanning function
CN113330346B (zh) * 2018-06-13 2023-06-23 奇跃公司 光学器件边缘密封剂的光泄露检测
JP7314237B2 (ja) * 2019-09-25 2023-07-25 東京エレクトロン株式会社 基板撮像装置及び基板撮像方法
JP7351273B2 (ja) * 2020-08-25 2023-09-27 株式会社Sumco 半導体ウェーハの割れの発生率低減方法
CN114518367B (zh) * 2022-04-18 2022-07-05 深圳市汇图技术有限公司 一种印刷板路光学追踪检测装置

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US4065212A (en) * 1975-06-30 1977-12-27 International Business Machines Corporation Inspection tool
JPH05160245A (ja) * 1991-12-06 1993-06-25 Nikon Corp 円形基板の位置決め装置
JP3200308B2 (ja) * 1994-11-04 2001-08-20 株式会社神戸製鋼所 円板周縁面検査装置
JP2999712B2 (ja) 1996-03-29 2000-01-17 住友金属工業株式会社 端部欠陥検査方法とその装置
DE19809505A1 (de) * 1997-03-05 1998-09-17 Asahi Optical Co Ltd Einrichtung zum Prüfen optischer Elemente
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
JP2002270672A (ja) * 2001-03-09 2002-09-20 Olympus Optical Co Ltd アライメント方法及び基板検査装置
KR100416791B1 (ko) * 2001-03-19 2004-01-31 삼성전자주식회사 반도체 웨이퍼 검사용 현미경장치 및 그 검사방법
WO2003028089A1 (fr) * 2001-09-19 2003-04-03 Olympus Optical Co., Ltd. Systeme de controle de tranches en semiconducteur
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2003344307A (ja) 2002-05-31 2003-12-03 Cradle Corp 光学検査装置
US7053393B2 (en) * 2002-06-04 2006-05-30 Olympus Corporation Alignment apparatus for object on stage
JP4334917B2 (ja) * 2002-06-04 2009-09-30 オリンパス株式会社 アライメント装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451077B (zh) * 2007-03-27 2014-09-01 Olympus Corp 外觀檢查裝置
TWI809110B (zh) * 2018-05-23 2023-07-21 義大利商馬普斯公司 檢查機械部件尺寸的方法及設備
US11761747B2 (en) 2018-05-23 2023-09-19 Marposs Societa' Per Azioni Method and apparatus for checking dimensions of a mechanical part

Also Published As

Publication number Publication date
US20090316143A1 (en) 2009-12-24
JPWO2006118152A1 (ja) 2008-12-18
US20080088833A1 (en) 2008-04-17
WO2006118152A1 (ja) 2006-11-09
US7684031B2 (en) 2010-03-23
TWI411773B (zh) 2013-10-11

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MM4A Annulment or lapse of patent due to non-payment of fees