TW200702650A - Method and device for obtaining work position information - Google Patents

Method and device for obtaining work position information

Info

Publication number
TW200702650A
TW200702650A TW095115057A TW95115057A TW200702650A TW 200702650 A TW200702650 A TW 200702650A TW 095115057 A TW095115057 A TW 095115057A TW 95115057 A TW95115057 A TW 95115057A TW 200702650 A TW200702650 A TW 200702650A
Authority
TW
Taiwan
Prior art keywords
work
photographing
reference mark
position information
during
Prior art date
Application number
TW095115057A
Other languages
English (en)
Inventor
Hiroshi Uemura
Kazuhiro Terada
Takashi Fukui
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200702650A publication Critical patent/TW200702650A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
TW095115057A 2005-04-28 2006-04-27 Method and device for obtaining work position information TW200702650A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005133591A JP2006309021A (ja) 2005-04-28 2005-04-28 ワーク位置情報取得方法および装置

Publications (1)

Publication Number Publication Date
TW200702650A true TW200702650A (en) 2007-01-16

Family

ID=37307932

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115057A TW200702650A (en) 2005-04-28 2006-04-27 Method and device for obtaining work position information

Country Status (6)

Country Link
US (1) US20090035669A1 (zh)
JP (1) JP2006309021A (zh)
KR (1) KR20080005410A (zh)
CN (1) CN101185035A (zh)
TW (1) TW200702650A (zh)
WO (1) WO2006118133A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI658910B (zh) * 2017-03-31 2019-05-11 日商平田機工股份有限公司 Transfer method and transfer system

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4606992B2 (ja) * 2005-10-20 2011-01-05 富士フイルム株式会社 描画装置及び描画方法
US8594983B2 (en) * 2006-03-20 2013-11-26 Duetto Integrated Systems, Inc. System for manufacturing laminated circuit boards
US8934081B2 (en) * 2010-03-01 2015-01-13 Mycronic AB Method and apparatus for performing alignment using reference board
JP2012198372A (ja) * 2011-03-22 2012-10-18 Dainippon Screen Mfg Co Ltd 描画装置および描画方法
CN102493282A (zh) * 2011-12-27 2012-06-13 马维理 字画古籍高清拍摄修复仪
JP6465591B2 (ja) * 2014-08-27 2019-02-06 株式会社オーク製作所 描画装置
KR102446951B1 (ko) * 2015-12-02 2022-09-23 세메스 주식회사 반도체 패키지들 수납 방법
JP6876470B2 (ja) 2017-03-07 2021-05-26 東京エレクトロン株式会社 ワーク加工装置、ワーク加工方法、プログラム及びコンピュータ記憶媒体
CN111505907B (zh) * 2019-01-31 2021-06-18 上海微电子装备（集团）股份有限公司 一种工件台定位误差的校准方法
CN111299975B (zh) * 2020-03-17 2021-11-12 孙晓杰 一种应用机器人提高复杂铸件加工效率的方法
JP7489913B2 (ja) 2020-12-24 2024-05-24 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3507205B2 (ja) * 1995-07-24 2004-03-15 キヤノン株式会社 走査型露光装置及び該装置を用いてデバイスを製造する方法
JPH09161716A (ja) * 1995-12-04 1997-06-20 Nikon Corp 荷電粒子線装置
JPH11126741A (ja) * 1997-10-23 1999-05-11 Nikon Corp 位置合わせ方法、露光方法及び露光装置
JP3644846B2 (ja) * 1999-05-13 2005-05-11 大日本スクリーン製造株式会社 描画装置の移動誤差検出装置及びその方法
JP2000329544A (ja) * 1999-05-24 2000-11-30 Dainippon Screen Mfg Co Ltd 処理装置の基板位置決め装置及びその方法
JP4076341B2 (ja) * 2001-11-29 2008-04-16 大日本スクリーン製造株式会社 レーザ描画方法とその装置
JP4201178B2 (ja) * 2002-05-30 2008-12-24 大日本スクリーン製造株式会社 画像記録装置
JP2005031274A (ja) * 2003-07-10 2005-02-03 Fuji Photo Film Co Ltd 画像記録装置及び画像記録方法
JP4322837B2 (ja) * 2004-03-31 2009-09-02 富士フイルム株式会社 露光装置の校正方法及び露光方法並びに露光装置
JP4912071B2 (ja) * 2006-08-04 2012-04-04 株式会社リコー 光走査装置、光走査方法、画像形成装置、カラー画像形成装置、プログラム、記録媒体
JP2009012323A (ja) * 2007-07-05 2009-01-22 Konica Minolta Business Technologies Inc 画像形成装置、画像形成方法及びプログラム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI658910B (zh) * 2017-03-31 2019-05-11 日商平田機工股份有限公司 Transfer method and transfer system

Also Published As

Publication number Publication date
KR20080005410A (ko) 2008-01-11
CN101185035A (zh) 2008-05-21
US20090035669A1 (en) 2009-02-05
WO2006118133A1 (ja) 2006-11-09
JP2006309021A (ja) 2006-11-09

Similar Documents

Publication Publication Date Title
TW200702650A (en) Method and device for obtaining work position information
SG137828A1 (en) Metrology tool, system comprising a lithographic apparatus and a metrology tool, and a method for determining a parameter of a substrate
TW200738379A (en) Boring method and boring device
DE602004027178D1 (de) Messverfahren zur Verwendung in Werkzeugmaschinen
TW200707133A (en) Lithographic apparatus and positioning apparatus
TW200616042A (en) Reticle maintaining device, reticle moving device, exposure device, and moving method for reticle
EP1803394A3 (en) Method of determining a position of a magnetic source
DE502006004016D1 (de) Bearbeitungsvorrichtung mit vermessungseinrichtung für ein modell
TW200720649A (en) Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
DE502005008875D1 (de) Werkzeugmaschine
DE602006019117D1 (de) Vorrichtung und verfahren für einen verfolgbaren ultraschall
DE102005058504B3 (de) Vorrichtung zum Bestimmen einer Messgröße an einem Messobjekt
ATE363963T1 (de) Schleifmaschine mit rundlaufkorrektur
EP2221691A3 (en) articulating device
TW200631724A (en) Stage device, gantry-type stage device, and method for controlling stage device
ATE419119T1 (de) Automatisches montagesystem
WO2010071840A3 (en) Conforming components using reverse engineering
TW200506315A (en) Substrate holder, substrate processing apparatus, substrate inspection device and method of using the same
GB2443585A (en) Data representation relating to a non-sampled workpiece
TW200606596A (en) Aligning apparatus, aligning method, exposure apparatus, exposure method and device manufacturing method
ATE481209T1 (de) Bearbeitungszentrum
CN210452424U (zh) 一种工件定位设备
ATE500912T1 (de) Verfahren zum planfräsen von werkstückoberflächen
ATE453083T1 (de) Vorrichtung mit halter, führung in diesem halter und element, das in der führung bewegt werden kann
ATE318449T1 (de) Vorrichtung zur messung oder maschinellen bearbeitung eines objekts mit einer verschiebungsstufe mit keilförmigen führungen