TW200700524A - Adhesive composition for flexible printed wiring board and adhesive film for flexible printed wiring board using it - Google Patents

Adhesive composition for flexible printed wiring board and adhesive film for flexible printed wiring board using it

Info

Publication number
TW200700524A
TW200700524A TW095107049A TW95107049A TW200700524A TW 200700524 A TW200700524 A TW 200700524A TW 095107049 A TW095107049 A TW 095107049A TW 95107049 A TW95107049 A TW 95107049A TW 200700524 A TW200700524 A TW 200700524A
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
flexible printed
adhesive composition
adhesive film
Prior art date
Application number
TW095107049A
Other languages
English (en)
Inventor
Noriko Kuwahara
Hisae Oba
Tomohito Yuasa
Nozomu Takano
Original Assignee
Hitachi Kasei Polymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kasei Polymer Co Ltd filed Critical Hitachi Kasei Polymer Co Ltd
Publication of TW200700524A publication Critical patent/TW200700524A/zh

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C11/00—Details of pavings
    • E01C11/22—Gutters; Kerbs ; Surface drainage of streets, roads or like traffic areas
    • E01C11/221—Kerbs or like edging members, e.g. flush kerbs, shoulder retaining means ; Joint members, connecting or load-transfer means specially for kerbs
    • E01C11/222—Raised kerbs, e.g. for sidewalks ; Integrated or portable means for facilitating ascent or descent
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C2201/00—Paving elements
    • E01C2201/06—Sets of paving elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW095107049A 2005-03-09 2006-03-02 Adhesive composition for flexible printed wiring board and adhesive film for flexible printed wiring board using it TW200700524A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005065409 2005-03-09
JP2006053922A JP4847767B2 (ja) 2005-03-09 2006-02-28 フレキシブルプリント配線板用接着剤組成物およびそれを用いてなるフレキシブルプリント配線板用接着フィルム

Publications (1)

Publication Number Publication Date
TW200700524A true TW200700524A (en) 2007-01-01

Family

ID=37405235

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107049A TW200700524A (en) 2005-03-09 2006-03-02 Adhesive composition for flexible printed wiring board and adhesive film for flexible printed wiring board using it

Country Status (3)

Country Link
JP (1) JP4847767B2 (zh)
KR (1) KR20060097618A (zh)
TW (1) TW200700524A (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100791265B1 (ko) * 2006-11-03 2008-01-04 (주)파트론 언더필 공정을 이용한 카메라모듈의 연성인쇄회로기판접합방법
JP2009007442A (ja) * 2007-06-27 2009-01-15 Hitachi Kasei Polymer Co Ltd フレキシブルプリント配線板用接着剤組成物およびそれを用いたフレキシブルプリント配線板用接着フィルム
US8138580B2 (en) 2007-09-19 2012-03-20 Toray Industries, Inc. Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
KR100945635B1 (ko) * 2007-12-18 2010-03-04 제일모직주식회사 반도체 조립용 접착 필름 조성물, 이에 의한 접착 필름 및이를 포함하는 다이싱 다이본드 필름
JP5881927B2 (ja) * 2008-03-26 2016-03-09 日立化成株式会社 半導体封止用接着剤、半導体封止用フィルム状接着剤、半導体装置の製造方法、および半導体装置
JP2009253213A (ja) * 2008-04-10 2009-10-29 Hitachi Kasei Polymer Co Ltd フレキシブルプリント配線板用接着剤組成物およびそれを用いたフレキシブルプリント配線板用接着フィルム、及びフレキシブルプリント配線板用カバーレイフィルム
JP2010074050A (ja) * 2008-09-22 2010-04-02 Hitachi Kasei Polymer Co Ltd フレキシブルプリント配線板用接着剤組成物およびそれを用いた接着フィルム
JP2011074110A (ja) * 2009-09-29 2011-04-14 Tomoegawa Paper Co Ltd 接着剤組成物、接着フィルムおよび接着テープ
US8674502B2 (en) 2010-07-16 2014-03-18 Hitachi Chemical Company, Ltd. Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
WO2013002004A1 (ja) * 2011-06-28 2013-01-03 日東電工株式会社 熱硬化型接着シート及びフレキシブル印刷回路基板
JP7318223B2 (ja) * 2019-02-05 2023-08-01 株式会社レゾナック 樹脂成形体を製造する方法、及び、シート状成形材料

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4164883B2 (ja) * 1997-08-19 2008-10-15 日立化成工業株式会社 印刷配線板用樹脂組成物及びそれを用いたプリプレグ、金属張り積層板
JP2004146754A (ja) * 2002-10-22 2004-05-20 Hitachi Kasei Polymer Co Ltd フレキシブルプリント配線板積層用接着剤組成物及び接着フィルム
JP2004197010A (ja) * 2002-12-20 2004-07-15 Hitachi Ltd 耐熱性接着剤及びその製造方法並びにそれを用いた半導体装置

Also Published As

Publication number Publication date
JP4847767B2 (ja) 2011-12-28
JP2006283002A (ja) 2006-10-19
KR20060097618A (ko) 2006-09-14

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