TW200644218A - Multi-chip module and method of manufacture - Google Patents

Multi-chip module and method of manufacture

Info

Publication number
TW200644218A
TW200644218A TW095114265A TW95114265A TW200644218A TW 200644218 A TW200644218 A TW 200644218A TW 095114265 A TW095114265 A TW 095114265A TW 95114265 A TW95114265 A TW 95114265A TW 200644218 A TW200644218 A TW 200644218A
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
chip module
manufacture
bonding pads
chip
Prior art date
Application number
TW095114265A
Other languages
English (en)
Inventor
John Yan
Yong Du
Bruce E Symons
Original Assignee
Spansion Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Spansion Llc filed Critical Spansion Llc
Publication of TW200644218A publication Critical patent/TW200644218A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/321—Disposition
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    • H01L2224/92—Specific sequence of method steps
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    • H01L2224/9222—Sequential connecting processes
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    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
TW095114265A 2005-04-27 2006-04-21 Multi-chip module and method of manufacture TW200644218A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/116,571 US7163839B2 (en) 2005-04-27 2005-04-27 Multi-chip module and method of manufacture

Publications (1)

Publication Number Publication Date
TW200644218A true TW200644218A (en) 2006-12-16

Family

ID=36595509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114265A TW200644218A (en) 2005-04-27 2006-04-21 Multi-chip module and method of manufacture

Country Status (7)

Country Link
US (1) US7163839B2 (zh)
EP (1) EP1878048A2 (zh)
JP (2) JP2008539588A (zh)
KR (1) KR101000111B1 (zh)
CN (1) CN101160656A (zh)
TW (1) TW200644218A (zh)
WO (1) WO2006115649A2 (zh)

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JP5559452B2 (ja) 2006-12-20 2014-07-23 富士通セミコンダクター株式会社 半導体装置及びその製造方法
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US20090001599A1 (en) * 2007-06-28 2009-01-01 Spansion Llc Die attachment, die stacking, and wire embedding using film
US20090051043A1 (en) * 2007-08-21 2009-02-26 Spansion Llc Die stacking in multi-die stacks using die support mechanisms
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US9698129B2 (en) 2011-03-18 2017-07-04 Johnson & Johnson Vision Care, Inc. Stacked integrated component devices with energization
US9889615B2 (en) 2011-03-18 2018-02-13 Johnson & Johnson Vision Care, Inc. Stacked integrated component media insert for an ophthalmic device
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US9715130B2 (en) 2014-08-21 2017-07-25 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form separators for biocompatible energization elements for biomedical devices
US10627651B2 (en) 2014-08-21 2020-04-21 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form biocompatible energization primary elements for biomedical devices with electroless sealing layers
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US9793536B2 (en) 2014-08-21 2017-10-17 Johnson & Johnson Vision Care, Inc. Pellet form cathode for use in a biocompatible battery
US10361405B2 (en) 2014-08-21 2019-07-23 Johnson & Johnson Vision Care, Inc. Biomedical energization elements with polymer electrolytes
US9941547B2 (en) 2014-08-21 2018-04-10 Johnson & Johnson Vision Care, Inc. Biomedical energization elements with polymer electrolytes and cavity structures
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KR101625355B1 (ko) * 2016-02-16 2016-06-07 노현일 탈착이 간편한 고무장갑
US10345620B2 (en) 2016-02-18 2019-07-09 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form biocompatible energization elements incorporating fuel cells for biomedical devices

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US7163839B2 (en) 2007-01-16
KR101000111B1 (ko) 2010-12-10
JP2008539588A (ja) 2008-11-13
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KR20070118149A (ko) 2007-12-13
WO2006115649A3 (en) 2007-06-28

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