TW200642793A - Method for severing brittle materials by lasers with asymmetric radiation density distribution - Google Patents

Method for severing brittle materials by lasers with asymmetric radiation density distribution

Info

Publication number
TW200642793A
TW200642793A TW095104982A TW95104982A TW200642793A TW 200642793 A TW200642793 A TW 200642793A TW 095104982 A TW095104982 A TW 095104982A TW 95104982 A TW95104982 A TW 95104982A TW 200642793 A TW200642793 A TW 200642793A
Authority
TW
Taiwan
Prior art keywords
radiation density
density distribution
lasers
brittle materials
asymmetric radiation
Prior art date
Application number
TW095104982A
Other languages
English (en)
Chinese (zh)
Other versions
TWI323203B (OSRAM
Inventor
Gabriele Eberhardt
Hans-Ulrich Zuehlke
Uwe Weinzierl
Vladimir Stepanovich Kondratenko
Original Assignee
Jenoptik Automatisierungstech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Automatisierungstech filed Critical Jenoptik Automatisierungstech
Publication of TW200642793A publication Critical patent/TW200642793A/zh
Application granted granted Critical
Publication of TWI323203B publication Critical patent/TWI323203B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03F—SEWERS; CESSPOOLS
    • E03F3/00—Sewer pipe-line systems
    • E03F3/06—Methods of, or installations for, laying sewer pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03F—SEWERS; CESSPOOLS
    • E03F3/00—Sewer pipe-line systems
    • E03F3/06—Methods of, or installations for, laying sewer pipes
    • E03F2003/065—Refurbishing of sewer pipes, e.g. by coating, lining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Public Health (AREA)
  • Water Supply & Treatment (AREA)
  • Hydrology & Water Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Lasers (AREA)
TW095104982A 2005-03-22 2006-02-15 Method for severing brittle materials by lasers with asymmetric radiation density distribution TW200642793A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005013783A DE102005013783B4 (de) 2005-03-22 2005-03-22 Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung

Publications (2)

Publication Number Publication Date
TW200642793A true TW200642793A (en) 2006-12-16
TWI323203B TWI323203B (OSRAM) 2010-04-11

Family

ID=36973650

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104982A TW200642793A (en) 2005-03-22 2006-02-15 Method for severing brittle materials by lasers with asymmetric radiation density distribution

Country Status (5)

Country Link
US (1) US20060213883A1 (OSRAM)
JP (1) JP2006263819A (OSRAM)
KR (1) KR20060102514A (OSRAM)
DE (1) DE102005013783B4 (OSRAM)
TW (1) TW200642793A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392550B (zh) * 2008-04-14 2013-04-11 Mitsuboshi Diamond Ind Co Ltd Method for processing brittle material substrates

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* Cited by examiner, † Cited by third party
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DE102006024825A1 (de) * 2006-05-23 2007-11-29 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Randbeschneiden eines Floatglasbandes
CA2560238A1 (en) * 2006-09-20 2008-03-20 Institut National D'optique Laser-based ablation method and optical system
US20100320249A1 (en) * 2007-02-28 2010-12-23 Claus Peter Kluge Method for producing a component using asymmetrical energy input along the parting or predetermined breaking line
TWI341242B (en) * 2007-07-31 2011-05-01 Nat Applied Res Laboratories Device for cutting brittle material
WO2011142401A1 (ja) * 2010-05-14 2011-11-17 古河電気工業株式会社 硬質ウエハ加工用粘着テープ及びそれを用いた研削方法
KR20130071417A (ko) * 2010-05-14 2013-06-28 아사히 가라스 가부시키가이샤 절단 방법 및 절단 장치
KR102088722B1 (ko) 2010-07-12 2020-03-17 로핀-시나르 테크놀로지스 엘엘씨 레이저 필라멘테이션에 의한 재료 가공 방법
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
JP6233407B2 (ja) * 2013-03-26 2017-11-22 旭硝子株式会社 ガラス板の加工方法、およびガラス板の加工装置
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
EP2953184B1 (de) * 2014-06-04 2018-08-01 Laser-Mikrotechnologie Dr. Kieburg GmbH Verfahren zum Laserschneiden von Elektrodenfolien und/oder Separatorenfolien
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
LT6428B (lt) * 2015-10-02 2017-07-25 Uab "Altechna R&D" Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション

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DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
WO1996020062A1 (en) * 1994-12-23 1996-07-04 Kondratenko Vladimir Stepanovi Method of cutting non-metallic materials and a device for carrying out said method
DE19715537C2 (de) * 1997-04-14 1999-08-05 Schott Glas Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas
DE19833368C1 (de) * 1998-07-24 2000-02-17 Schott Glas Verfahren und Vorrichtung zur Bearbeitung von Bauteilen aus sprödbrüchigen Werkstoffen
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
EP1244346A4 (en) * 2000-01-04 2005-01-12 Ruiter Seeds C V Lp De CULTIVATED TOMATO PLANTS HAVING HIGHER BRIX VALUE AND PROCESS FOR PRODUCING SUCH PLANTS
WO2001085387A1 (en) * 2000-05-11 2001-11-15 Ptg Precision Technology Center Limited Llc System for cutting brittle materials
RU2206525C2 (ru) * 2001-07-25 2003-06-20 Кондратенко Владимир Степанович Способ резки хрупких неметаллических материалов
JP3992976B2 (ja) * 2001-12-21 2007-10-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP1500484B1 (en) * 2002-03-12 2011-07-13 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392550B (zh) * 2008-04-14 2013-04-11 Mitsuboshi Diamond Ind Co Ltd Method for processing brittle material substrates

Also Published As

Publication number Publication date
KR20060102514A (ko) 2006-09-27
DE102005013783A1 (de) 2006-09-28
DE102005013783B4 (de) 2007-08-16
TWI323203B (OSRAM) 2010-04-11
US20060213883A1 (en) 2006-09-28
JP2006263819A (ja) 2006-10-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees