TW200641526A - Photosetting/thermosetting one-liquid type solder resist composite and printed wiring board using the same - Google Patents

Photosetting/thermosetting one-liquid type solder resist composite and printed wiring board using the same

Info

Publication number
TW200641526A
TW200641526A TW094145125A TW94145125A TW200641526A TW 200641526 A TW200641526 A TW 200641526A TW 094145125 A TW094145125 A TW 094145125A TW 94145125 A TW94145125 A TW 94145125A TW 200641526 A TW200641526 A TW 200641526A
Authority
TW
Taiwan
Prior art keywords
photosetting
thermosetting
solder resist
liquid type
type solder
Prior art date
Application number
TW094145125A
Other languages
English (en)
Other versions
TWI426346B (zh
Inventor
Touko Shiina
Aiko Iwasa
Yutaka Nita
Taku Nagano
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200641526A publication Critical patent/TW200641526A/zh
Application granted granted Critical
Publication of TWI426346B publication Critical patent/TWI426346B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J13/00—Details of machines for forging, pressing, or hammering
    • B21J13/02—Dies or mountings therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J13/00—Details of machines for forging, pressing, or hammering
    • B21J13/08—Accessories for handling work or tools
    • B21J13/14—Ejecting devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW094145125A 2005-01-07 2005-12-19 A photohardenable thermosetting one of the liquid solder resist compositions and a printed circuit board using the same TWI426346B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005001970A JP4649212B2 (ja) 2005-01-07 2005-01-07 光硬化性熱硬化性の一液型ソルダーレジスト組成物及びそれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
TW200641526A true TW200641526A (en) 2006-12-01
TWI426346B TWI426346B (zh) 2014-02-11

Family

ID=36797771

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145125A TWI426346B (zh) 2005-01-07 2005-12-19 A photohardenable thermosetting one of the liquid solder resist compositions and a printed circuit board using the same

Country Status (4)

Country Link
JP (1) JP4649212B2 (zh)
KR (1) KR20060081361A (zh)
CN (1) CN1800979B (zh)
TW (1) TWI426346B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI455954B (zh) * 2008-05-07 2014-10-11 Taiyo Holdings Co Ltd 填孔用熱硬化性樹脂組成物及該組成物與抗焊層形成用光硬化性熱硬化性樹脂組成物之組合單元、以及印刷電路板
JP5112944B2 (ja) * 2008-05-07 2013-01-09 太陽ホールディングス株式会社 穴埋め用熱硬化性樹脂組成物とソルダーマスク形成用光硬化性・熱硬化性樹脂組成物の組合せユニット及びプリント配線板
KR101197987B1 (ko) * 2010-08-18 2012-11-05 삼성전기주식회사 주석 합금 형성용 도금액 및 이를 이용한 주석 합금 피막의 형성방법
CN102636955A (zh) * 2011-02-10 2012-08-15 台湾永光化学工业股份有限公司 感光树脂组合物
JP5970185B2 (ja) * 2011-12-27 2016-08-17 株式会社タムラ製作所 樹脂および当該樹脂を含む感光性組成物
JP5766671B2 (ja) * 2012-09-05 2015-08-19 株式会社タムラ製作所 黒色硬化性樹脂組成物およびそれを用いたプリント配線基板
CN110402020B (zh) * 2019-08-22 2022-03-18 江苏上达电子有限公司 一种柔性印刷线路板及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08291214A (ja) * 1995-04-21 1996-11-05 Daicel Chem Ind Ltd 新規多官能エポキシ樹脂組成物およびそれを用いた光硬化性樹脂組成物
JPH08335768A (ja) * 1995-06-06 1996-12-17 Taiyo Ink Mfg Ltd アルカリ現像可能な一液型ソルダーレジスト組成物及びそれから得られるソルダーレジスト皮膜
JP3808996B2 (ja) * 1997-12-08 2006-08-16 互応化学工業株式会社 光硬化型印刷インク及びプリント配線板製造用インク
AU2002217554A1 (en) * 2001-12-28 2003-07-30 Taiyo Ink Mfg. Co., Ltd. Photosensitive resin composition and printed wiring boards
JP2003277480A (ja) * 2002-03-25 2003-10-02 Taiyo Ink Mfg Ltd 硬化性樹脂組成物及びそれを用いたプリント配線板

Also Published As

Publication number Publication date
CN1800979A (zh) 2006-07-12
JP4649212B2 (ja) 2011-03-09
CN1800979B (zh) 2014-05-14
TWI426346B (zh) 2014-02-11
JP2006190848A (ja) 2006-07-20
KR20060081361A (ko) 2006-07-12

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