TW200631185A - Electronic tag chip - Google Patents
Electronic tag chipInfo
- Publication number
- TW200631185A TW200631185A TW094146131A TW94146131A TW200631185A TW 200631185 A TW200631185 A TW 200631185A TW 094146131 A TW094146131 A TW 094146131A TW 94146131 A TW94146131 A TW 94146131A TW 200631185 A TW200631185 A TW 200631185A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic tag
- tag chip
- reduce
- soi
- diodes
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 239000012212 insulator Substances 0.000 abstract 1
- 230000003071 parasitic effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors having potential barriers
- H01L29/94—Metal-insulator-semiconductors, e.g. MOS
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0805—Capacitors only
- H01L27/0811—MIS diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/922—Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/002837 WO2006087822A1 (ja) | 2005-02-16 | 2005-02-16 | 電子タグチップ |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200631185A true TW200631185A (en) | 2006-09-01 |
Family
ID=36916238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094146131A TW200631185A (en) | 2005-02-16 | 2005-12-23 | Electronic tag chip |
Country Status (7)
Country | Link |
---|---|
US (1) | US7863718B2 (zh) |
EP (1) | EP1855315A4 (zh) |
JP (1) | JP4867915B2 (zh) |
KR (2) | KR20090127173A (zh) |
CN (1) | CN100568487C (zh) |
TW (1) | TW200631185A (zh) |
WO (1) | WO2006087822A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7298008B2 (en) * | 2006-01-20 | 2007-11-20 | International Business Machines Corporation | Electrostatic discharge protection device and method of fabricating same |
US8164933B2 (en) * | 2007-04-04 | 2012-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Power source circuit |
FR2917895B1 (fr) * | 2007-06-21 | 2010-04-09 | Commissariat Energie Atomique | Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple |
JP5155616B2 (ja) * | 2007-07-25 | 2013-03-06 | 沖プリンテッドサーキット株式会社 | Rfidタグ、rfidシステムおよびrfidタグの製造方法 |
JP5103127B2 (ja) * | 2007-10-05 | 2012-12-19 | 株式会社日立製作所 | Rfidタグ |
US8445947B2 (en) * | 2008-07-04 | 2013-05-21 | Stmicroelectronics (Rousset) Sas | Electronic circuit having a diode-connected MOS transistor with an improved efficiency |
JP5655534B2 (ja) * | 2009-12-18 | 2015-01-21 | 日本電波工業株式会社 | 電圧制御可変容量及び電圧制御発振器 |
JP5519318B2 (ja) * | 2010-02-19 | 2014-06-11 | 日立Geニュークリア・エナジー株式会社 | 芯線認識システムおよび芯線認識方法 |
JP5632663B2 (ja) * | 2010-06-29 | 2014-11-26 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9947688B2 (en) | 2011-06-22 | 2018-04-17 | Psemi Corporation | Integrated circuits with components on both sides of a selected substrate and methods of fabrication |
US9705363B2 (en) * | 2013-06-14 | 2017-07-11 | Renesas Electronics Corporation | Communication control device and mounting board |
DE102013108518B4 (de) | 2013-08-07 | 2016-11-24 | Infineon Technologies Ag | Halbleitervorrichtung und verfahren zum herstellen derselben |
US9502586B1 (en) * | 2015-09-14 | 2016-11-22 | Qualcomm Incorporated | Backside coupled symmetric varactor structure |
EP3843009A4 (en) * | 2018-08-22 | 2022-05-11 | Kyocera Corporation | RFID LABEL SUBSTRATE,RFID LABEL AND RFID SYSTEM |
CN109261477A (zh) * | 2018-10-23 | 2019-01-25 | 浙江大学 | 一种具有刻蚀孔及分块式上电极的微机电压电超声波换能器 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3850855T2 (de) * | 1987-11-13 | 1994-11-10 | Nissan Motor | Halbleitervorrichtung. |
JPH04352470A (ja) * | 1991-05-30 | 1992-12-07 | Mitsubishi Electric Corp | 半導体装置 |
JPH05129423A (ja) * | 1991-10-30 | 1993-05-25 | Rohm Co Ltd | 半導体装置及びその製造方法 |
JPH0664379A (ja) * | 1992-08-12 | 1994-03-08 | Oki Electric Ind Co Ltd | Icカードおよびその製造方法 |
KR100306988B1 (ko) * | 1992-10-26 | 2001-12-15 | 윌리엄 비. 켐플러 | 장치패키지 |
JP3254113B2 (ja) | 1994-08-30 | 2002-02-04 | セイコーインスツルメンツ株式会社 | 加速度センサ |
JPH1154548A (ja) | 1997-08-04 | 1999-02-26 | Mitsubishi Heavy Ind Ltd | 非接触タグにおけるicチップ電極接続構造 |
JP2000299440A (ja) | 1999-04-15 | 2000-10-24 | Hitachi Ltd | 電界効果トランジスタ及びそれを用いた集積化電圧発生回路 |
US6368901B2 (en) * | 1999-07-15 | 2002-04-09 | Texas Instruments Incorporated | Integrated circuit wireless tagging |
GB2352931A (en) | 1999-07-29 | 2001-02-07 | Marconi Electronic Syst Ltd | Piezoelectric tag |
JP2001230425A (ja) * | 2000-02-17 | 2001-08-24 | Seiko Epson Corp | Mosダイオード回路 |
JP4433629B2 (ja) * | 2001-03-13 | 2010-03-17 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
JP2004362190A (ja) | 2003-06-04 | 2004-12-24 | Hitachi Ltd | 半導体装置 |
JP4525002B2 (ja) | 2003-06-06 | 2010-08-18 | 株式会社日立製作所 | 無線認識半導体装置および無線認識半導体装置製造方法 |
US7271076B2 (en) * | 2003-12-19 | 2007-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
-
2005
- 2005-02-16 WO PCT/JP2005/002837 patent/WO2006087822A1/ja active Application Filing
- 2005-02-16 US US11/719,693 patent/US7863718B2/en not_active Expired - Fee Related
- 2005-02-16 JP JP2007503558A patent/JP4867915B2/ja not_active Expired - Fee Related
- 2005-02-16 KR KR1020097022202A patent/KR20090127173A/ko not_active Application Discontinuation
- 2005-02-16 KR KR1020077011370A patent/KR101029215B1/ko not_active IP Right Cessation
- 2005-02-16 CN CNB2005800398554A patent/CN100568487C/zh not_active Expired - Fee Related
- 2005-02-16 EP EP05710540A patent/EP1855315A4/en not_active Withdrawn
- 2005-12-23 TW TW094146131A patent/TW200631185A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20090140300A1 (en) | 2009-06-04 |
KR20070072595A (ko) | 2007-07-04 |
KR20090127173A (ko) | 2009-12-09 |
CN100568487C (zh) | 2009-12-09 |
JPWO2006087822A1 (ja) | 2008-07-03 |
WO2006087822A1 (ja) | 2006-08-24 |
EP1855315A1 (en) | 2007-11-14 |
KR101029215B1 (ko) | 2011-04-12 |
US7863718B2 (en) | 2011-01-04 |
EP1855315A4 (en) | 2009-05-27 |
CN101076887A (zh) | 2007-11-21 |
JP4867915B2 (ja) | 2012-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200631185A (en) | Electronic tag chip | |
HK1122906A1 (en) | Antenna structure of an integrated circuit | |
TW200715514A (en) | Semiconductor chip, display panel using the same, and methods of manufacturing semiconductor chip and display panel using the same | |
TW200802782A (en) | Chip module for complete power train | |
TW200638534A (en) | Wireless chip | |
TW200715384A (en) | Methods for manufacturing RFID tags and structures formed therefrom | |
WO2005099110A3 (en) | Radio front-end module with passive circuit elements monolithically integrated in a semiconductor substrate and with an integrated circuit connected to said substrate | |
TWI260056B (en) | Module structure having an embedded chip | |
WO2009031267A1 (ja) | Rfidタグ | |
DK1958126T3 (da) | Dobbelt chipkortsystem | |
SG157278A1 (en) | Rf devices | |
TW200703569A (en) | Memory device and manufacturing method the same | |
EP4293714A3 (en) | Power semiconductor device module | |
WO2006057820A3 (en) | Radio frequency identification (rfid) tag for an item having a conductive layer included or attached | |
TW200802791A (en) | Integrated circuit chips | |
TW200608303A (en) | External package capable of being radio-tagged | |
TW200715708A (en) | Electronic substrate, manufacturing method for electronic substrate, and electronic device | |
TW200742025A (en) | Seal-ring structure for system-level ESD protection | |
DE102006029248A1 (de) | Transponder | |
EP1821241A3 (en) | Hybrid frequency contactless transponder unit, module for and method of manufacturing | |
HK1079616A1 (en) | Semiconductor device having reduced capacitance to substrate and method | |
TW200701435A (en) | Building fully-depleted and partially-depleted transistors on same chip | |
WO2003038897A3 (de) | Elektronikbauteil, schaltungskonzept dafür und herstellungsverfahren | |
ATE470957T1 (de) | Organische halbleiterformulierung | |
ATE347149T1 (de) | Flexibles halbleiter-bauelement und identifikationsetikett |