TW200628977A - Photosensitive resin composition and photosensitive dry film by the use thereof - Google Patents

Photosensitive resin composition and photosensitive dry film by the use thereof

Info

Publication number
TW200628977A
TW200628977A TW094137318A TW94137318A TW200628977A TW 200628977 A TW200628977 A TW 200628977A TW 094137318 A TW094137318 A TW 094137318A TW 94137318 A TW94137318 A TW 94137318A TW 200628977 A TW200628977 A TW 200628977A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive
dry film
photosensitive resin
photopolymerization initiator
Prior art date
Application number
TW094137318A
Other languages
English (en)
Other versions
TWI292081B (en
Inventor
Teruhiro Uematsu
Naoya Katsumata
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200628977A publication Critical patent/TW200628977A/zh
Application granted granted Critical
Publication of TWI292081B publication Critical patent/TWI292081B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
TW094137318A 2004-11-04 2005-10-25 Photosensitive resin composition and photosensitive dry film by the use thereof TWI292081B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004320515A JP2006133378A (ja) 2004-11-04 2004-11-04 感光性樹脂組成物、およびこれを用いた感光性ドライフィルム
PCT/JP2005/019652 WO2006049049A1 (en) 2004-11-04 2005-10-19 Photosensitive resin composition and photosensitive dry film by the use thereof

Publications (2)

Publication Number Publication Date
TW200628977A true TW200628977A (en) 2006-08-16
TWI292081B TWI292081B (en) 2008-01-01

Family

ID=35720934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137318A TWI292081B (en) 2004-11-04 2005-10-25 Photosensitive resin composition and photosensitive dry film by the use thereof

Country Status (7)

Country Link
US (1) US20070264601A1 (zh)
EP (1) EP1810083A1 (zh)
JP (1) JP2006133378A (zh)
KR (1) KR100883172B1 (zh)
CN (1) CN101044434A (zh)
TW (1) TWI292081B (zh)
WO (1) WO2006049049A1 (zh)

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WO2007123357A1 (en) * 2006-04-24 2007-11-01 Kolon Industries Inc. Dry film photoresist resin composition for ldi
KR100951874B1 (ko) 2006-04-24 2010-04-12 주식회사 코오롱 Ｌｄｉ용 드라이 필름 포토레지스트 수지 조성물
CN101595406B (zh) 2007-01-12 2011-05-04 凸版印刷株式会社 着色组合物、滤色器及其制造方法
US20090270092A1 (en) * 2008-04-28 2009-10-29 Research In Motion Limited Method for Assisting a Wireless Device to Find Closed Subscriber Group Cells
US7887992B2 (en) * 2008-12-23 2011-02-15 E. I. Du Pont De Nemours And Company Photosensitive paste and process for production of pattern using the same
JP5374143B2 (ja) * 2008-12-25 2013-12-25 東京応化工業株式会社 感光性樹脂組成物及び被エッチング基体の製造方法
JP5404028B2 (ja) * 2008-12-25 2014-01-29 東京応化工業株式会社 被エッチング基体の製造方法
JP5384929B2 (ja) * 2008-12-26 2014-01-08 東京応化工業株式会社 透明電極形成用光硬化性樹脂組成物及び透明電極の製造方法
KR20100109860A (ko) * 2009-04-01 2010-10-11 도요 잉키 세이조 가부시끼가이샤 감광성 착색 조성물 및 컬러 필터
JP5320270B2 (ja) * 2009-11-25 2013-10-23 株式会社沖データ 表示パネルの製造方法
CN103365087B (zh) * 2012-03-28 2019-03-08 东京应化工业株式会社 绝缘膜形成用感光性树脂组合物、绝缘膜、以及绝缘膜的形成方法
JP6166576B2 (ja) * 2013-04-08 2017-07-19 株式会社カネカ 活性エネルギー線硬化性組成物およびその硬化物
CN104865794A (zh) * 2014-02-20 2015-08-26 上海飞凯光电材料股份有限公司 一种光刻胶
EP3054350B1 (en) 2014-12-10 2018-04-11 Goo Chemical Co., Ltd. Liquid solder resist composition and coated printed wiring board
KR102275736B1 (ko) * 2014-12-30 2021-07-09 코오롱인더스트리 주식회사 드라이 필름 포토 레지스트용 감광성 수지 조성물
CN108062176B (zh) 2016-11-09 2021-07-09 东友精细化工有限公司 触摸传感器层叠体及其制造方法
WO2018159575A1 (ja) 2017-02-28 2018-09-07 富士フイルム株式会社 インプリント用密着膜形成用組成物、密着膜、積層体、硬化物パターンの製造方法および回路基板の製造方法
KR102393376B1 (ko) * 2017-04-10 2022-05-03 삼성디스플레이 주식회사 감광성 수지 조성물 및 이를 포함한 패턴 형성용 조성물의 경화물을 포함하는 전자 장치
JP7246615B2 (ja) * 2017-12-20 2023-03-28 住友電気工業株式会社 プリント配線板の製造方法及び積層体
CN108241259B (zh) * 2018-01-24 2021-08-10 杭州福斯特电子材料有限公司 一种具有良好孔掩蔽功能可直接描绘曝光成像的抗蚀剂组合物
CN109062005B (zh) * 2018-10-30 2021-12-07 杭州福斯特电子材料有限公司 一种感光干膜
CN113759661A (zh) * 2020-06-03 2021-12-07 新应材股份有限公司 感光性树脂组合物、隔壁、光转换层以及光发射装置
TWI732580B (zh) * 2020-06-03 2021-07-01 新應材股份有限公司 感光性樹脂組成物、隔壁、光轉換層以及光發射裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4252887A (en) * 1979-08-14 1981-02-24 E. I. Du Pont De Nemours And Company Dimers derived from unsymmetrical 2,4,5-triphenylimidazole compounds as photoinitiators
DE69527840T2 (de) * 1995-01-25 2003-05-28 Mitsubishi Chem Corp Polymerisierbare zusammensetzung fuer farbfilter
US5914206A (en) * 1996-07-01 1999-06-22 Mitsubishi Chemical Corporation Color filter and black resist composition
JP4130030B2 (ja) * 1999-03-09 2008-08-06 富士フイルム株式会社 感光性組成物および１，３−ジヒドロ−１−オキソ−２ｈ−インデン誘導体化合物
JP4518651B2 (ja) * 2000-08-22 2010-08-04 大日本印刷株式会社 着色レジスト材セット及びカラーフィルタ
JP2003076015A (ja) * 2001-09-07 2003-03-14 Nichigo Morton Co Ltd 感光性樹脂組成物及びそれを用いたドライフィルム
JP4756181B2 (ja) * 2001-09-07 2011-08-24 ニチゴー・モートン株式会社 感光性樹脂組成物及びそれを用いたドライフィルム
US6994948B2 (en) * 2001-10-12 2006-02-07 E.I. Du Pont De Nemours And Company, Inc. Aqueous developable photoimageable thick film compositions
US20030124461A1 (en) * 2001-10-12 2003-07-03 Suess Terry R. Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes
JP4198363B2 (ja) * 2002-01-29 2008-12-17 富士フイルム株式会社 反射型カラーフィルタ
JP4404049B2 (ja) * 2003-03-07 2010-01-27 旭硝子株式会社 感光性樹脂組成物及びその塗膜硬化物

Also Published As

Publication number Publication date
KR100883172B1 (ko) 2009-02-10
JP2006133378A (ja) 2006-05-25
KR20070061575A (ko) 2007-06-13
TWI292081B (en) 2008-01-01
WO2006049049A1 (en) 2006-05-11
US20070264601A1 (en) 2007-11-15
CN101044434A (zh) 2007-09-26
EP1810083A1 (en) 2007-07-25

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