TW200628040A - Multi-layer circuit board and the manufacturing method of the multi-layer circuit board - Google Patents
Multi-layer circuit board and the manufacturing method of the multi-layer circuit boardInfo
- Publication number
- TW200628040A TW200628040A TW094102665A TW94102665A TW200628040A TW 200628040 A TW200628040 A TW 200628040A TW 094102665 A TW094102665 A TW 094102665A TW 94102665 A TW94102665 A TW 94102665A TW 200628040 A TW200628040 A TW 200628040A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- immersed
- going
- layer circuit
- manufacturing
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003282095A JP2005051075A (ja) | 2003-07-29 | 2003-07-29 | 多層回路基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200628040A true TW200628040A (en) | 2006-08-01 |
TWI267332B TWI267332B (en) | 2006-11-21 |
Family
ID=34267411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94102665A TWI267332B (en) | 2003-07-29 | 2005-01-28 | Multi-layer circuit board and the manufacturing method of the multi-layer circuit board |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2005051075A (zh) |
TW (1) | TWI267332B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105323956A (zh) * | 2014-05-30 | 2016-02-10 | 京瓷电路科技株式会社 | 布线基板 |
TWI666749B (zh) * | 2014-02-19 | 2019-07-21 | 矽品精密工業股份有限公司 | 封裝基板及封裝結構 |
TWI677945B (zh) * | 2017-08-29 | 2019-11-21 | 日商東芝記憶體股份有限公司 | 半導體裝置 |
CN113395817A (zh) * | 2020-03-13 | 2021-09-14 | 重庆达方电子有限公司 | 薄膜电路板 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4819033B2 (ja) * | 2005-01-27 | 2011-11-16 | パナソニック株式会社 | 多層回路基板の製造方法 |
CN103379750B (zh) * | 2012-04-27 | 2016-06-01 | 富葵精密组件(深圳)有限公司 | 多层电路板及其制作方法 |
CN103517584A (zh) * | 2012-06-27 | 2014-01-15 | 富葵精密组件(深圳)有限公司 | 多层电路板的制作方法 |
CN103517583B (zh) | 2012-06-27 | 2016-09-28 | 富葵精密组件(深圳)有限公司 | 多层电路板及其制作方法 |
CN103582320B (zh) * | 2012-07-19 | 2017-05-10 | 富葵精密组件(深圳)有限公司 | 多层线路板及其制作方法 |
CN103687306A (zh) * | 2012-09-05 | 2014-03-26 | 北大方正集团有限公司 | 一种印刷电路板及其制作方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02277286A (ja) * | 1989-04-19 | 1990-11-13 | Hitachi Ltd | 多層プリント基板 |
JPH0485991A (ja) * | 1990-07-27 | 1992-03-18 | Fujitsu Ltd | 多層プリント配線板の積層制御方法 |
JPH06177548A (ja) * | 1992-12-07 | 1994-06-24 | Hitachi Ltd | プリント配線基板 |
JPH1168314A (ja) * | 1997-08-21 | 1999-03-09 | Matsushita Electric Ind Co Ltd | 移動体通信機器 |
JPH11163539A (ja) * | 1997-11-25 | 1999-06-18 | Kyocera Corp | 多層配線基板 |
KR19990073126A (ko) * | 1999-05-26 | 1999-10-05 | 이형도 | 램버스용인쇄회로기판 |
JP2001044636A (ja) * | 1999-07-28 | 2001-02-16 | Toshiba Corp | 印刷配線基板及び印刷配線基板を内蔵した電子機器 |
JP2001144452A (ja) * | 1999-11-15 | 2001-05-25 | Nec Corp | 多層プリント基板 |
JP2002076644A (ja) * | 2000-08-28 | 2002-03-15 | Matsushita Electric Works Ltd | 多層プリント配線板 |
JP2002141675A (ja) * | 2000-11-01 | 2002-05-17 | Pfu Ltd | プリント配線板 |
JP2003086950A (ja) * | 2001-07-06 | 2003-03-20 | Matsushita Electric Works Ltd | プリント配線板 |
JP2003152336A (ja) * | 2001-11-15 | 2003-05-23 | Nec Toppan Circuit Solutions Toyama Inc | 多層プリント配線板の製造方法 |
-
2003
- 2003-07-29 JP JP2003282095A patent/JP2005051075A/ja active Pending
-
2005
- 2005-01-28 TW TW94102665A patent/TWI267332B/zh active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI666749B (zh) * | 2014-02-19 | 2019-07-21 | 矽品精密工業股份有限公司 | 封裝基板及封裝結構 |
CN105323956A (zh) * | 2014-05-30 | 2016-02-10 | 京瓷电路科技株式会社 | 布线基板 |
TWI677945B (zh) * | 2017-08-29 | 2019-11-21 | 日商東芝記憶體股份有限公司 | 半導體裝置 |
CN113395817A (zh) * | 2020-03-13 | 2021-09-14 | 重庆达方电子有限公司 | 薄膜电路板 |
Also Published As
Publication number | Publication date |
---|---|
TWI267332B (en) | 2006-11-21 |
JP2005051075A (ja) | 2005-02-24 |
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