TW200628040A - Multi-layer circuit board and the manufacturing method of the multi-layer circuit board - Google Patents

Multi-layer circuit board and the manufacturing method of the multi-layer circuit board

Info

Publication number
TW200628040A
TW200628040A TW094102665A TW94102665A TW200628040A TW 200628040 A TW200628040 A TW 200628040A TW 094102665 A TW094102665 A TW 094102665A TW 94102665 A TW94102665 A TW 94102665A TW 200628040 A TW200628040 A TW 200628040A
Authority
TW
Taiwan
Prior art keywords
circuit board
immersed
going
layer circuit
manufacturing
Prior art date
Application number
TW094102665A
Other languages
English (en)
Other versions
TWI267332B (en
Inventor
Yoji Ueda
Susumu Matsuoka
Rikiya Okimoto
Shozo Ochi
Satoru Tomekawa
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200628040A publication Critical patent/TW200628040A/zh
Application granted granted Critical
Publication of TWI267332B publication Critical patent/TWI267332B/zh

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
TW94102665A 2003-07-29 2005-01-28 Multi-layer circuit board and the manufacturing method of the multi-layer circuit board TWI267332B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003282095A JP2005051075A (ja) 2003-07-29 2003-07-29 多層回路基板およびその製造方法

Publications (2)

Publication Number Publication Date
TW200628040A true TW200628040A (en) 2006-08-01
TWI267332B TWI267332B (en) 2006-11-21

Family

ID=34267411

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94102665A TWI267332B (en) 2003-07-29 2005-01-28 Multi-layer circuit board and the manufacturing method of the multi-layer circuit board

Country Status (2)

Country Link
JP (1) JP2005051075A (zh)
TW (1) TWI267332B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105323956A (zh) * 2014-05-30 2016-02-10 京瓷电路科技株式会社 布线基板
TWI666749B (zh) * 2014-02-19 2019-07-21 矽品精密工業股份有限公司 封裝基板及封裝結構
TWI677945B (zh) * 2017-08-29 2019-11-21 日商東芝記憶體股份有限公司 半導體裝置
CN113395817A (zh) * 2020-03-13 2021-09-14 重庆达方电子有限公司 薄膜电路板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4819033B2 (ja) * 2005-01-27 2011-11-16 パナソニック株式会社 多層回路基板の製造方法
CN103379750B (zh) * 2012-04-27 2016-06-01 富葵精密组件(深圳)有限公司 多层电路板及其制作方法
CN103517584A (zh) * 2012-06-27 2014-01-15 富葵精密组件(深圳)有限公司 多层电路板的制作方法
CN103517583B (zh) 2012-06-27 2016-09-28 富葵精密组件(深圳)有限公司 多层电路板及其制作方法
CN103582320B (zh) * 2012-07-19 2017-05-10 富葵精密组件(深圳)有限公司 多层线路板及其制作方法
CN103687306A (zh) * 2012-09-05 2014-03-26 北大方正集团有限公司 一种印刷电路板及其制作方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277286A (ja) * 1989-04-19 1990-11-13 Hitachi Ltd 多層プリント基板
JPH0485991A (ja) * 1990-07-27 1992-03-18 Fujitsu Ltd 多層プリント配線板の積層制御方法
JPH06177548A (ja) * 1992-12-07 1994-06-24 Hitachi Ltd プリント配線基板
JPH1168314A (ja) * 1997-08-21 1999-03-09 Matsushita Electric Ind Co Ltd 移動体通信機器
JPH11163539A (ja) * 1997-11-25 1999-06-18 Kyocera Corp 多層配線基板
KR19990073126A (ko) * 1999-05-26 1999-10-05 이형도 램버스용인쇄회로기판
JP2001044636A (ja) * 1999-07-28 2001-02-16 Toshiba Corp 印刷配線基板及び印刷配線基板を内蔵した電子機器
JP2001144452A (ja) * 1999-11-15 2001-05-25 Nec Corp 多層プリント基板
JP2002076644A (ja) * 2000-08-28 2002-03-15 Matsushita Electric Works Ltd 多層プリント配線板
JP2002141675A (ja) * 2000-11-01 2002-05-17 Pfu Ltd プリント配線板
JP2003086950A (ja) * 2001-07-06 2003-03-20 Matsushita Electric Works Ltd プリント配線板
JP2003152336A (ja) * 2001-11-15 2003-05-23 Nec Toppan Circuit Solutions Toyama Inc 多層プリント配線板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI666749B (zh) * 2014-02-19 2019-07-21 矽品精密工業股份有限公司 封裝基板及封裝結構
CN105323956A (zh) * 2014-05-30 2016-02-10 京瓷电路科技株式会社 布线基板
TWI677945B (zh) * 2017-08-29 2019-11-21 日商東芝記憶體股份有限公司 半導體裝置
CN113395817A (zh) * 2020-03-13 2021-09-14 重庆达方电子有限公司 薄膜电路板

Also Published As

Publication number Publication date
TWI267332B (en) 2006-11-21
JP2005051075A (ja) 2005-02-24

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