TW200627602A - Method and system for sealing a substrate - Google Patents

Method and system for sealing a substrate

Info

Publication number
TW200627602A
TW200627602A TW094127977A TW94127977A TW200627602A TW 200627602 A TW200627602 A TW 200627602A TW 094127977 A TW094127977 A TW 094127977A TW 94127977 A TW94127977 A TW 94127977A TW 200627602 A TW200627602 A TW 200627602A
Authority
TW
Taiwan
Prior art keywords
substrate
mems
mems device
seal
sealing
Prior art date
Application number
TW094127977A
Other languages
English (en)
Inventor
Philip D Floyd
Original Assignee
Idc Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idc Llc filed Critical Idc Llc
Publication of TW200627602A publication Critical patent/TW200627602A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
TW094127977A 2004-09-27 2005-08-17 Method and system for sealing a substrate TW200627602A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61356904P 2004-09-27 2004-09-27
US11/089,769 US7259449B2 (en) 2004-09-27 2005-03-16 Method and system for sealing a substrate

Publications (1)

Publication Number Publication Date
TW200627602A true TW200627602A (en) 2006-08-01

Family

ID=35482112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127977A TW200627602A (en) 2004-09-27 2005-08-17 Method and system for sealing a substrate

Country Status (11)

Country Link
US (4) US7259449B2 (zh)
EP (1) EP1640325A3 (zh)
JP (1) JP4331148B2 (zh)
KR (1) KR20060092891A (zh)
AU (1) AU2005203429A1 (zh)
BR (1) BRPI0503940A (zh)
CA (1) CA2516576A1 (zh)
MX (1) MXPA05009421A (zh)
RU (1) RU2005129864A (zh)
SG (1) SG121061A1 (zh)
TW (1) TW200627602A (zh)

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US7572665B2 (en) * 2005-10-21 2009-08-11 Wisconsin Alumni Research Foundation Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same
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US20130106875A1 (en) * 2011-11-02 2013-05-02 Qualcomm Mems Technologies, Inc. Method of improving thin-film encapsulation for an electromechanical systems assembly
US20140028686A1 (en) * 2012-07-27 2014-01-30 Qualcomm Mems Technologies, Inc. Display system with thin film encapsulated inverted imod
US9249014B2 (en) * 2012-11-06 2016-02-02 Infineon Technologies Austria Ag Packaged nano-structured component and method of making a packaged nano-structured component
RU2561195C2 (ru) * 2012-12-26 2015-08-27 Открытое акционерное общество "Центральный научно-исследовательский институт измерительной аппаратуры" Устройство мембранного типа
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