TW200626020A - Ring mechanism, and plasma processor using the ring mechanism - Google Patents

Ring mechanism, and plasma processor using the ring mechanism

Info

Publication number
TW200626020A
TW200626020A TW095107948A TW95107948A TW200626020A TW 200626020 A TW200626020 A TW 200626020A TW 095107948 A TW095107948 A TW 095107948A TW 95107948 A TW95107948 A TW 95107948A TW 200626020 A TW200626020 A TW 200626020A
Authority
TW
Taiwan
Prior art keywords
ring mechanism
focus ring
ring
plasma
wafer
Prior art date
Application number
TW095107948A
Other languages
English (en)
Chinese (zh)
Other versions
TWI301730B (https=
Inventor
Akira Koshiishi
Mitsuru Hashimoto
Hideaki Tanaka
Shigeru Tahara
Kunihiko Hinata
Jun Ooyabu
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002027630A external-priority patent/JP4209618B2/ja
Priority claimed from JP2002058833A external-priority patent/JP2003257935A/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200626020A publication Critical patent/TW200626020A/zh
Application granted granted Critical
Publication of TWI301730B publication Critical patent/TWI301730B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/915—Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW095107948A 2001-12-13 2002-12-12 Ring mechanism, and plasma processor using the ring mechanism TW200626020A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001379375 2001-12-13
JP2002027630A JP4209618B2 (ja) 2002-02-05 2002-02-05 プラズマ処理装置及びリング部材
JP2002058833A JP2003257935A (ja) 2002-03-05 2002-03-05 プラズマ処理装置

Publications (2)

Publication Number Publication Date
TW200626020A true TW200626020A (en) 2006-07-16
TWI301730B TWI301730B (https=) 2008-10-01

Family

ID=27347947

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095107948A TW200626020A (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processor using the ring mechanism
TW091135997A TWI272877B (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW091135997A TWI272877B (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism

Country Status (4)

Country Link
US (1) US7882800B2 (https=)
AU (1) AU2002366921A1 (https=)
TW (2) TW200626020A (https=)
WO (1) WO2003054947A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI704655B (zh) * 2015-09-11 2020-09-11 美商應用材料股份有限公司 用於減少基板附近的電場影響之單件式處理套組屏蔽

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TWI704655B (zh) * 2015-09-11 2020-09-11 美商應用材料股份有限公司 用於減少基板附近的電場影響之單件式處理套組屏蔽

Also Published As

Publication number Publication date
US20050005859A1 (en) 2005-01-13
AU2002366921A1 (en) 2003-07-09
TWI301730B (https=) 2008-10-01
WO2003054947A1 (fr) 2003-07-03
TW200302035A (en) 2003-07-16
US7882800B2 (en) 2011-02-08
TWI272877B (en) 2007-02-01

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