TW200626020A - Ring mechanism, and plasma processor using the ring mechanism - Google Patents

Ring mechanism, and plasma processor using the ring mechanism

Info

Publication number
TW200626020A
TW200626020A TW095107948A TW95107948A TW200626020A TW 200626020 A TW200626020 A TW 200626020A TW 095107948 A TW095107948 A TW 095107948A TW 95107948 A TW95107948 A TW 95107948A TW 200626020 A TW200626020 A TW 200626020A
Authority
TW
Taiwan
Prior art keywords
ring mechanism
focus ring
ring
plasma
wafer
Prior art date
Application number
TW095107948A
Other languages
English (en)
Chinese (zh)
Other versions
TWI301730B (enExample
Inventor
Akira Koshiishi
Mitsuru Hashimoto
Hideaki Tanaka
Shigeru Tahara
Kunihiko Hinata
Jun Ooyabu
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002027630A external-priority patent/JP4209618B2/ja
Priority claimed from JP2002058833A external-priority patent/JP2003257935A/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200626020A publication Critical patent/TW200626020A/zh
Application granted granted Critical
Publication of TWI301730B publication Critical patent/TWI301730B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/915—Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW095107948A 2001-12-13 2002-12-12 Ring mechanism, and plasma processor using the ring mechanism TW200626020A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001379375 2001-12-13
JP2002027630A JP4209618B2 (ja) 2002-02-05 2002-02-05 プラズマ処理装置及びリング部材
JP2002058833A JP2003257935A (ja) 2002-03-05 2002-03-05 プラズマ処理装置

Publications (2)

Publication Number Publication Date
TW200626020A true TW200626020A (en) 2006-07-16
TWI301730B TWI301730B (enExample) 2008-10-01

Family

ID=27347947

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095107948A TW200626020A (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processor using the ring mechanism
TW091135997A TWI272877B (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW091135997A TWI272877B (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism

Country Status (4)

Country Link
US (1) US7882800B2 (enExample)
AU (1) AU2002366921A1 (enExample)
TW (2) TW200626020A (enExample)
WO (1) WO2003054947A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI704655B (zh) * 2015-09-11 2020-09-11 美商應用材料股份有限公司 用於減少基板附近的電場影響之單件式處理套組屏蔽

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Publication number Priority date Publication date Assignee Title
TWI704655B (zh) * 2015-09-11 2020-09-11 美商應用材料股份有限公司 用於減少基板附近的電場影響之單件式處理套組屏蔽

Also Published As

Publication number Publication date
US7882800B2 (en) 2011-02-08
WO2003054947A1 (fr) 2003-07-03
US20050005859A1 (en) 2005-01-13
TWI301730B (enExample) 2008-10-01
TW200302035A (en) 2003-07-16
TWI272877B (en) 2007-02-01
AU2002366921A1 (en) 2003-07-09

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