AU2002366921A1 - Ring mechanism, and plasma processing device using the ring mechanism - Google Patents

Ring mechanism, and plasma processing device using the ring mechanism

Info

Publication number
AU2002366921A1
AU2002366921A1 AU2002366921A AU2002366921A AU2002366921A1 AU 2002366921 A1 AU2002366921 A1 AU 2002366921A1 AU 2002366921 A AU2002366921 A AU 2002366921A AU 2002366921 A AU2002366921 A AU 2002366921A AU 2002366921 A1 AU2002366921 A1 AU 2002366921A1
Authority
AU
Australia
Prior art keywords
ring mechanism
processing device
plasma processing
ring
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002366921A
Other languages
English (en)
Inventor
Mitsuru Hashimoto
Kunihiko Hinata
Akira Koshiishi
Jun Ooyabu
Shigeru Tahara
Hideaki Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002027630A external-priority patent/JP4209618B2/ja
Priority claimed from JP2002058833A external-priority patent/JP2003257935A/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2002366921A1 publication Critical patent/AU2002366921A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/915—Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
AU2002366921A 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism Abandoned AU2002366921A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2001379375 2001-12-13
JP2001-379375 2001-12-13
JP2002027630A JP4209618B2 (ja) 2002-02-05 2002-02-05 プラズマ処理装置及びリング部材
JP2002-27630 2002-02-05
JP2002-58833 2002-03-05
JP2002058833A JP2003257935A (ja) 2002-03-05 2002-03-05 プラズマ処理装置
PCT/JP2002/013016 WO2003054947A1 (fr) 2001-12-13 2002-12-12 Mecanisme en anneau, et dispositif de traitement de plasma utilisant ce mecanisme en anneau

Publications (1)

Publication Number Publication Date
AU2002366921A1 true AU2002366921A1 (en) 2003-07-09

Family

ID=27347947

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002366921A Abandoned AU2002366921A1 (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism

Country Status (4)

Country Link
US (1) US7882800B2 (enExample)
AU (1) AU2002366921A1 (enExample)
TW (2) TW200626020A (enExample)
WO (1) WO2003054947A1 (enExample)

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CN118380375A (zh) 2017-11-21 2024-07-23 朗姆研究公司 底部边缘环和中部边缘环
TWI848010B (zh) * 2018-10-18 2024-07-11 美商蘭姆研究公司 用於斜面蝕刻器的下電漿排除區域環
US11094511B2 (en) * 2018-11-13 2021-08-17 Applied Materials, Inc. Processing chamber with substrate edge enhancement processing
KR102244438B1 (ko) * 2018-12-17 2021-04-27 어드밴스드 마이크로 패브리케이션 이큅먼트 인코퍼레이티드. 차이나 플라즈마 처리 장치에 사용되는 rf 전극 조립품 및 플라즈마 처리 장치
KR102647177B1 (ko) * 2019-02-11 2024-03-15 삼성전자주식회사 플라즈마 처리 장치
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KR102731053B1 (ko) * 2020-03-19 2024-11-15 삼성전자주식회사 기판 처리 장치
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CN113496862B (zh) * 2020-04-02 2024-09-06 中微半导体设备(上海)股份有限公司 等离子体反应器及其射频功率分布调节方法
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Also Published As

Publication number Publication date
TWI301730B (enExample) 2008-10-01
US20050005859A1 (en) 2005-01-13
TW200626020A (en) 2006-07-16
US7882800B2 (en) 2011-02-08
TWI272877B (en) 2007-02-01
WO2003054947A1 (fr) 2003-07-03
TW200302035A (en) 2003-07-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase