TW200619016A - Process for preparing metallized ceramic substrate - Google Patents

Process for preparing metallized ceramic substrate

Info

Publication number
TW200619016A
TW200619016A TW094144202A TW94144202A TW200619016A TW 200619016 A TW200619016 A TW 200619016A TW 094144202 A TW094144202 A TW 094144202A TW 94144202 A TW94144202 A TW 94144202A TW 200619016 A TW200619016 A TW 200619016A
Authority
TW
Taiwan
Prior art keywords
ceramic substrate
paste layer
forming
metallized ceramic
conductive paste
Prior art date
Application number
TW094144202A
Other languages
English (en)
Inventor
Yasuyuki Yamamoto
Masakatsu Maeda
Kunihiro Gotoh
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of TW200619016A publication Critical patent/TW200619016A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C04B41/90—Coating or impregnation for obtaining at least two superposed coatings having different compositions at least one coating being a metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW094144202A 2004-12-15 2005-12-14 Process for preparing metallized ceramic substrate TW200619016A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004363004 2004-12-15
JP2005123616A JP4731976B2 (ja) 2004-12-15 2005-04-21 メタライズドセラミック基板の製造方法

Publications (1)

Publication Number Publication Date
TW200619016A true TW200619016A (en) 2006-06-16

Family

ID=36587848

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144202A TW200619016A (en) 2004-12-15 2005-12-14 Process for preparing metallized ceramic substrate

Country Status (5)

Country Link
EP (1) EP1829848A4 (zh)
JP (1) JP4731976B2 (zh)
KR (1) KR101022723B1 (zh)
TW (1) TW200619016A (zh)
WO (1) WO2006064793A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512910B (zh) * 2010-03-02 2015-12-11 Tokuyama Corp 金屬化基板之製造方法
US9301390B2 (en) 2009-03-30 2016-03-29 Tokuyama Corporation Process for producing metallized substrate, and metallized substrate

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7876053B2 (en) * 2004-06-21 2011-01-25 Tokuyama Corporation Nitride sintered body and method for manufacturing thereof
JP5059478B2 (ja) 2007-04-26 2012-10-24 日本電波工業株式会社 表面実装用の圧電発振器及び圧電振動子
KR100896601B1 (ko) * 2007-11-05 2009-05-08 삼성전기주식회사 무수축 세라믹 기판의 제조방법 및 이를 이용한 무수축세라믹 기판
JP5052380B2 (ja) * 2008-03-27 2012-10-17 京セラ株式会社 セラミック配線基板の製造方法
JP5213494B2 (ja) * 2008-03-27 2013-06-19 京セラ株式会社 セラミック基板の製造方法
JP4980439B2 (ja) 2010-03-02 2012-07-18 株式会社トクヤマ メタライズドセラミック基板の製造方法
JP5388946B2 (ja) * 2010-05-18 2014-01-15 株式会社トクヤマ メタライズド窒化アルミニウム基板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4876059A (zh) * 1972-01-14 1973-10-13
JP3697277B2 (ja) * 1994-10-25 2005-09-21 株式会社東芝 セラミックス基板およびその製造方法
JPH09221375A (ja) * 1996-02-14 1997-08-26 Sumitomo Metal Ind Ltd セラミックス基板及びその製造方法
JPH11349390A (ja) * 1998-04-10 1999-12-21 Taiheiyo Cement Corp メタライズ層及びその形成方法
JP2000138428A (ja) * 1998-10-30 2000-05-16 Kyocera Corp 配線基板
JP4950379B2 (ja) * 2000-12-21 2012-06-13 株式会社東芝 ＡｌＮメタライズ基板およびその製造方法
JP2004335508A (ja) * 2003-04-30 2004-11-25 Ngk Spark Plug Co Ltd セラミック配線基板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9301390B2 (en) 2009-03-30 2016-03-29 Tokuyama Corporation Process for producing metallized substrate, and metallized substrate
TWI512910B (zh) * 2010-03-02 2015-12-11 Tokuyama Corp 金屬化基板之製造方法
US9374893B2 (en) 2010-03-02 2016-06-21 Tokuyama Corporation Production method of metallized substrate

Also Published As

Publication number Publication date
EP1829848A4 (en) 2011-04-06
KR20070088743A (ko) 2007-08-29
JP2006196854A (ja) 2006-07-27
JP4731976B2 (ja) 2011-07-27
KR101022723B1 (ko) 2011-03-22
WO2006064793A1 (ja) 2006-06-22
EP1829848A1 (en) 2007-09-05

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