TW200618087A - Tape pasting equipment, mounting equipment, and mounting method - Google Patents
Tape pasting equipment, mounting equipment, and mounting methodInfo
- Publication number
- TW200618087A TW200618087A TW094129102A TW94129102A TW200618087A TW 200618087 A TW200618087 A TW 200618087A TW 094129102 A TW094129102 A TW 094129102A TW 94129102 A TW94129102 A TW 94129102A TW 200618087 A TW200618087 A TW 200618087A
- Authority
- TW
- Taiwan
- Prior art keywords
- equipment
- mounting
- tape
- tape pasting
- area
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004258078A JP4723216B2 (ja) | 2004-09-06 | 2004-09-06 | テープ貼付装置、マウント装置及びマウント方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200618087A true TW200618087A (en) | 2006-06-01 |
Family
ID=36036241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094129102A TW200618087A (en) | 2004-09-06 | 2005-08-25 | Tape pasting equipment, mounting equipment, and mounting method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4723216B2 (zh) |
TW (1) | TW200618087A (zh) |
WO (1) | WO2006027953A1 (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4884075B2 (ja) * | 2006-05-22 | 2012-02-22 | 株式会社東京精密 | テープ貼付方法およびテープ貼付装置 |
JP4637057B2 (ja) * | 2006-05-25 | 2011-02-23 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP2007313765A (ja) * | 2006-05-26 | 2007-12-06 | Lintec Corp | 積層シート製造装置および積層シート製造方法 |
JP4787713B2 (ja) * | 2006-10-10 | 2011-10-05 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP4616231B2 (ja) * | 2006-10-30 | 2011-01-19 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP4913550B2 (ja) * | 2006-11-07 | 2012-04-11 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP5002267B2 (ja) | 2007-01-15 | 2012-08-15 | 株式会社新川 | ダイボンダとダイボンダの熱圧着テープ片切り出し及び貼り付け方法及びプログラム |
JP4713541B2 (ja) * | 2007-06-04 | 2011-06-29 | リンテック株式会社 | シート貼付装置 |
JP4801018B2 (ja) * | 2007-07-31 | 2011-10-26 | リンテック株式会社 | シート貼付装置 |
JP5139004B2 (ja) * | 2007-08-21 | 2013-02-06 | リンテック株式会社 | シート切断装置 |
JP4922140B2 (ja) * | 2007-12-03 | 2012-04-25 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP5412260B2 (ja) * | 2009-12-10 | 2014-02-12 | 日東電工株式会社 | 粘着テープ貼付け方法およびこれを用いた装置 |
US8574398B2 (en) * | 2010-05-27 | 2013-11-05 | Suss Microtec Lithography, Gmbh | Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers |
JP2014017357A (ja) * | 2012-07-09 | 2014-01-30 | Nitto Denko Corp | 粘着テープ、粘着テープの貼付け方法および粘着テープ貼付け装置 |
JP5981822B2 (ja) * | 2012-09-27 | 2016-08-31 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
JP6054466B2 (ja) * | 2015-05-15 | 2016-12-27 | リンテック株式会社 | シート製造装置 |
JP6848258B2 (ja) * | 2015-12-25 | 2021-03-24 | 東洋製罐株式会社 | ロール加工装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57138151A (en) * | 1981-02-20 | 1982-08-26 | Shinkawa Ltd | Bonding method for tape |
WO1999004432A1 (en) * | 1997-07-18 | 1999-01-28 | Hitachi Chemical Company, Ltd. | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame |
JP3618080B2 (ja) * | 2000-11-14 | 2005-02-09 | リンテック株式会社 | ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法 |
JP3701221B2 (ja) * | 2001-08-27 | 2005-09-28 | 株式会社 日立インダストリイズ | フィルムラミネート方法とその装置 |
-
2004
- 2004-09-06 JP JP2004258078A patent/JP4723216B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-24 WO PCT/JP2005/015317 patent/WO2006027953A1/ja active Application Filing
- 2005-08-25 TW TW094129102A patent/TW200618087A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006027953A1 (ja) | 2006-03-16 |
JP4723216B2 (ja) | 2011-07-13 |
JP2006073920A (ja) | 2006-03-16 |
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