TW200616061A - Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed thereby - Google Patents

Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed thereby

Info

Publication number
TW200616061A
TW200616061A TW094130132A TW94130132A TW200616061A TW 200616061 A TW200616061 A TW 200616061A TW 094130132 A TW094130132 A TW 094130132A TW 94130132 A TW94130132 A TW 94130132A TW 200616061 A TW200616061 A TW 200616061A
Authority
TW
Taiwan
Prior art keywords
laser beam
semiconductor wafer
beam processing
scribe lines
production
Prior art date
Application number
TW094130132A
Other languages
English (en)
Other versions
TWI280616B (en
Inventor
Tsuyoshi Kida
Original Assignee
Nec Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Electronics Corp filed Critical Nec Electronics Corp
Publication of TW200616061A publication Critical patent/TW200616061A/zh
Application granted granted Critical
Publication of TWI280616B publication Critical patent/TWI280616B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
TW094130132A 2004-09-02 2005-09-02 Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed thereby TWI280616B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004255131A JP4741822B2 (ja) 2004-09-02 2004-09-02 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200616061A true TW200616061A (en) 2006-05-16
TWI280616B TWI280616B (en) 2007-05-01

Family

ID=35943871

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130132A TWI280616B (en) 2004-09-02 2005-09-02 Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed thereby

Country Status (5)

Country Link
US (3) US7545024B2 (zh)
JP (1) JP4741822B2 (zh)
KR (1) KR100751550B1 (zh)
CN (1) CN100587914C (zh)
TW (1) TWI280616B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404153B (zh) * 2006-06-23 2013-08-01 Disco Corp 晶圓之加工結果管理方法

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US7510950B2 (en) * 2005-06-30 2009-03-31 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7465596B2 (en) * 2005-06-30 2008-12-16 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
JP2008003577A (ja) * 2006-05-25 2008-01-10 Canon Inc 画像表示装置の製造方法および分断方法
JP5000944B2 (ja) * 2006-08-02 2012-08-15 株式会社ディスコ レーザー加工装置のアライメント方法
US20080070378A1 (en) * 2006-09-19 2008-03-20 Jong-Souk Yeo Dual laser separation of bonded wafers
DE102007004953A1 (de) * 2007-01-26 2008-07-31 Tesa Ag Heizelement
JP4840174B2 (ja) * 2007-02-08 2011-12-21 パナソニック株式会社 半導体チップの製造方法
JP4840200B2 (ja) * 2007-03-09 2011-12-21 パナソニック株式会社 半導体チップの製造方法
JP5309728B2 (ja) * 2008-06-27 2013-10-09 富士通セミコンダクター株式会社 レチクルデータ作成方法及びレチクルデータ作成装置
JP2011155294A (ja) * 2011-04-04 2011-08-11 Renesas Electronics Corp 半導体装置の製造方法
US20120322235A1 (en) * 2011-06-15 2012-12-20 Wei-Sheng Lei Wafer dicing using hybrid galvanic laser scribing process with plasma etch
JP6248401B2 (ja) 2013-03-19 2017-12-20 富士電機株式会社 半導体装置の製造方法およびそれに用いられる露光マスク
EP2957378A1 (de) 2014-06-16 2015-12-23 Synova SA Bearbeitungskopf zum Einkopplen eines Laserstrahles in einem Flüssigkeitsstrahl mit einer Flüssigkeitschnittstelle
BR112015029057A2 (pt) * 2014-12-22 2017-09-26 Intel Corp substrato de múltiplas camadas para empacotamento de semicondutor
US11011394B2 (en) * 2017-11-21 2021-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for annealing die and wafer
JP6584567B1 (ja) 2018-03-30 2019-10-02 キヤノン株式会社 リソグラフィ装置、パターン形成方法及び物品の製造方法
CN109732213A (zh) * 2019-03-19 2019-05-10 深圳市升达康科技有限公司 一种用于与stm设备相连的pcb激光打标机
US20220325433A1 (en) * 2019-06-27 2022-10-13 Khalifa University of Science and Technology An additive fabrication method of transparent rock micromodels with in-situ mineral coating
WO2021016384A1 (en) * 2019-07-22 2021-01-28 Massachusetts Institute Of Technology Flexing semiconductor structures and related techniques
JP6828107B2 (ja) * 2019-08-30 2021-02-10 キヤノン株式会社 リソグラフィ装置、パターン形成方法及び物品の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404153B (zh) * 2006-06-23 2013-08-01 Disco Corp 晶圓之加工結果管理方法

Also Published As

Publication number Publication date
CN1744284A (zh) 2006-03-08
US20060046435A1 (en) 2006-03-02
US20080113494A1 (en) 2008-05-15
US7545024B2 (en) 2009-06-09
CN100587914C (zh) 2010-02-03
US7829439B2 (en) 2010-11-09
TWI280616B (en) 2007-05-01
KR100751550B1 (ko) 2007-08-23
JP2006073779A (ja) 2006-03-16
JP4741822B2 (ja) 2011-08-10
US20080099454A1 (en) 2008-05-01
KR20060050935A (ko) 2006-05-19

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MM4A Annulment or lapse of patent due to non-payment of fees