TW200614298A - Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards - Google Patents

Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards

Info

Publication number
TW200614298A
TW200614298A TW094119163A TW94119163A TW200614298A TW 200614298 A TW200614298 A TW 200614298A TW 094119163 A TW094119163 A TW 094119163A TW 94119163 A TW94119163 A TW 94119163A TW 200614298 A TW200614298 A TW 200614298A
Authority
TW
Taiwan
Prior art keywords
printed circuit
thick
circuit boards
capacitors
film capacitors
Prior art date
Application number
TW094119163A
Other languages
English (en)
Inventor
William J Borland
Saul Ferguson
Hena Pyada
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200614298A publication Critical patent/TW200614298A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW094119163A 2004-07-01 2005-06-10 Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards TW200614298A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/882,820 US7100277B2 (en) 2004-07-01 2004-07-01 Methods of forming printed circuit boards having embedded thick film capacitors

Publications (1)

Publication Number Publication Date
TW200614298A true TW200614298A (en) 2006-05-01

Family

ID=34936202

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119163A TW200614298A (en) 2004-07-01 2005-06-10 Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards

Country Status (6)

Country Link
US (2) US7100277B2 (zh)
EP (1) EP1612818A1 (zh)
JP (1) JP2006019749A (zh)
KR (1) KR20060048739A (zh)
CN (1) CN1716480A (zh)
TW (1) TW200614298A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482183B (zh) * 2012-12-04 2015-04-21 Samsung Electro Mech 嵌入式多層陶瓷電子組件及其製造方法，以及具有嵌入式多層陶瓷電子組件於其內的印刷電路板

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005327932A (ja) * 2004-05-14 2005-11-24 Shinko Electric Ind Co Ltd 多層配線基板及びその製造方法
KR100619367B1 (ko) * 2004-08-26 2006-09-08 삼성전기주식회사 고유전율을 갖는 커패시터를 내장한 인쇄회로기판 및 그제조 방법
JP3816508B2 (ja) * 2004-11-04 2006-08-30 三井金属鉱業株式会社 キャパシタ層形成材及びそのキャパシタ層形成材を用いて得られる内蔵キャパシタ層を備えたプリント配線板
KR100645625B1 (ko) * 2004-12-01 2006-11-15 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
US20060120015A1 (en) * 2004-12-02 2006-06-08 Borland William J Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
US20060141225A1 (en) * 2004-12-28 2006-06-29 Borland William J Oxygen doped firing of barium titanate on copper foil
US20080289866A1 (en) * 2004-12-28 2008-11-27 Ngk Spark Plug Co., Ltd. Wiring Board and Wiring Board Manufacturing Method
US7138068B2 (en) * 2005-03-21 2006-11-21 Motorola, Inc. Printed circuit patterned embedded capacitance layer
US20060228817A1 (en) * 2005-04-07 2006-10-12 Ho-Ching Yang Dispensable capacitor manufacturing process
JP2007142109A (ja) * 2005-11-17 2007-06-07 Tdk Corp 電子部品
TWI296910B (en) * 2005-12-27 2008-05-11 Phoenix Prec Technology Corp Substrate structure with capacitance component embedded therein and method for fabricating the same
US7444727B2 (en) * 2006-03-10 2008-11-04 Motorola, Inc. Method for forming multi-layer embedded capacitors on a printed circuit board
JP4950542B2 (ja) * 2006-04-07 2012-06-13 岩手東芝エレクトロニクス株式会社 固体撮像装置およびその製造方法
US20070291440A1 (en) * 2006-06-15 2007-12-20 Dueber Thomas E Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components
US7336501B2 (en) * 2006-06-26 2008-02-26 Ibiden Co., Ltd. Wiring board with built-in capacitor
TW200810043A (en) * 2006-08-04 2008-02-16 Phoenix Prec Technology Corp Circuit board structure with capacitor embedded therein and method for fabricating the same
US20080037198A1 (en) * 2006-08-10 2008-02-14 Borland William J Methods of forming individual formed-on-foil thin capacitors for embedding inside printed wiring boards and semiconductor packages
KR100878414B1 (ko) * 2006-10-27 2009-01-13 삼성전기주식회사 캐패시터 내장형 인쇄회로기판 및 제조방법
TWI333684B (en) * 2006-11-07 2010-11-21 Unimicron Technology Corp Package substrate having embedded capacitor
US7818855B2 (en) * 2006-11-10 2010-10-26 E. I. Du Pont De Nemours And Company Method of making thin-film capacitors on metal foil using thick top electrodes
CN101617573A (zh) 2006-12-12 2009-12-30 E.I.内穆尔杜邦公司 复合有机包封材料
US7738257B2 (en) * 2006-12-13 2010-06-15 Intel Corporation Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same
US7685687B2 (en) * 2007-01-22 2010-03-30 E. I. Du Pont De Nemours And Company Methods of making high capacitance density ceramic capacitors
US8059423B2 (en) * 2007-02-06 2011-11-15 Sanmina-Sci Corporation Enhanced localized distributive capacitance for circuit boards
JP4843555B2 (ja) * 2007-05-11 2011-12-21 矢崎総業株式会社 部品固定方法
US20100024210A1 (en) * 2007-07-31 2010-02-04 Harris Corporation Product Optimization Process for Embedded Passives
US7679926B2 (en) * 2007-08-22 2010-03-16 Taiwan Semiconductor Manfacturing Company, Ltd. Capacitors with insulating layer having embedded dielectric rods
JP2009094333A (ja) * 2007-10-10 2009-04-30 Nippon Mektron Ltd キャパシタを内蔵したプリント配線板およびその製造方法
DE102008004470A1 (de) * 2007-12-05 2009-06-10 Rohde & Schwarz Gmbh & Co. Kg Elektrische Schaltungsanordnung mit konzentrierten Elementen in Mehrlagensubstraten
US8730647B2 (en) * 2008-02-07 2014-05-20 Ibiden Co., Ltd. Printed wiring board with capacitor
US20090223700A1 (en) * 2008-03-05 2009-09-10 Honeywell International Inc. Thin flexible circuits
US8470680B2 (en) * 2008-07-28 2013-06-25 Kemet Electronics Corporation Substrate with embedded patterned capacitance
US8022785B2 (en) * 2008-12-03 2011-09-20 Arcom Digital, Llc Step attenuator circuit with improved insertion loss
US8786049B2 (en) 2009-07-23 2014-07-22 Proteus Digital Health, Inc. Solid-state thin-film capacitor
US8756778B2 (en) * 2009-10-01 2014-06-24 Stmicroelectronics Sa Method of adjustment during manufacture of a circuit having a capacitor
JP5659592B2 (ja) * 2009-11-13 2015-01-28 ソニー株式会社 印刷回路基板の製造方法
JP5429019B2 (ja) * 2010-04-16 2014-02-26 富士通株式会社 キャパシタ及びその製造方法
CN101923911B (zh) * 2010-04-27 2011-11-02 电子科技大学 基于不锈钢基板的ybco厚膜电阻浆料及其制备方法
FR2963478B1 (fr) 2010-07-27 2013-06-28 St Microelectronics Grenoble 2 Dispositif semi-conducteur comprenant un composant passif de condensateurs et procede pour sa fabrication.
CN102458034A (zh) * 2010-10-19 2012-05-16 鸿富锦精密工业（深圳）有限公司 印刷电路板
US9955568B2 (en) * 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
US20160048595A1 (en) * 2014-08-12 2016-02-18 Lenovo (Singapore) Pte. Ltd. Filtering Content Suggestions for Multiple Users
CN106162477B (zh) * 2016-07-18 2020-01-03 瑞声科技(新加坡)有限公司 一种埋容结构、埋容结构的制作方法和mems麦克风
JP7080579B2 (ja) * 2016-12-02 2022-06-06 凸版印刷株式会社 電子部品製造方法
JP2019175968A (ja) * 2018-03-28 2019-10-10 富士通株式会社 回路基板及び回路基板の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4190854A (en) 1978-02-15 1980-02-26 National Semiconductor Corporation Trim structure for integrated capacitors
JPS60253207A (ja) * 1984-05-30 1985-12-13 株式会社東芝 コンデンサの製造方法
JPH02153589A (ja) 1988-12-05 1990-06-13 Ibiden Co Ltd 厚膜素子付プリント配線板
US5736681A (en) * 1993-09-03 1998-04-07 Kabushiki Kaisha Toshiba Printed wiring board having an interconnection penetrating an insulating layer
JP3460347B2 (ja) * 1994-03-30 2003-10-27 松下電器産業株式会社 半導体装置の製造方法
DE69529000T2 (de) * 1994-03-30 2003-08-21 Matsushita Electric Ind Co Ltd Verfahren zur Herstellung von Halbleitervorrichtungen mit eingebautem Kondensator
US5822175A (en) * 1995-04-13 1998-10-13 Matsushita Electronics Corporation Encapsulated capacitor structure having a dielectric interlayer
US5920454A (en) * 1997-02-11 1999-07-06 Hokuriko Electric Industry Co., Ltd. Capacitor-mounted circuit board
US6005197A (en) * 1997-08-25 1999-12-21 Lucent Technologies Inc. Embedded thin film passive components
US6631551B1 (en) 1998-06-26 2003-10-14 Delphi Technologies, Inc. Method of forming integral passive electrical components on organic circuit board substrates
JP3127908B2 (ja) * 1998-11-20 2001-01-29 日本電気株式会社 半導体装置の製造方法
EP1014399B1 (en) * 1998-12-22 2006-05-17 Matsushita Electric Industrial Co., Ltd. Flexible thin film capacitor and method for producing the same
US6349456B1 (en) * 1998-12-31 2002-02-26 Motorola, Inc. Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes
US6317023B1 (en) 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
JP3964085B2 (ja) 1999-12-09 2007-08-22 大日本印刷株式会社 プリント配線基板、及びプリント配線基板の製造方法
US6284590B1 (en) * 2000-11-30 2001-09-04 Chartered Semiconductor Manufacturing Ltd. Method to eliminate top metal corner shaping during bottom metal patterning for MIM capacitors
US6495413B2 (en) * 2001-02-28 2002-12-17 Ramtron International Corporation Structure for masking integrated capacitors of particular utility for ferroelectric memory integrated circuits
JP3946578B2 (ja) 2001-06-05 2007-07-18 大日本印刷株式会社 受動素子を備えた配線板の製造方法、受動素子を備えた配線板
EP1265466A3 (en) 2001-06-05 2004-07-21 Dai Nippon Printing Co., Ltd. Method for fabrication wiring board provided with passive element and wiring board provided with passive element
US6860000B2 (en) 2002-02-15 2005-03-01 E.I. Du Pont De Nemours And Company Method to embed thick film components
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
KR100455891B1 (ko) * 2002-12-24 2004-11-06 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
US7029971B2 (en) * 2003-07-17 2006-04-18 E. I. Du Pont De Nemours And Company Thin film dielectrics for capacitors and methods of making thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482183B (zh) * 2012-12-04 2015-04-21 Samsung Electro Mech 嵌入式多層陶瓷電子組件及其製造方法，以及具有嵌入式多層陶瓷電子組件於其內的印刷電路板

Also Published As

Publication number Publication date
US20060002097A1 (en) 2006-01-05
CN1716480A (zh) 2006-01-04
US7100277B2 (en) 2006-09-05
US20060254812A1 (en) 2006-11-16
EP1612818A1 (en) 2006-01-04
KR20060048739A (ko) 2006-05-18
JP2006019749A (ja) 2006-01-19

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