TW200610647A - Printed circuit board material for embedded passive devices - Google Patents

Printed circuit board material for embedded passive devices

Info

Publication number
TW200610647A
TW200610647A TW093136680A TW93136680A TW200610647A TW 200610647 A TW200610647 A TW 200610647A TW 093136680 A TW093136680 A TW 093136680A TW 93136680 A TW93136680 A TW 93136680A TW 200610647 A TW200610647 A TW 200610647A
Authority
TW
Taiwan
Prior art keywords
circuit board
layer
printed circuit
board material
functional layer
Prior art date
Application number
TW093136680A
Other languages
English (en)
Other versions
TWI268859B (en
Inventor
Seung-Hyun Sohn
Hyo-Soon Shin
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW200610647A publication Critical patent/TW200610647A/zh
Application granted granted Critical
Publication of TWI268859B publication Critical patent/TWI268859B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW93136680A 2004-09-23 2004-11-29 Printed circuit board material for embedded passive devices TWI268859B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040076557A KR100638620B1 (ko) 2004-09-23 2004-09-23 임베디드 수동소자용 인쇄회로기판재료

Publications (2)

Publication Number Publication Date
TW200610647A true TW200610647A (en) 2006-04-01
TWI268859B TWI268859B (en) 2006-12-21

Family

ID=36074387

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93136680A TWI268859B (en) 2004-09-23 2004-11-29 Printed circuit board material for embedded passive devices

Country Status (5)

Country Link
US (3) US20060062976A1 (zh)
JP (1) JP2006093640A (zh)
KR (1) KR100638620B1 (zh)
CN (1) CN1753598A (zh)
TW (1) TWI268859B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405523B (zh) * 2007-01-29 2013-08-11 Sumitomo Bakelite Co 積層體、基板之製造方法、基板以及半導體裝置
TWI491498B (zh) * 2008-12-26 2015-07-11 Mitsubishi Gas Chemical Co 樹脂複合銅箔
TWI513586B (zh) * 2010-02-08 2015-12-21 Taiyo Holdings Co Ltd Laminated structures and the photosensitive dry films used

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US7982137B2 (en) * 2007-06-27 2011-07-19 Hamilton Sundstrand Corporation Circuit board with an attached die and intermediate interposer
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
US20090056991A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom
WO2009086441A2 (en) * 2007-12-27 2009-07-09 Zettacore, Inc. Self-contained charge storage molecules for use in molecular capacitors
US8586798B2 (en) * 2008-07-14 2013-11-19 Esionic Es, Inc. Heat transfer medium, phosphonium ionic liquids, and methods of making
US8907133B2 (en) 2008-07-14 2014-12-09 Esionic Es, Inc. Electrolyte compositions and electrochemical double layer capacitors formed there from
US8927775B2 (en) 2008-07-14 2015-01-06 Esionic Es, Inc. Phosphonium ionic liquids, salts, compositions, methods of making and devices formed there from
WO2010098066A1 (ja) * 2009-02-25 2010-09-02 パナソニック株式会社 熱伝導性組成物とこれを用いた放熱板、放熱基板、回路モジュール、熱伝導性組成物の製造方法
JP2011119611A (ja) * 2009-12-07 2011-06-16 Furukawa Electric Co Ltd:The 射出成形基板及び射出成形部品
JP5427632B2 (ja) * 2010-02-08 2014-02-26 太陽ホールディングス株式会社 積層構造体及びそれに用いる感光性ドライフィルム
KR101730983B1 (ko) 2010-07-06 2017-04-27 나믹스 코포레이션 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법
CN105637987A (zh) * 2013-10-29 2016-06-01 京瓷株式会社 布线基板、使用了该布线基板的安装结构体以及层叠片
CN103702511B (zh) * 2013-12-31 2017-07-07 广东生益科技股份有限公司 一种高导热金属基板及其制作方法
JP6623569B2 (ja) * 2014-07-23 2019-12-25 Tdk株式会社 薄膜誘電体及び薄膜コンデンサ素子
CN105228344B (zh) * 2015-09-10 2018-09-04 安捷利（番禺）电子实业有限公司 一种埋入式电容的制备方法
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
JP6686231B2 (ja) 2017-08-09 2020-04-22 リンテック株式会社 接着構造体の解体方法
CN108650781A (zh) * 2018-06-20 2018-10-12 景旺电子科技(龙川)有限公司 一种内嵌铜基ims的散热基板及其制备方法
CN109714015B (zh) * 2018-12-28 2021-10-26 电子科技大学 一种基于磁介复合材料的叠层低通滤波器
JP7455516B2 (ja) * 2019-03-29 2024-03-26 Tdk株式会社 素子内蔵基板およびその製造方法
TWI725518B (zh) * 2019-08-22 2021-04-21 聚鼎科技股份有限公司 導熱基板
CN114830840B (zh) * 2019-12-17 2024-04-05 日本发条株式会社 层叠体、粘结方法及电路基板用半成品
CN113043681A (zh) * 2019-12-27 2021-06-29 广东生益科技股份有限公司 一种磁性材料及其制备方法和用途
TW202206286A (zh) 2020-07-28 2022-02-16 美商聖高拜塑膠製品公司 介電基板及其形成方法
US20240043654A1 (en) * 2020-08-25 2024-02-08 Lg Innotek Co., Ltd. Resin composition for semiconductor package and resin coated copper comprising same
TWI823206B (zh) 2020-12-16 2023-11-21 美商聖高拜塑膠製品公司 介電基板及其製造方法

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JPS61185994A (ja) * 1985-02-13 1986-08-19 信越化学工業株式会社 耐熱性フレキシブルプリント配線用基板およびその製造方法
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
US5707729A (en) * 1994-09-13 1998-01-13 Mitsui Mining & Smelting Co., Ltd. Adhesive for copper foils and adhesive-backed copper foil
TW350194B (en) * 1994-11-30 1999-01-11 Mitsubishi Gas Chemical Co Metal-foil-clad composite ceramic board and process for the production thereof the invention relates to the metal-foil-clad composite ceramic board and process for the production
JP3197213B2 (ja) * 1996-05-29 2001-08-13 松下電器産業株式会社 プリント配線板およびその製造方法
JP3945002B2 (ja) 1998-03-20 2007-07-18 凸版印刷株式会社 積層材料の製造方法
US20020048137A1 (en) * 1998-04-01 2002-04-25 Williams Thomas J. Two-layered embedded capacitor
US6618238B2 (en) * 1998-04-01 2003-09-09 Polyclad Laminates, Inc. Parallel plate buried capacitor
WO2000049070A1 (fr) * 1999-02-19 2000-08-24 Hitachi Chemical Co., Ltd. Preimpregne, stratifie a revetement metallique et carte a circuit imprime obtenue a partir de ceux-ci
US6451441B1 (en) * 1999-03-30 2002-09-17 Kyocera Corporation Film with metal foil
US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
JP4148501B2 (ja) * 2002-04-02 2008-09-10 三井金属鉱業株式会社 プリント配線板の内蔵キャパシタ層形成用の誘電体フィラー含有樹脂及びその誘電体フィラー含有樹脂を用いて誘電体層を形成した両面銅張積層板並びにその両面銅張積層板の製造方法
JP4300806B2 (ja) 2003-01-22 2009-07-22 住友ベークライト株式会社 樹脂付き金属箔および多層プリント回路板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405523B (zh) * 2007-01-29 2013-08-11 Sumitomo Bakelite Co 積層體、基板之製造方法、基板以及半導體裝置
TWI491498B (zh) * 2008-12-26 2015-07-11 Mitsubishi Gas Chemical Co 樹脂複合銅箔
TWI513586B (zh) * 2010-02-08 2015-12-21 Taiyo Holdings Co Ltd Laminated structures and the photosensitive dry films used
US9423691B2 (en) 2010-02-08 2016-08-23 Taiyo Holdings Co., Ltd. Layered structure and photosensitive dry film to be used therefor

Also Published As

Publication number Publication date
CN1753598A (zh) 2006-03-29
TWI268859B (en) 2006-12-21
KR100638620B1 (ko) 2006-10-26
US20090314419A1 (en) 2009-12-24
KR20060027666A (ko) 2006-03-28
US20070148421A1 (en) 2007-06-28
JP2006093640A (ja) 2006-04-06
US20060062976A1 (en) 2006-03-23

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