TW200608153A - Exposure apparatus - Google Patents

Exposure apparatus

Info

Publication number
TW200608153A
TW200608153A TW094120229A TW94120229A TW200608153A TW 200608153 A TW200608153 A TW 200608153A TW 094120229 A TW094120229 A TW 094120229A TW 94120229 A TW94120229 A TW 94120229A TW 200608153 A TW200608153 A TW 200608153A
Authority
TW
Taiwan
Prior art keywords
stage member
exposure apparatus
honeycomb structure
torsional
rectangular
Prior art date
Application number
TW094120229A
Other languages
English (en)
Inventor
Tadahiro Ohmi
Kiwamu Takehisa
Shirou Moriyama
Shunichi Sasaki
Masataka Hirose
Mamoru Ishii
Tomoyuki Sugaya
Masako Kataoka
Motohiro Umezu
Original Assignee
Univ Tohoku
Nihon Ceratec Co Ltd
Taiheiyo Cement Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Tohoku, Nihon Ceratec Co Ltd, Taiheiyo Cement Corp filed Critical Univ Tohoku
Publication of TW200608153A publication Critical patent/TW200608153A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)
TW094120229A 2004-06-17 2005-06-17 Exposure apparatus TW200608153A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004179637A JP4382586B2 (ja) 2004-06-17 2004-06-17 露光装置

Publications (1)

Publication Number Publication Date
TW200608153A true TW200608153A (en) 2006-03-01

Family

ID=35509863

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120229A TW200608153A (en) 2004-06-17 2005-06-17 Exposure apparatus

Country Status (6)

Country Link
US (1) US20070207601A1 (zh)
EP (1) EP1783554A4 (zh)
JP (1) JP4382586B2 (zh)
CN (1) CN101002143A (zh)
TW (1) TW200608153A (zh)
WO (1) WO2005124466A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5036471B2 (ja) * 2007-09-27 2012-09-26 京セラ株式会社 セラミック構造体およびその製造方法ならびにこれを用いた半導体または液晶製造装置用部材
NL2002888A1 (nl) * 2008-06-12 2009-12-15 Asml Netherlands Bv Lithographic apparatus, composite material and manufacturing method.
JP4964853B2 (ja) * 2008-09-24 2012-07-04 住友重機械工業株式会社 ステージ装置
KR102098981B1 (ko) 2012-11-27 2020-04-08 가부시키가이샤 크리에이티브 테크놀러지 정전 척, 유리 기판 처리 방법 및 그 유리 기판
JP7020006B2 (ja) * 2017-09-07 2022-02-16 富士フイルムビジネスイノベーション株式会社 画像形成装置、及び画像形成装置用ユニット

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4416191B2 (ja) * 1997-08-29 2010-02-17 京セラ株式会社 低熱膨張セラミックスおよびその製造方法、並びに半導体製造用部品
JPH11142555A (ja) * 1997-11-11 1999-05-28 Canon Inc 位置決め装置、露光装置およびデバイス製造方法
JP3483452B2 (ja) * 1998-02-04 2004-01-06 キヤノン株式会社 ステージ装置および露光装置、ならびにデバイス製造方法
JP3810039B2 (ja) * 1998-05-06 2006-08-16 キヤノン株式会社 ステージ装置
JP3469513B2 (ja) * 1999-08-24 2003-11-25 太平洋セメント株式会社 露光装置およびそれに用いられる支持部材
JP2003535807A (ja) * 2000-06-20 2003-12-02 ショット、グラス、テクノロジーズ、インコーポレイテッド ガラスセラミック複合材
US6542224B2 (en) * 2000-10-13 2003-04-01 Corning Incorporated Silica-based light-weight EUV lithography stages
JP4288694B2 (ja) * 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
JP3998521B2 (ja) * 2002-06-24 2007-10-31 東芝テック株式会社 シート給送装置
JP4082953B2 (ja) * 2002-07-31 2008-04-30 太平洋セメント株式会社 低熱膨張セラミックス接合体
JP4489344B2 (ja) * 2002-11-27 2010-06-23 太平洋セメント株式会社 ステージ部材
JP2004264371A (ja) * 2003-02-21 2004-09-24 Tadahiro Omi 液晶パネル用露光装置
JP2005045184A (ja) * 2003-07-25 2005-02-17 Taiheiyo Cement Corp 可動ステージ
JP2005203537A (ja) * 2004-01-15 2005-07-28 Taiheiyo Cement Corp 軽量高剛性セラミック部材
JP2005234338A (ja) * 2004-02-20 2005-09-02 Taiheiyo Cement Corp 位置測定用ミラー

Also Published As

Publication number Publication date
EP1783554A4 (en) 2009-03-11
JP4382586B2 (ja) 2009-12-16
JP2006003611A (ja) 2006-01-05
EP1783554A1 (en) 2007-05-09
WO2005124466A1 (ja) 2005-12-29
CN101002143A (zh) 2007-07-18
US20070207601A1 (en) 2007-09-06

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