TW200602816A - Method of manufacturing micro-structure body, method of manufacturing stamper using the micro-structure body, and method of manufacturing micro-structure body made of resin using the stamper - Google Patents

Method of manufacturing micro-structure body, method of manufacturing stamper using the micro-structure body, and method of manufacturing micro-structure body made of resin using the stamper

Info

Publication number
TW200602816A
TW200602816A TW094111097A TW94111097A TW200602816A TW 200602816 A TW200602816 A TW 200602816A TW 094111097 A TW094111097 A TW 094111097A TW 94111097 A TW94111097 A TW 94111097A TW 200602816 A TW200602816 A TW 200602816A
Authority
TW
Taiwan
Prior art keywords
structure body
micro
manufacturing
stamper
resist layer
Prior art date
Application number
TW094111097A
Other languages
English (en)
Chinese (zh)
Inventor
Yukihiro Yanagawa
Original Assignee
Kuraray Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co filed Critical Kuraray Co
Publication of TW200602816A publication Critical patent/TW200602816A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00769—Producing diffraction gratings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1847—Manufacturing methods
    • G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133504—Diffusing, scattering, diffracting elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
TW094111097A 2004-04-09 2005-04-08 Method of manufacturing micro-structure body, method of manufacturing stamper using the micro-structure body, and method of manufacturing micro-structure body made of resin using the stamper TW200602816A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004115938 2004-04-09

Publications (1)

Publication Number Publication Date
TW200602816A true TW200602816A (en) 2006-01-16

Family

ID=35125212

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094111097A TW200602816A (en) 2004-04-09 2005-04-08 Method of manufacturing micro-structure body, method of manufacturing stamper using the micro-structure body, and method of manufacturing micro-structure body made of resin using the stamper

Country Status (3)

Country Link
JP (1) JP4802093B2 (ja)
TW (1) TW200602816A (ja)
WO (1) WO2005098486A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106842825A (zh) * 2017-03-21 2017-06-13 京东方科技集团股份有限公司 母模及其制造方法
CN112584623A (zh) * 2019-09-27 2021-03-30 恒煦电子材料股份有限公司 电镀金属导线的制作方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5151101B2 (ja) * 2006-09-12 2013-02-27 ソニー株式会社 レンズフィルムおよび表示装置
KR101362729B1 (ko) * 2007-05-08 2014-02-12 삼성디스플레이 주식회사 광학 시트, 이의 제조 방법 및 이를 갖는 표시 장치
JP2009151257A (ja) * 2007-12-24 2009-07-09 Ind Technol Res Inst 傾斜露光リソグラフシステム
JP6135347B2 (ja) * 2013-07-16 2017-05-31 凸版印刷株式会社 カラーフィルタの製造方法及びカラーフィルタ
DE102013107947A1 (de) * 2013-07-25 2015-02-19 Acquandas GmbH Verfahren zur Herstellung einer medizinischen Vorrichtung, Verfahren zum Modifizieren der Oberfläche einer medizinischen Vorrichtung, medizinische Vorrichtung und Schichtverbund mit einem Substrat
JP5987894B2 (ja) * 2014-12-22 2016-09-07 王子ホールディングス株式会社 凹凸パターンシートの製造方法、及び光学シートの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57200042A (en) * 1981-06-02 1982-12-08 Hoya Corp Exposure method for chemically machinable photosensitive glass
JP3047603B2 (ja) * 1992-03-12 2000-05-29 凸版印刷株式会社 印刷版の製造方法
JPH06300905A (ja) * 1993-04-14 1994-10-28 Nikon Corp 光散乱面を有する光学部品及びその製造方法
JP2000105370A (ja) * 1998-09-29 2000-04-11 Matsushita Electric Ind Co Ltd 反射板、並びに反射型表示素子及びその製造方法
JP2001235873A (ja) * 2000-02-24 2001-08-31 Mitsubishi Electric Corp テーパ形状の形成方法
JP2002146584A (ja) * 2000-04-14 2002-05-22 Citizen Watch Co Ltd 微小形状構造体、ノズル部品、光学部品、表示装置、電鋳元型及びそれらの製造方法
JP2002105621A (ja) * 2000-09-27 2002-04-10 Tokyo Process Service Kk 金属板とその製造方法及び露光装置
JP2003215314A (ja) * 2002-01-18 2003-07-30 Dainippon Printing Co Ltd 反射防止物品
JP2003345029A (ja) * 2002-05-24 2003-12-03 Shin Sti Technology Kk フォトマスク、拡散反射板及びその製造方法
JP2004013060A (ja) * 2002-06-11 2004-01-15 Seiko Epson Corp 反射板、反射板の製造方法、液晶表示装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106842825A (zh) * 2017-03-21 2017-06-13 京东方科技集团股份有限公司 母模及其制造方法
CN106842825B (zh) * 2017-03-21 2021-01-12 京东方科技集团股份有限公司 母模及其制造方法
US11131930B2 (en) 2017-03-21 2021-09-28 Boe Technology Group Co., Ltd. Female mold and method for manufacturing the same
CN112584623A (zh) * 2019-09-27 2021-03-30 恒煦电子材料股份有限公司 电镀金属导线的制作方法

Also Published As

Publication number Publication date
WO2005098486A1 (ja) 2005-10-20
JP4802093B2 (ja) 2011-10-26
JPWO2005098486A1 (ja) 2008-02-28

Similar Documents

Publication Publication Date Title
TW200602816A (en) Method of manufacturing micro-structure body, method of manufacturing stamper using the micro-structure body, and method of manufacturing micro-structure body made of resin using the stamper
ATE443605T1 (de) Strukturierung von hydrogelen
TW200633791A (en) Method for fabricating nano-adhesive
WO2007146082A3 (en) Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same
TW200628399A (en) Mold and process for production of substrates having transferred micropatterns thereon
WO2005039868A3 (de) Strukturierung von elektrischen funktionsschichten mittels einer transferfolie und strukturierung des klebers
ATE451717T1 (de) Herstellungsverfahren
TW200801801A (en) Process for producing patterned film and photosensitive resin composition
HK1081600A1 (en) Method and reagents system having a non-regenerative enzyme-coenzyme complex
WO2005035435A3 (en) Systems and methods for mastering microstructures through a substrate using negative photoresist and microstructure masters so produced
GB9715101D0 (en) The production of microstructures for analysis of fluids
TW200613066A (en) Resin layer forming method, resin layer forming apparatus, disc and disc manufacturing method
AU5935501A (en) Multi depth substrate fabrication processes
KR20150112945A (ko) 광투과형 임프린트용 몰드, 대면적 몰드의 제조방법
SG128567A1 (en) Method and apparatus for manufacturing patterned media
US9116425B2 (en) Mold for nanoimprint lithography and method for forming the same
DE60226069D1 (de) Verfahren zur modifizierung einer polymeroberfläche
ATE348853T1 (de) Verbessertes verfahren zur modifizierung einer polymeroberfläche
TW200801815A (en) Method for forming pattern and composition for forming organic thin film using therefor
WO2006059757A3 (en) Process for producing resist pattern and conductor pattern
JP6173989B2 (ja) パターン形成方法
JP2009226762A (ja) インプリントモールド、インプリントモールド製造方法、微細構造体
TW200724709A (en) A method for forming a mask pattern for ion-implantation
JP2007102156A (ja) ３次元構造物の製造方法、３次元構造物、光学素子及びステンシルマスク。
TW200504857A (en) Method for fabricating semiconductor device and method for fabricating semiconductor substrate used in the semiconductor device