TW200602412A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
TW200602412A
TW200602412A TW093139009A TW93139009A TW200602412A TW 200602412 A TW200602412 A TW 200602412A TW 093139009 A TW093139009 A TW 093139009A TW 93139009 A TW93139009 A TW 93139009A TW 200602412 A TW200602412 A TW 200602412A
Authority
TW
Taiwan
Prior art keywords
resin composition
thermosetting resin
cured
disclosed
weight
Prior art date
Application number
TW093139009A
Other languages
English (en)
Chinese (zh)
Other versions
TWI308577B (enExample
Inventor
Koichi Shibayama
Koji Yonezawa
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200602412A publication Critical patent/TW200602412A/zh
Application granted granted Critical
Publication of TWI308577B publication Critical patent/TWI308577B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/10—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW093139009A 2003-12-15 2004-12-15 Thermosetting resin composition TW200602412A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003417176 2003-12-15

Publications (2)

Publication Number Publication Date
TW200602412A true TW200602412A (en) 2006-01-16
TWI308577B TWI308577B (enExample) 2009-04-11

Family

ID=34675184

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139009A TW200602412A (en) 2003-12-15 2004-12-15 Thermosetting resin composition

Country Status (7)

Country Link
US (2) US20070148442A1 (enExample)
EP (1) EP1698670A4 (enExample)
JP (1) JP4081115B2 (enExample)
KR (1) KR20060120198A (enExample)
CN (1) CN1890325B (enExample)
TW (1) TW200602412A (enExample)
WO (1) WO2005056683A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8163830B2 (en) * 2006-03-31 2012-04-24 Intel Corporation Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same
KR20090051005A (ko) * 2006-07-21 2009-05-20 쇼와 덴코 가부시키가이샤 투명 복합재료
JP2008045121A (ja) * 2006-07-21 2008-02-28 Showa Denko Kk 透明複合材料
TW200831583A (en) * 2006-09-29 2008-08-01 Nippon Catalytic Chem Ind Curable resin composition, optical material, and method of regulating optical material
JP5175499B2 (ja) * 2007-08-20 2013-04-03 積水化学工業株式会社 熱硬化性樹脂組成物の製造方法
US20100219541A1 (en) * 2007-09-28 2010-09-02 Konica Minolta Opto, Inc. Method for manufacturing optical device
ES2709473T3 (es) 2008-03-25 2019-04-16 Toray Industries Composición de resina epoxi, material compuesto reforzado con fibra y método de producción del mismo
US8105853B2 (en) * 2008-06-27 2012-01-31 Bridgelux, Inc. Surface-textured encapsulations for use with light emitting diodes
CN102326106B (zh) * 2009-02-20 2013-07-31 积水化学工业株式会社 Gi型光纤及其制造方法
CN101704991B (zh) * 2009-11-23 2011-08-17 南亚塑胶工业股份有限公司 一种热固性环氧树脂组合物
US8783915B2 (en) 2010-02-11 2014-07-22 Bridgelux, Inc. Surface-textured encapsulations for use with light emitting diodes
EP2627724A4 (en) * 2010-08-17 2014-04-09 Texas State University San Marcos A Component Of The Texas State University System PERMANENT CERAMIC NANOCOMPOSITE HEAT INSULATION LAYERS FOR METALS AND FIRE-RESISTANT MATERIALS
CN102378479A (zh) * 2010-08-25 2012-03-14 富葵精密组件(深圳)有限公司 电路板基板及其制作方法
TWI484014B (zh) * 2010-08-30 2015-05-11 Zhen Ding Technology Co Ltd 電路板基板及其製作方法
US8686069B2 (en) * 2010-10-12 2014-04-01 Hexcel Corporation Solvent resistance of epoxy resins toughened with polyethersulfone
EP2685512A4 (en) * 2011-03-11 2014-09-03 Konica Minolta Inc METHOD FOR PRODUCING A LIGHT-EMITTING DEVICE AND A MIXING PHOSPHORIZED SOLUTION
JP5635655B1 (ja) * 2013-06-28 2014-12-03 太陽インキ製造株式会社 熱硬化性組成物、ドライフィルムおよびプリント配線板
JP5624184B1 (ja) * 2013-06-28 2014-11-12 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
US10743412B2 (en) * 2014-02-27 2020-08-11 Shin-Etsu Chemical Co., Ltd. Substrate and semiconductor apparatus
JP6018148B2 (ja) * 2014-09-25 2016-11-02 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
US20180179424A1 (en) * 2016-12-23 2018-06-28 Industrial Technology Research Institute Adhesive composition and composite substrate employing the same
JP6668287B2 (ja) * 2017-04-04 2020-03-18 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ 膜形成組成物およびそれを用いた膜形成方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3084130A (en) * 1959-12-02 1963-04-02 Johns Manville Dry cold molding composition containing thermosetting resin binder and hydrated mineral absorbent
EP0209382A3 (en) * 1985-07-16 1988-01-13 Mitsubishi Petrochemical Co., Ltd. Cast molding of acrylic plastics
EP0417912B1 (en) * 1989-08-25 1994-11-09 Idemitsu Petrochemical Company Limited Thermoplastic resin-based molding composition
JPH104270A (ja) * 1996-06-18 1998-01-06 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JP2002064276A (ja) * 2000-08-22 2002-02-28 Nippon Steel Chem Co Ltd 光又は熱硬化性樹脂組成物及び多層プリント配線基板
CN1235971C (zh) * 2000-11-29 2006-01-11 太阳油墨制造株式会社 液状热固化性树脂组合物与印刷电路板及其制造方法
US20040053061A1 (en) * 2000-12-08 2004-03-18 Koji Yonezawa Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepreg
JP3863771B2 (ja) * 2000-12-08 2006-12-27 積水化学工業株式会社 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、ｔａｂ用フィルム及びプリプレグ
JP2003313435A (ja) * 2002-02-19 2003-11-06 Sekisui Chem Co Ltd 絶縁基板用材料、積層板、プリント基板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、ｔａｂ用フィルム及びプリプレグ
JP4268456B2 (ja) * 2002-06-07 2009-05-27 積水化学工業株式会社 樹脂基板材料
JP2004244510A (ja) * 2003-02-13 2004-09-02 Sekisui Chem Co Ltd 樹脂組成物、樹脂シート、配線基板及びコーティング剤

Also Published As

Publication number Publication date
KR20060120198A (ko) 2006-11-24
EP1698670A1 (en) 2006-09-06
CN1890325A (zh) 2007-01-03
EP1698670A4 (en) 2010-05-05
US20070148442A1 (en) 2007-06-28
WO2005056683A1 (ja) 2005-06-23
JPWO2005056683A1 (ja) 2007-07-19
CN1890325B (zh) 2011-09-07
US20090267263A1 (en) 2009-10-29
JP4081115B2 (ja) 2008-04-23
TWI308577B (enExample) 2009-04-11

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