KR20060120198A - 열경화성 수지 조성물, 기판용 재료 및 기판용 필름 - Google Patents
열경화성 수지 조성물, 기판용 재료 및 기판용 필름 Download PDFInfo
- Publication number
- KR20060120198A KR20060120198A KR1020067011684A KR20067011684A KR20060120198A KR 20060120198 A KR20060120198 A KR 20060120198A KR 1020067011684 A KR1020067011684 A KR 1020067011684A KR 20067011684 A KR20067011684 A KR 20067011684A KR 20060120198 A KR20060120198 A KR 20060120198A
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- South Korea
- Prior art keywords
- resin
- thermosetting resin
- resin composition
- layered silicate
- inorganic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 105
- 239000011342 resin composition Substances 0.000 title claims abstract description 75
- 239000000463 material Substances 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 135
- 239000011347 resin Substances 0.000 claims abstract description 135
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 88
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 47
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 46
- 239000006185 dispersion Substances 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims description 66
- 229920000647 polyepoxide Polymers 0.000 claims description 66
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000000470 constituent Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 65
- -1 aerosol and oxygen Chemical compound 0.000 description 59
- 238000000034 method Methods 0.000 description 41
- 239000000126 substance Substances 0.000 description 27
- 150000001875 compounds Chemical class 0.000 description 26
- 238000000465 moulding Methods 0.000 description 23
- 239000013078 crystal Substances 0.000 description 20
- 230000003287 optical effect Effects 0.000 description 20
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 18
- 230000014759 maintenance of location Effects 0.000 description 18
- 150000003839 salts Chemical class 0.000 description 15
- 239000011229 interlayer Substances 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 229920006351 engineering plastic Polymers 0.000 description 13
- 125000000524 functional group Chemical group 0.000 description 13
- 238000013329 compounding Methods 0.000 description 12
- 229920001971 elastomer Polymers 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 238000007493 shaping process Methods 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000012792 core layer Substances 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 229920001721 polyimide Polymers 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 9
- 238000004891 communication Methods 0.000 description 9
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- 229920003192 poly(bis maleimide) Polymers 0.000 description 9
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 238000010538 cationic polymerization reaction Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
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- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000009719 polyimide resin Substances 0.000 description 7
- 229920001955 polyphenylene ether Polymers 0.000 description 7
- 150000004760 silicates Chemical class 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
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- 239000002253 acid Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- AZJYLVAUMGUUBL-UHFFFAOYSA-A u1qj22mc8e Chemical compound [F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[F-].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].O=[Si]=O.O=[Si]=O.O=[Si]=O.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3 AZJYLVAUMGUUBL-UHFFFAOYSA-A 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
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- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920001451 polypropylene glycol Polymers 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 4
- 241000251468 Actinopterygii Species 0.000 description 4
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
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- 239000003505 polymerization initiator Substances 0.000 description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- BCHZICNRHXRCHY-UHFFFAOYSA-N 2h-oxazine Chemical group N1OC=CC=C1 BCHZICNRHXRCHY-UHFFFAOYSA-N 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003945 anionic surfactant Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004202 carbamide Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 3
- 125000003827 glycol group Chemical group 0.000 description 3
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 3
- 229910000271 hectorite Inorganic materials 0.000 description 3
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- 150000004714 phosphonium salts Chemical group 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910052902 vermiculite Inorganic materials 0.000 description 3
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- 235000019354 vermiculite Nutrition 0.000 description 3
- 238000004736 wide-angle X-ray diffraction Methods 0.000 description 3
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
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- 235000019270 ammonium chloride Nutrition 0.000 description 2
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- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
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- 229910021645 metal ion Inorganic materials 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
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- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/10—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
Landscapes
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
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- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
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| JP2003417176 | 2003-12-15 | ||
| JPJP-P-2003-00417176 | 2003-12-15 |
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| KR20060120198A true KR20060120198A (ko) | 2006-11-24 |
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| EP (1) | EP1698670A4 (enExample) |
| JP (1) | JP4081115B2 (enExample) |
| KR (1) | KR20060120198A (enExample) |
| CN (1) | CN1890325B (enExample) |
| TW (1) | TW200602412A (enExample) |
| WO (1) | WO2005056683A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20190129960A (ko) * | 2017-04-04 | 2019-11-20 | 메르크 파텐트 게엠베하 | 필름 형성 조성물 및 이를 이용한 필름 형성 방법 |
Families Citing this family (21)
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| US8163830B2 (en) * | 2006-03-31 | 2012-04-24 | Intel Corporation | Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same |
| KR20090051005A (ko) * | 2006-07-21 | 2009-05-20 | 쇼와 덴코 가부시키가이샤 | 투명 복합재료 |
| JP2008045121A (ja) * | 2006-07-21 | 2008-02-28 | Showa Denko Kk | 透明複合材料 |
| TW200831583A (en) * | 2006-09-29 | 2008-08-01 | Nippon Catalytic Chem Ind | Curable resin composition, optical material, and method of regulating optical material |
| JP5175499B2 (ja) * | 2007-08-20 | 2013-04-03 | 積水化学工業株式会社 | 熱硬化性樹脂組成物の製造方法 |
| US20100219541A1 (en) * | 2007-09-28 | 2010-09-02 | Konica Minolta Opto, Inc. | Method for manufacturing optical device |
| ES2709473T3 (es) | 2008-03-25 | 2019-04-16 | Toray Industries | Composición de resina epoxi, material compuesto reforzado con fibra y método de producción del mismo |
| US8105853B2 (en) * | 2008-06-27 | 2012-01-31 | Bridgelux, Inc. | Surface-textured encapsulations for use with light emitting diodes |
| CN102326106B (zh) * | 2009-02-20 | 2013-07-31 | 积水化学工业株式会社 | Gi型光纤及其制造方法 |
| CN101704991B (zh) * | 2009-11-23 | 2011-08-17 | 南亚塑胶工业股份有限公司 | 一种热固性环氧树脂组合物 |
| US8783915B2 (en) | 2010-02-11 | 2014-07-22 | Bridgelux, Inc. | Surface-textured encapsulations for use with light emitting diodes |
| EP2627724A4 (en) * | 2010-08-17 | 2014-04-09 | Texas State University San Marcos A Component Of The Texas State University System | PERMANENT CERAMIC NANOCOMPOSITE HEAT INSULATION LAYERS FOR METALS AND FIRE-RESISTANT MATERIALS |
| CN102378479A (zh) * | 2010-08-25 | 2012-03-14 | 富葵精密组件(深圳)有限公司 | 电路板基板及其制作方法 |
| TWI484014B (zh) * | 2010-08-30 | 2015-05-11 | Zhen Ding Technology Co Ltd | 電路板基板及其製作方法 |
| US8686069B2 (en) * | 2010-10-12 | 2014-04-01 | Hexcel Corporation | Solvent resistance of epoxy resins toughened with polyethersulfone |
| EP2685512A4 (en) * | 2011-03-11 | 2014-09-03 | Konica Minolta Inc | METHOD FOR PRODUCING A LIGHT-EMITTING DEVICE AND A MIXING PHOSPHORIZED SOLUTION |
| JP5635655B1 (ja) * | 2013-06-28 | 2014-12-03 | 太陽インキ製造株式会社 | 熱硬化性組成物、ドライフィルムおよびプリント配線板 |
| JP5624184B1 (ja) * | 2013-06-28 | 2014-11-12 | 太陽インキ製造株式会社 | ドライフィルムおよびプリント配線板 |
| US10743412B2 (en) * | 2014-02-27 | 2020-08-11 | Shin-Etsu Chemical Co., Ltd. | Substrate and semiconductor apparatus |
| JP6018148B2 (ja) * | 2014-09-25 | 2016-11-02 | 太陽インキ製造株式会社 | ドライフィルムおよびプリント配線板 |
| US20180179424A1 (en) * | 2016-12-23 | 2018-06-28 | Industrial Technology Research Institute | Adhesive composition and composite substrate employing the same |
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| US3084130A (en) * | 1959-12-02 | 1963-04-02 | Johns Manville | Dry cold molding composition containing thermosetting resin binder and hydrated mineral absorbent |
| EP0209382A3 (en) * | 1985-07-16 | 1988-01-13 | Mitsubishi Petrochemical Co., Ltd. | Cast molding of acrylic plastics |
| EP0417912B1 (en) * | 1989-08-25 | 1994-11-09 | Idemitsu Petrochemical Company Limited | Thermoplastic resin-based molding composition |
| JPH104270A (ja) * | 1996-06-18 | 1998-01-06 | Sumitomo Bakelite Co Ltd | 多層プリント配線板の製造方法 |
| JP2002064276A (ja) * | 2000-08-22 | 2002-02-28 | Nippon Steel Chem Co Ltd | 光又は熱硬化性樹脂組成物及び多層プリント配線基板 |
| CN1235971C (zh) * | 2000-11-29 | 2006-01-11 | 太阳油墨制造株式会社 | 液状热固化性树脂组合物与印刷电路板及其制造方法 |
| US20040053061A1 (en) * | 2000-12-08 | 2004-03-18 | Koji Yonezawa | Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepreg |
| JP3863771B2 (ja) * | 2000-12-08 | 2006-12-27 | 積水化学工業株式会社 | 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、ｔａｂ用フィルム及びプリプレグ |
| JP2003313435A (ja) * | 2002-02-19 | 2003-11-06 | Sekisui Chem Co Ltd | 絶縁基板用材料、積層板、プリント基板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、ｔａｂ用フィルム及びプリプレグ |
| JP4268456B2 (ja) * | 2002-06-07 | 2009-05-27 | 積水化学工業株式会社 | 樹脂基板材料 |
| JP2004244510A (ja) * | 2003-02-13 | 2004-09-02 | Sekisui Chem Co Ltd | 樹脂組成物、樹脂シート、配線基板及びコーティング剤 |
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- 2004-12-14 CN CN2004800365202A patent/CN1890325B/zh not_active Expired - Fee Related
- 2004-12-15 TW TW093139009A patent/TW200602412A/zh unknown
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2009
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190129960A (ko) * | 2017-04-04 | 2019-11-20 | 메르크 파텐트 게엠베하 | 필름 형성 조성물 및 이를 이용한 필름 형성 방법 |
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| EP1698670A1 (en) | 2006-09-06 |
| CN1890325A (zh) | 2007-01-03 |
| EP1698670A4 (en) | 2010-05-05 |
| US20070148442A1 (en) | 2007-06-28 |
| WO2005056683A1 (ja) | 2005-06-23 |
| TW200602412A (en) | 2006-01-16 |
| JPWO2005056683A1 (ja) | 2007-07-19 |
| CN1890325B (zh) | 2011-09-07 |
| US20090267263A1 (en) | 2009-10-29 |
| JP4081115B2 (ja) | 2008-04-23 |
| TWI308577B (enExample) | 2009-04-11 |
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