TW200532818A - Sliding type fingerprint sensor package - Google Patents

Abstract

A sliding type fingerprint sensor package includes a carrier with an upper surface. A sensor chip is attached to the upper surface of the carrier. The active surface of the sensor chip includes a sensing region for sensing fingerprint by sliding. A plurality of bonding pads are formed on one side of the active surface. A groove is formed between the sensing region and the bonding pads. A plurality of connecting elements electrically couple the bonding pads to the carrier. A molding compound seals the connecting elements and covers the bonding pads along the groove. The groove is used for preventing the molding compound flowing to the sensing region.

Description

200532818

[Technical field to which the invention belongs] The mounting structure is particularly related to the present invention The present invention relates to a sensor package: a touch-slip fingerprint sensor package structure. [Prior art]

Private 4 t sensory devices are used for personal identification, which can be divided into two types: pressure-touch type and touch-type. The pressure-touch fingerprint sensor has a roughly square sensor ^ for direct finger pressing. The fingerprint is sensed, so the size of the sensing area of the pressure-type fingerprint sensing theft needs to have enough sensing area to avoid misjudgment, and the sensing area of the sliding fingerprint sensor can only be a long rectangle When using, you only need to touch your finger with the touch area of the touch-slip fingerprint sensor and slide it across the sensing area to sense and recognize the shape and appearance of the fingerprint. The sensor system can have a smaller size.

A conventional fingerprint sensor is disclosed in Japanese Laid-Open Patent Publication No. 200 3-2 35830. Please refer to FIG. 1. The fingerprint sensor 100 includes a substrate 1 10 and a sensing chip 丨 2 〇, a plurality of bonding wires 130 and a sealant 140 formed by a stamper, the bonding wires 130 are electrically connected to the sensing chip 1 2 0 and or the substrate 1 1 0 ′ the sealing compound 1 4 0 A part of the active surfaces of the fresh wires 130 and the sensing chip 120 is covered, and the sensing area 121 of the sensing chip 120 is exposed. Since the sealing compound 140 is easy to have a film when the stamper is formed, The waste gel (mold flash) overflows and contaminates the sensing area 1 2 1 of the sensing chip 120. In order to prevent the sensing area 1 2 1 of the sensing chip 120 from being covered by thin film scrap, the above-mentioned patent publication discloses An opening 14 1 is formed in the sealing compound 1 40, and the edge of the opening 1 41 to the edge of the sensing area 1 21 is 0.3 to 1.0 mm to avoid the sealing compound 140 or film flash (mold flash). cover

Page 7 200532818 V. Description of the invention (2) Covering the sensing area 1 2 1 However, as the size of the sensing chip 丨 2 〇 becomes smaller, it is no longer possible to be on the active surface of the sensing chip 1 2 〇 Leave a sufficient range, and even the clamping surface of the mold is too close to the periphery of the sensing wafer 120, which causes the sensing wafer 120 to crack. [Summary of the Invention] The main purpose of the present invention is a package structure, which is formed with a diversion groove between a sensing wafer for diversion of a flash (mold flash) or sealing gel to avoid the sensing area. A second object of the present invention is a seal-pei structure, which forms a colloid with a virtual stamper so that the active surfaces of the sealed wafers are coplanar to avoid the touch-slip fingerprint sensor carrier according to the present invention. The sensing chip and the plurality of carriers have an upper surface. The upper surface, the sensing chip has a sensing area, a plurality of pads, and one of the fingerprint surfaces that touches and slides in a touch-slip manner. On the side, the diversion groove is formed between the conductive elements and the electrical connection glue system covers the conductive elements and the edge of the gel is adjacent to the diversion groove to provide a touch-slip fingerprint sensor. The surface of the pads and the sensing area flow to the film waste glue of the diversion trough. ". To prevent the sealing gel or film waste glue from contamination, provide a touch-slip fingerprint sensor dummy area mold The surface of the extended area of the colloid and a chip of the sensing chip are sensed. The seismic sealing structure of the sensor includes a lead element and a colloid, wherein the sensing chip is disposed on an active surface of the carrier, and the active The noodle system includes a deflector, where the For the sensing area, the pads are formed on the pads that are actively formed on the pads and the sensing area to the carrier, the sealing sound of the sensing chip is covered, and the seal reveals that Sensing area.

200532818 V. Description of the invention (3) [Embodiment] Referring to the attached drawings, the present invention will enumerate the following embodiments. According to a specific embodiment of the present invention, please refer to FIGS. 2 and 3, a touch-slip fingerprint sensor package structure 2000, which includes a carrier 2 1, a sensor chip 2 2 0, a plurality of One guide element 2 3 0 and one colloid 2 4 0, wherein the carrier 210 can be a substrate, and the material can be BT, FR 4 or 5 5 'The carrier 210 has an upper surface 211 and The lower surface 212, the upper surface 21 1 is formed with a plurality of connection pads 213, and the lower surface 2 12 is formed with a plurality of external pads 21 4 electrically connected to the connection pads 2 1 3, and the external 塾 21 4 is for external electrical transmission. The sensing chip 22 is disposed on the upper surface 2n of the carrier 210. It can be adhered to the carrier with an adhesive layer 250 such as epoxy. 21〇 upper surface 211, preferably, the upper surface 2 11 of the carrier 21 can be formed with a positioning groove 215 to place the delta sensor chip 2 2 0 'Please refer to FIG. 3, the sensor The test chip 2 2 0 has an active surface 2 2 1. In this embodiment, the active surface 221 of the sensor chip 220 is rectangular, and The length of the side 2 21a, 221b is three times longer than the length of the short sides 221c, 221d. The active surface 221 has a rectangular sensing area 22 2, and the sensing area 222 is formed with a plurality of fingerprint sensing integrated circuits. A sensing element (not shown in the figure) is used to touch-slip type fingerprints. One side of the active surface 22 1 is formed with a plurality of & pads 223 ′ In this embodiment, the The pads 223 are disposed on the active surface 221, and on one side of the short side 2 21c, a diversion groove 2 2 4 is formed between the pads 223 and the sensing area 2 2 2. The flow grooves 2 2 4 pass through the two longer sides 221a, 221b of the active surface 221. The guide elements 230 may be

200532818 V. Description of the invention (4)-bonding wire and electrically connecting the pad 223 of the sensing chip 220 to the first connector 213 of the carrier 210 'The sealing compound 240 is formed by a dummy region 310 (dummy area) mold 3 00 (see Figure 4). A stamper is formed on the side of the sensing chip 2 2 0 on the two shorter sides 2 2 1 c and 2 2 1 d to reveal the feeling of the sensing chip 220. The measurement region 222. The sealing compound 240 has a first packaging portion 241 and a second packaging portion 242. The first packaging portion 241 is formed on the short side 2 2 1 c of the sensing chip 2 2 0. In order to cover the conductive elements 2 3 0 and the bonding pads 223 of the sensing chip 220, the side edge 241 a of the first package portion 241 is adjacent to the flow guide groove 224. When the first package portion 241 is used, the diversion groove 224 can guide the overflow of the mold flash of the mold · 300 to prevent the film waste from contaminating the sensing area 222 of the sensing chip 220. In addition, since the dummy region 310 of the mold 300 corresponds to the outer side of the short side 2 2 Id of the sensing chip 220, the second package portion 242 of the sealing compound 240 has an extension region 243. Preferably, a surface 243a of the extension region 243 is coplanar with the active surface 221 of the sensing chip 220 to prevent the short side 2 2 1 d of the sensing chip 220 from cracking. When the molding compound 240 is stamped on the sides of the sensing chip 220 on the two shorter sides 221c and 221d, the guide grooves 22 4 of the sensing chip 220 are formed on the bonding pads 22 3 and the sensor. Between the measurement area 222 and the mold 300 are designed with the dummy area 31 0 (dummy are a), the side 24 la of the first encapsulation portion 241 is adjacent to the diversion groove 224 and covers the sensing area. The solder pad 223 of the chip 220 and the conductive elements 230, because the flow guide groove 224 has the function of inadvertently overflowing the film waste glue or the sealant 240, so the overflow of the sealant 240 or the film waste glue can be avoided. Flow to the sensing area 222 to avoid the

Page 10 200532818 V. Description of the invention (5) The sensing area 222 is covered or contaminated by the sealant 240 or film waste, and the extension area 243 of the second package portion 242 of the sealant 240 is formed on the sensing chip 220 The side of the short side 221d can prevent the short side 221 (1) of the sensing chip 220 from breaking. The warranty scope of the present invention shall be determined by the scope of the attached patent application. Anyone who is familiar with this technology, Any changes and modifications made without departing from the spirit and scope of the present invention belong to the protection scope of the present invention.

200532818 Brief description of the drawings [Simplified description of the drawings] Figure 1: Sectional schematic diagram of the Japanese public tester Figure 2: Sectional cut of the package structure of the tester according to the present invention Figure 3: Schematic diagram according to the present invention; and Figure 4: Basis The package structure of the transmitter is a specific embodiment of fingerprint sensing in the Japanese Patent Laid-Open Publication No. 200 3-235830, a schematic diagram of a touch-slip fingerprint sensing surface; a specific embodiment of the disclosure, a visible one on a sensing chip In a specific embodiment, a schematic cross-sectional view of the touch-slip fingerprint sensor before a gel is formed. Simple description of 70 symbols 100 fingerprint sensor substrate sensing chip fresh line sealing gel fingerprint sensor carrier connection pad sensing wafer long side sensing area lead element sealing gel no120 130 140 20021 22021 220221 b222 230 240 1 2 1 Sensing area 141 Opening 211 Upper surface 214 External pad 221 Active surface 2 21 c Short side 223 Solder pad 212 Lower surface 215 Positioning groove 221a Long & 221d Short side 224 Guide # 41 241 Side of the first package portion 241a side

Page 12 200532818 Brief description of drawings 242 Second package part 243 Extension area 243a Surface 250 Adhesive layer 300 Mold 310 Dummy area

Claims (1)

200532818 6. Scope of patent application [Scope of patent application] 1. A touch-slip fingerprint sensor package structure, including a carrier, which has an upper surface; a sensing chip, which is disposed on the carrier On the upper surface, the test chip has an active surface including a sensing area formed on the active surface; a plurality of f pads formed on one side of the active surface; and A diversion groove is formed on the active surface and is provided between the sensing areas; the arsenic sounder · j several lead connections * are electrically connected to the pads to the bearing Some sensing areas 2, such as structure, · shape. 3. If the structure is installed 4. If the structure is connected to the system 5. If the structure is misplaced ^; It covers the conductive elements and covers the sensing crystal colloid-the side is adjacent to the flow channel and the application is exposed ★ The sensor chip in the first scope of the patent scope of the Xuan Xuan initiatively touches: "The sensing area of the main surface of the Xuan main body of the texture sensor is the first or second scope of the patent scope of the rectangular application. The sealant system overflows to: as described in item 1 or 2 of the scope of patent application for: type fingerprint sensor;: ;; β; where the φβ type fingerprint sensing of the sensing chip passes through the active surface The two longer sides. Chengma rectangle, as described in item 4 of the patent application, where the sealant system has a first fingerprint sensor seal, and has a first mounting part *-second package 200532818 The first seal of Hai Hai 6. The scope of patent application is formed on the side edge mounting portion of the two shorter sides of the sensing chip to cover the conductive elements. 6. According to the touch-slip fingerprint sensor seal structure described in item 5 of the scope of the patent application, wherein the first package of δ Xuan has an extension area, the extension bar and surface are in common with the active surface of the sensing chip. flat. Table 7. The touch-slip fingerprint sensor seal structure described in item 4 of the scope of patent application, wherein the pads are provided on one side of the short side of the active surface. 8. The touch-slip fingerprint sensor package structure described in item 4 of the scope of patent application, wherein the length of the long side of the active surface is greater than 3 times the length of the short side. 9. The touch-slip fingerprint sensor package structure according to item 1 of the scope of the patent application, wherein the upper surface of the carrier is formed with a positioning slot to accommodate the sensing chip. 10. The package structure of the touch-slip fingerprint sensor described in item 1 of the scope of the patent application, wherein the sensing chip is attached to the carrier through an adhesive layer. i j. The touch-slip fingerprint sensor package structure described in item 1 of the patent application scope, wherein the carrier is a substrate / substrate. Page 15