1278122 九、發明說明： 【發明所屬之技術領域】 本發明係有關於影像感測器之點膠封裝技術，特別係 有關於一種影像感測器之點膠封裝構造及方法。 【先前技術】 習知影像感測器之CMOS(互補金屬氧化半導體）晶片 係必須經過適當封裝，其不同於傳統密封IC晶片之模封 膠體（molding compound)，並且影像感測器用以保護銲線 鲁之社、封膠係為點膠（diSpensing)形成，以符合影像感測器多 樣化與節省密封膠用量之需求，並可避免影像感測晶片被 模具壓傷，以提高封裝良率。 請參閱第1與2D圖，一種習知影像感測器之點膠封 裝構造100係包含有一基板110、一影像感測晶片12〇、 複數個電性連接該基板11 〇與該影像感測晶片12〇之銲線 130、以及點塗形成之一點膠攔壩ι4〇與一密封膠ι5〇。該 0 影像感測晶片120係設置於該基板110之一上表面i1]L。 通常該影像感測晶片120之一主動面121上係預先貼附有 一透光片160。並以打線形成之該些銲線13〇連接該影像 感測晶片120之複數個銲墊122與該基板110之複數個連 接墊112。由於該影像感測晶片120係設置於該基板11〇 之该上表面111 ’使得該影像感測晶片12 〇之該主動面121 與該基板110之該上表面111有一高度差，因此在點塗該 點膠攔壩140時，增加點膠作業困難。再者該點塗形成之 該點膠攔壩140其外觀較差，且較浪費該點膠攔壩14〇與 6 1278122 戎岔封膠150之膠材。請參閱第2A至2D圖，其係為該影 像感測器之點膠封裝構造1〇〇之製造過程之上視圖，如第 2A圖所示，其中該影像感測晶片12〇之該主動面i2i係 貼附有該透光片160,並且該影像感測晶片12〇係已設置 於該基板110之該上表面U1以及該些銲線13〇係連接該 影像感測晶片120之該些銲墊122與該基板11〇之該些連 接墊112。首先，進行第一外膠點塗步驟，將一第一外膠 141點塗於該基板11〇之該上表面m上；接著如第2b 籲 圖所示，進行第二外膠點塗步驟，將一第二外膠142點塗 於該影像感測晶片120之該主動面121上，以使得該第一 外膠141與該第二外膠142組成在該基板no與該影像感 測晶片120上之該點膠攔壩14〇。之後，進行第一内膠點 — 塗步驟，如第2C圖所示，將一第一内膠151點塗於該點 - 膠攔壩140之環繞區域内，使其形成於該基板110之該上 表面111上；接著，如第2D圖所示，進行第二内膠點塗 步驟，將一第二内膠152點塗於該影像感測晶片120之該 鲁 主動面121上。該第一内膠151與該第二内膠152係組成 在該基板110與該影像感測晶片120上之該密封膠150， 在該點膠攔壩140之限制下，該密封膠150係密封該些銲 線130。然而受制於該影像感測晶片120與該基板110之 間高度差，通常由較高黏度膠體點塗形成之該點膠攔壩 140係具有較差之點塗外觀，且在該影像感測晶片120上 之該第二外膠142會與該基板11〇上之該第一外膠141連 接不良。此外，由於製造上述之該影像感測器之點膠封襞 7 1278122 構造100需要多道點塗操作步驟，增加封裝成本。 【發明内容】 本發明之主要目的係在於提供一 膠封裝構造及方法 種影像感測器之點 一基板係具有一容晶穴 一影像感測 晶片係設置於該基板之容晶穴内，該影像感測晶片之一主 動面係約略與該基板之-上表面為共平面n㈣搁 壩以及一密封膠之點膠形成。由於該影像感測晶片之該主1278122 IX. Description of the Invention: [Technical Field] The present invention relates to a dispensing technique for an image sensor, and more particularly to a dispensing package structure and method for an image sensor. [Prior Art] A CMOS (Complementary Metal Oxide Semiconductor) wafer of a conventional image sensor must be properly packaged, which is different from a molding compound of a conventional sealed IC chip, and an image sensor is used to protect the bonding wire. Luzhishe and sealant are formed by diSpensing to meet the needs of image sensor diversification and save the amount of sealant, and to prevent the image sensing wafer from being crushed by the mold to improve the package yield. Referring to FIGS. 1 and 2D , a conventional image sensor dispensing structure 100 includes a substrate 110 , an image sensing wafer 12 , a plurality of electrically connected substrates 11 , and the image sensing wafer . 12〇 of the wire 130, and a spot coating to form a glue block dam4〇 and a sealant ι5〇. The 0 image sensing wafer 120 is disposed on an upper surface i1]L of the substrate 110. Generally, a light transmitting sheet 160 is preliminarily attached to one active surface 121 of the image sensing wafer 120. The plurality of bonding pads 122 of the image sensing wafer 120 and the plurality of bonding pads 112 of the substrate 110 are connected by the bonding wires 13 formed by wire bonding. The image sensing chip 120 is disposed on the upper surface 111 ′ of the substrate 11 , such that the active surface 121 of the image sensing wafer 12 and the upper surface 111 of the substrate 110 have a height difference, so When the glue is used to block the dam 140, it is difficult to increase the dispensing operation. Moreover, the dispensing dam 140 formed by the spot coating has a poor appearance, and wastes the glue dam 14 〇 and 6 1278122 戎岔 sealant 150. Please refer to FIG. 2A to FIG. 2D, which are top views of the manufacturing process of the dispensing structure of the image sensor, as shown in FIG. 2A, wherein the image sensing wafer 12 is disposed on the active surface. The light-transmitting sheet 160 is attached to the i2i, and the image sensing wafer 12 is disposed on the upper surface U1 of the substrate 110 and the soldering wires 13 are connected to the soldering electrodes 120. The pad 122 and the substrate 11 are connected to the connection pads 112. First, a first outer glue coating step is performed, and a first outer rubber 141 is spot-applied on the upper surface m of the substrate 11; then, as shown in FIG. 2b, a second outer glue coating step is performed. A second outer adhesive 142 is applied to the active surface 121 of the image sensing wafer 120 such that the first outer adhesive 141 and the second outer adhesive 142 are formed on the substrate no and the image sensing wafer 120. On the top of the glue block dam 14 〇. Thereafter, a first inner glue point-coating step is performed. As shown in FIG. 2C, a first inner glue 151 is applied to the surrounding area of the point-rubber dam 140 so as to be formed on the substrate 110. On the upper surface 111; then, as shown in FIG. 2D, a second internal glue coating step is performed, and a second adhesive 152 is applied to the active surface 121 of the image sensing wafer 120. The first adhesive 151 and the second adhesive 152 are formed on the substrate 110 and the image sensing wafer 120. The sealant 150 is sealed under the restriction of the dispensing dam 140. The bonding wires 130. However, subject to the height difference between the image sensing wafer 120 and the substrate 110, the dispensing dam 140, which is typically formed by higher viscosity colloid dispensing, has a poor dot appearance and is in the image sensing wafer 120. The second outer glue 142 is connected to the first outer glue 141 on the substrate 11 . In addition, due to the manufacture of the above-described image sensor, the dispensing device 7 1278122 construction 100 requires multiple dispensing steps, increasing packaging costs. SUMMARY OF THE INVENTION The main object of the present invention is to provide a plastic package structure and method. The substrate of the image sensor has a cavity. The image sensing chip is disposed in the cavity of the substrate. One of the active wafers of the sensing wafer is formed approximately in a coplanar n-(four) dam with the upper surface of the substrate and a sealant of a sealant. Because the image sensing chip is the main
動面係約略與4基板之$上表面為共平面，因此點膠搁塌 具有較佳之點膠攔壩外觀，並且該密封膠係能以一次點膠 形成於該基板之該上表面與該影像感測晶片之該主動 面，以密封該些銲線，其係可減少點膠次數。 本發明之次一目的在於提供一種影像感測器之點膠 封裝構造及方法，一影像感測晶片係設置於於一基板之一 容晶穴内，並且該影像感測晶片之一主動面係約^與該基 板之-上表面$共平®，一‘點膠攔壩係形成於該基板之該 上表面上，該點膠攔壩更可延伸至該影像感測晶片之該主 動面上，而呈「门」形，以縮小該點膠攔壩環繞複數個銲 線之面積，其係可節省一密封膠之點膠用^，以降低點膠 封裝之成本。 依據本發明，一種影像感測器之點膠封裝構造係主要 包含-具有-容晶穴之墓板、—影像感測晶片、複數個鲜 線、-點膠攔壤以及一密封膠。丨中，該影像感測晶片設 置於該基板之該容晶穴内並具有—主動面，該影像感測晶 片之該主動面係、約略與該基板之—上表面為共平面。該些 8 1278122 銲線係電性連接該基板與該影像感測晶片。該點膠攔壩係 點膠形成於該基板之該上表面上，以環繞該些銲線。該密 封膠係點膠形成在該影像感測晶片之該主動面上與在該 基板之該上表面上且被該點膠攔壩所限制，以密封該些銲 線。 【實施方式】 在本發明之一具體實施例中，請參閱第3圖，一種影 像感測器之點膠封裝構造2〇〇係主要包含一基板21〇、一 鲁 影像感測晶片220、複數個銲線230、一點膠攔壩24〇以 及一密封膠250。其中該基板21〇係具有一上表面211、 一下表面212以及一容晶穴213，該基板21〇係為具有線 路圖案之陶瓷基板或是BT樹脂基板。複數個連接墊214 係形成於該基板210之該上表面211，該些連接墊214係 ， 可電性連接至在該基板21〇之該下表面212之複數個外接 墊（圖未繪出）。較佳地，該容晶穴213之深度與尺寸係對 φ 應於該影像感測晶片220之厚度與尺寸，以容納該影像感 測晶片220 。 该影像感測晶片220係具有一主動面221及一對應之 煮面222，複數個銲墊223係設置於該主動面221。在本 實施例中，該些銲墊223係鄰近於該主動面221之其中兩 側邊。忒主動面221包含有一感測區224。通常該影像感 測晶片220係為一 CM0S影像感測晶片，該感測區224内 汉有以互補金屬氧化半導體（CM〇s)製程製作之感測元 件。在本實施例中，在該影像感測晶片22〇之該主動面 9 1278122 上係已設置有一透光片260，以遮護該影像感測晶片220 之該感測區224。此外，該影像感測晶片220之該背面222 係以例如黏膠、膠帶或共晶接合層等黏著層（圖未繪出）貼 附於該基板210之該容晶穴213之底面，且該基板210之 該容晶穴213之深度係約等同或約大於該影像感測晶片 220之厚度。當該影像感測晶片220設置於該基板210之 該容晶穴213内，該影像感測晶片220之該主動面221係 約略與該基板210之該上表面211為共平面，以利該點膠 > 攔壩240與該密封膠250之點膠形成以及縮短該些銲線 230之線長及打線弧高，該些銲線23〇係電性連接該基板 210之該些連接墊214與該影像感測晶片220之該些銲墊 223 〇 清參閱第3圖及第4A、4B圖，第4A及4B圖係為該 、影像感測器之點膠封裝構造200之製造過程上視圖，如第 3及4A圖所示，該影像感測晶片22〇係設置於該基板21〇 _ 之該容晶穴213中，並且該些銲線230係電性連接該些連 接墊214與該些銲墊223，一較高黏度之點塗膠體係點膠 形成於4基板210之該上表面211上，以形成環繞該些銲 線230之该點膠攔壩24〇。較佳地，該點膠攔壩2川可更 延伸至該影像感測晶片220之該主動面221上，例如可呈 门」形（如第4A圖所示），在本實施例中，呈「门」形 之I點膠攔壩24G之兩端係延伸至該影像感測日日日片22〇之 5亥主動面221，以縮小該點膠攔塌240環繞該些銲線23〇 之面積其係可以節省該密封膠250之點膠用量。之後，請 10 1278122 參閱第3及4B圖，利用一較高流動度之點塗膠體點膠形 成於該影像感測晶片220之該主動面221上與該基板210 之該上表面211上’以形成該密封膠250，並且該密封膠 250係被該點膠攔壩240所限制，以密封該些銲線230。 在上述之§亥影像感測器之點膠封裝構造200中，該影 像感測晶片220係設置於該基板210之該容晶穴213内並 具有該主動面221 ’且δ玄主動面221係約略與該基板21〇 之該上表面211為共平面’以利該點膠攔壩240之點膠形 > 成以及該密封膠250之點膠形成，其係解決習知因基板與 影像感測晶片之兩度差導致點膠困難之問題。並且該點膠 攔壩240係具有一較佳之點膠攔壩外觀並能以一次點膠形 成以及该饮封膠2 5 0係能以一次點膠形成於該基板21 〇之 该上表面211與§亥影像感測晶片2 2 0之該主動面2 21，以 ' 密封該些銲線230，以有效減少點膠次數。 本發明之保護範圍當視後附之申請專利範圍所界定 者為準，任何熟知此項技藝者，在不脫離本發明之精神和 範圍内所作之任何變化與修改，均屬於本發明之保護範 圍。 【圖式簡單說明】 第1 圖··習知影像感測器之點膠封裝構造之截面示 意圖。 第2A至2D圖：習知影像感測器之點膠封裝構造在製造過 程之上視圖。 第3 圖：依據本發明之一具體實施例，一種影像感 11 1278122 '則器之點膠封裝構造之截面示意圖。 第4A至4B圖：依撼太欢 又據本發明之一具體實施例，該影像感測 器之點膠封裝構造在製造過程之上視圖。【主要元件符號說明】 100影像感測器之點膠封裝構造 110基板 111上表面 120影像感測晶片 121主動面 140點膠攔壩 142第二外膠 151第一内膠 112連接墊 122銲墊 130銲線 141第一外膠 150密封膠 160透光片 200影像感測器之點膠封裝構造 210基板 213容晶穴 220影像感測晶片 223銲墊 152第二内膠 230銲線 260透光 211上表面 214連接墊 221主動面 224感測區 240點膠攔壩 212下表面 222背面 250密封膠 片 12The moving surface is approximately coplanar with the upper surface of the 4 substrate, so the dispensing collapse has a better appearance of dispensing the dam, and the sealing adhesive can be formed on the upper surface of the substrate with a single dispensing and the image. The active surface of the wafer is sensed to seal the bonding wires, which reduces the number of dispensings. A second object of the present invention is to provide a dispensing and packaging structure and method for an image sensor. An image sensing chip is disposed in a cavity of a substrate, and an active surface of the image sensing chip is ^ is common with the upper surface of the substrate, a 'dip dam is formed on the upper surface of the substrate, and the dispensing dam can extend to the active surface of the image sensing wafer. In the form of a "door", the area around the plurality of bonding wires is reduced by the dispensing dam, which can save a glue for the sealing glue to reduce the cost of the dispensing package. According to the present invention, a dispensing structure of an image sensor mainly comprises a tomb with a cavity, an image sensing wafer, a plurality of fresh wires, a dispensing barrier, and a sealant. The image sensing chip is disposed in the cavity of the substrate and has an active surface, and the active surface of the image sensing wafer is approximately coplanar with the upper surface of the substrate. The 8 1278122 bonding wires are electrically connected to the substrate and the image sensing wafer. The dispensing dam is formed on the upper surface of the substrate to surround the bonding wires. The sealant is formed on the active surface of the image sensing wafer and on the upper surface of the substrate and is bounded by the dispensing dam to seal the solder lines. [Embodiment] In an embodiment of the present invention, referring to FIG. 3, a dispensing and packaging structure 2 of an image sensor mainly includes a substrate 21, a image sensing chip 220, and a plurality of A bonding wire 230, a rubber dam 24 〇 and a sealing glue 250. The substrate 21 has an upper surface 211, a lower surface 212, and a cavity 213. The substrate 21 is a ceramic substrate having a line pattern or a BT resin substrate. A plurality of connection pads 214 are formed on the upper surface 211 of the substrate 210. The connection pads 214 are electrically connected to a plurality of external pads on the lower surface 212 of the substrate 21 (not shown). . Preferably, the depth and size of the cavity 213 are determined by the thickness and size of the image sensing wafer 220 to accommodate the image sensing wafer 220. The image sensing wafer 220 has an active surface 221 and a corresponding cooking surface 222, and a plurality of pads 223 are disposed on the active surface 221. In the embodiment, the pads 223 are adjacent to two sides of the active surface 221 . The active surface 221 includes a sensing region 224. Generally, the image sensing chip 220 is a CMOS image sensing wafer, and the sensing region 224 has a sensing element fabricated by a complementary metal oxide semiconductor (CM 〇 s) process. In this embodiment, a light transmissive sheet 260 is disposed on the active surface 9 1278122 of the image sensing wafer 22 to shield the sensing region 224 of the image sensing wafer 220. In addition, the back surface 222 of the image sensing wafer 220 is adhered to the bottom surface of the cavity 213 of the substrate 210 by an adhesive layer (not shown) such as an adhesive, a tape or a eutectic bonding layer. The depth of the cavity 213 of the substrate 210 is approximately equal to or greater than the thickness of the image sensing wafer 220. When the image sensing wafer 220 is disposed in the cavity 213 of the substrate 210, the active surface 221 of the image sensing wafer 220 is approximately coplanar with the upper surface 211 of the substrate 210 to facilitate the point. The glue dam 240 forms a dispensing with the sealant 250 and shortens the line length and the arc height of the bonding wires 230. The bonding wires 23 are electrically connected to the connecting pads 214 of the substrate 210 and The pads 223 of the image sensing wafer 220 are as shown in FIG. 3 and FIGS. 4A and 4B, and FIGS. 4A and 4B are top views of the manufacturing process of the dispensing device 200 of the image sensor. As shown in FIGS. 3 and 4A, the image sensing wafers 22 are disposed in the hole 213 of the substrate 21〇, and the bonding wires 230 are electrically connected to the connection pads 214 and the plurality of bonding pads 214. A pad 223, a higher viscosity point coating system is formed on the upper surface 211 of the 4 substrate 210 to form the dispensing dam 24 around the bonding wires 230. Preferably, the dispensing dam can be extended to the active surface 221 of the image sensing wafer 220, for example, in the form of a gate (as shown in FIG. 4A). In this embodiment, The two ends of the "door" I dispensing dam dam 24G extend to the 5 hai active surface 221 of the image sensing day and day film 22 to reduce the dispensing collapse 240 around the bonding wires 23 The area can save the amount of dispensing of the sealant 250. Thereafter, please refer to FIGS. 3 and 4B, wherein a higher fluidity dot is applied to the active surface 221 of the image sensing wafer 220 and the upper surface 211 of the substrate 210. The sealant 250 is formed and the sealant 250 is restrained by the dispensing dam 240 to seal the weld lines 230. The image sensing wafer 220 is disposed in the cavity 213 of the substrate 210 and has the active surface 221 'and the δ meta-active surface 221 in the dispensing structure 200 of the above-described image sensor. The upper surface 211 of the substrate 21 is approximately coplanar to facilitate the dispensing of the dispensing dam 240 and the dispensing of the sealant 250, which solves the conventional substrate and image sense. Measuring the difference between the two degrees of the wafer leads to the problem of difficulty in dispensing. And the dispensing dam 240 has a better appearance of the dispensing dam and can be formed by a single dispensing and the dispensing glue 250 can be formed on the upper surface 211 of the substrate 21 by a single dispensing. The image is sensed by the active surface 2 21 of the wafer 2' to seal the bonding wires 230 to effectively reduce the number of dispensings. The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a dispensing structure of a conventional image sensor. 2A-2D: A view of a dispensing assembly of a conventional image sensor in a manufacturing process. Figure 3 is a cross-sectional view showing a dispensing structure of an image sensing 11 1278122' in accordance with an embodiment of the present invention. 4A-4B: Depending on the embodiment of the present invention, the dispensing assembly of the image sensor is viewed from above in the manufacturing process. [Main component symbol description] 100 image sensor dispensing structure 110 substrate 111 upper surface 120 image sensing wafer 121 active surface 140 dispensing dam 142 second outer glue 151 first inner glue 112 connection pad 122 pad 130 wire 141 first outer glue 150 sealant 160 light transmissive film 200 image sensor dispensing structure 210 substrate 213 cavity hole 220 image sensing wafer 223 pad 152 second inner glue 230 wire 260 light transmission 211 upper surface 214 connecting pad 221 active surface 224 sensing area 240 dispensing dam 212 lower surface 222 back 250 sealing film 12