TWI563646B - Chip scale package of image sensor having dam combination - Google Patents

Chip scale package of image sensor having dam combination

Info

Publication number
TWI563646B
TWI563646B TW103130623A TW103130623A TWI563646B TW I563646 B TWI563646 B TW I563646B TW 103130623 A TW103130623 A TW 103130623A TW 103130623 A TW103130623 A TW 103130623A TW I563646 B TWI563646 B TW I563646B
Authority
TW
Taiwan
Prior art keywords
image sensor
chip scale
scale package
dam combination
dam
Prior art date
Application number
TW103130623A
Other languages
Chinese (zh)
Other versions
TW201611253A (en
Inventor
Shou Chian Hsu
Wei Chun Chao
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW103130623A priority Critical patent/TWI563646B/en
Publication of TW201611253A publication Critical patent/TW201611253A/en
Application granted granted Critical
Publication of TWI563646B publication Critical patent/TWI563646B/en

Links

TW103130623A 2014-09-04 2014-09-04 Chip scale package of image sensor having dam combination TWI563646B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103130623A TWI563646B (en) 2014-09-04 2014-09-04 Chip scale package of image sensor having dam combination

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103130623A TWI563646B (en) 2014-09-04 2014-09-04 Chip scale package of image sensor having dam combination

Publications (2)

Publication Number Publication Date
TW201611253A TW201611253A (en) 2016-03-16
TWI563646B true TWI563646B (en) 2016-12-21

Family

ID=56085261

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103130623A TWI563646B (en) 2014-09-04 2014-09-04 Chip scale package of image sensor having dam combination

Country Status (1)

Country Link
TW (1) TWI563646B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200701482A (en) * 2005-06-17 2007-01-01 Advanced Semiconductor Eng Dispensing package of image sensor and its method
TW200933773A (en) * 2007-12-12 2009-08-01 Stats Chippac Ltd Integrated circuit package system with interconnect lock
TW200952133A (en) * 2008-04-29 2009-12-16 Omnivision Tech Inc Apparatus and method for using spacer paste to package an image sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200701482A (en) * 2005-06-17 2007-01-01 Advanced Semiconductor Eng Dispensing package of image sensor and its method
TW200933773A (en) * 2007-12-12 2009-08-01 Stats Chippac Ltd Integrated circuit package system with interconnect lock
TW200952133A (en) * 2008-04-29 2009-12-16 Omnivision Tech Inc Apparatus and method for using spacer paste to package an image sensor

Also Published As

Publication number Publication date
TW201611253A (en) 2016-03-16

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