TWI563646B - Chip scale package of image sensor having dam combination - Google Patents
Chip scale package of image sensor having dam combinationInfo
- Publication number
- TWI563646B TWI563646B TW103130623A TW103130623A TWI563646B TW I563646 B TWI563646 B TW I563646B TW 103130623 A TW103130623 A TW 103130623A TW 103130623 A TW103130623 A TW 103130623A TW I563646 B TWI563646 B TW I563646B
- Authority
- TW
- Taiwan
- Prior art keywords
- image sensor
- chip scale
- scale package
- dam combination
- dam
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103130623A TWI563646B (en) | 2014-09-04 | 2014-09-04 | Chip scale package of image sensor having dam combination |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103130623A TWI563646B (en) | 2014-09-04 | 2014-09-04 | Chip scale package of image sensor having dam combination |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201611253A TW201611253A (en) | 2016-03-16 |
TWI563646B true TWI563646B (en) | 2016-12-21 |
Family
ID=56085261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103130623A TWI563646B (en) | 2014-09-04 | 2014-09-04 | Chip scale package of image sensor having dam combination |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI563646B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200701482A (en) * | 2005-06-17 | 2007-01-01 | Advanced Semiconductor Eng | Dispensing package of image sensor and its method |
TW200933773A (en) * | 2007-12-12 | 2009-08-01 | Stats Chippac Ltd | Integrated circuit package system with interconnect lock |
TW200952133A (en) * | 2008-04-29 | 2009-12-16 | Omnivision Tech Inc | Apparatus and method for using spacer paste to package an image sensor |
-
2014
- 2014-09-04 TW TW103130623A patent/TWI563646B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200701482A (en) * | 2005-06-17 | 2007-01-01 | Advanced Semiconductor Eng | Dispensing package of image sensor and its method |
TW200933773A (en) * | 2007-12-12 | 2009-08-01 | Stats Chippac Ltd | Integrated circuit package system with interconnect lock |
TW200952133A (en) * | 2008-04-29 | 2009-12-16 | Omnivision Tech Inc | Apparatus and method for using spacer paste to package an image sensor |
Also Published As
Publication number | Publication date |
---|---|
TW201611253A (en) | 2016-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1219570A1 (en) | Moving image sensor package | |
GB2548186B (en) | Stacked semiconductor chip RGBZ sensor | |
GB2526440B (en) | Sensor arrangements | |
GB201403389D0 (en) | Sensor | |
TWI563254B (en) | Sensor | |
GB201511366D0 (en) | Integrated circuit package | |
GB201600104D0 (en) | Sensing pad | |
GB201418985D0 (en) | Packaging wearable sensors | |
BR112017000271A2 (en) | electrochemical sensor chip | |
ZA201702626B (en) | Pressure sensitive adhesive compositions | |
EP3186664C0 (en) | Measurement of acceleration | |
HUP1500528A1 (en) | Evaluating sensor device for digitalization of motions | |
SG11201701909PA (en) | Sensor device | |
TWI562342B (en) | Image sensing device | |
KR101653228B9 (en) | Tdi line image sensor | |
GB201407477D0 (en) | Infrared sensor package | |
PL3210535T3 (en) | Device for detection of chewing | |
IL236127A0 (en) | Sensor for detectingearthquakes | |
GB201412136D0 (en) | Sensor | |
GB2543088B (en) | Inhibition of sensor biofouling | |
TWI560812B (en) | Wafer level packaging structure for temperatrue sensing element | |
KR101561920B9 (en) | Semiconductor package | |
TWI563646B (en) | Chip scale package of image sensor having dam combination | |
IL252794B (en) | Sensor array packaging solution | |
GB2528159B (en) | Sensor |