TW200531195A - Bump bonding apparatus and method for inspecting bump non-adhesion - Google Patents

Bump bonding apparatus and method for inspecting bump non-adhesion Download PDF

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Publication number
TW200531195A
TW200531195A TW094101995A TW94101995A TW200531195A TW 200531195 A TW200531195 A TW 200531195A TW 094101995 A TW094101995 A TW 094101995A TW 94101995 A TW94101995 A TW 94101995A TW 200531195 A TW200531195 A TW 200531195A
Authority
TW
Taiwan
Prior art keywords
bump
capillary
sphere
conductor
lead
Prior art date
Application number
TW094101995A
Other languages
English (en)
Chinese (zh)
Inventor
Kuniyuki Takahashi
Fumihiko Kato
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200531195A publication Critical patent/TW200531195A/zh

Links

Classifications

    • H10W72/075—
    • H10W72/012—
    • H10W72/0711—
    • H10W72/01225—
    • H10W72/07141—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/20—
    • H10W72/50—
    • H10W72/536—
    • H10W72/90—
    • H10W72/9415—

Landscapes

  • Wire Bonding (AREA)
TW094101995A 2004-03-03 2005-01-24 Bump bonding apparatus and method for inspecting bump non-adhesion TW200531195A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004059118A JP2005251919A (ja) 2004-03-03 2004-03-03 バンプボンディング装置及びバンプ不着検出方法

Publications (1)

Publication Number Publication Date
TW200531195A true TW200531195A (en) 2005-09-16

Family

ID=34909148

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101995A TW200531195A (en) 2004-03-03 2005-01-24 Bump bonding apparatus and method for inspecting bump non-adhesion

Country Status (4)

Country Link
US (1) US20050194422A1 (OSRAM)
JP (1) JP2005251919A (OSRAM)
KR (1) KR100628706B1 (OSRAM)
TW (1) TW200531195A (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100720269B1 (ko) * 2006-05-10 2007-05-23 삼성에스디에스 주식회사 Ｒｆｉｄ 태그 라벨 자동 부착시스템 및 그 방법
KR101231192B1 (ko) * 2008-03-19 2013-02-07 삼성테크윈 주식회사 와이어 본딩 모니터링 장치, 와이어 본딩 장비 및 와이어볼의 본딩 높이 값 모니터링 방법
JP2010123817A (ja) * 2008-11-21 2010-06-03 Fujitsu Ltd ワイヤボンディング方法および電子装置とその製造方法
JP2011066191A (ja) * 2009-09-17 2011-03-31 Renesas Electronics Corp 半導体装置の製造方法およびボンディング装置
US9455544B2 (en) * 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
US9604305B2 (en) * 2011-10-26 2017-03-28 GM Global Technology Operations LLC Quality status display for a vibration welding process
KR101620351B1 (ko) * 2012-01-30 2016-05-12 삼성전자주식회사 회로소자의 와이어 본딩 방법
TWI649816B (zh) * 2016-08-23 2019-02-01 日商新川股份有限公司 打線方法與打線裝置
CN112400226B (zh) * 2018-06-29 2024-07-30 库利克和索夫工业公司 焊接线材与焊线机上的焊接位置之间的焊接的检测方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3370556B2 (ja) * 1997-05-14 2003-01-27 株式会社新川 ワイヤボンディング装置及びその制御方法
US6098868A (en) * 1997-05-23 2000-08-08 Masushita Electric Industrial Co., Ltd. Bump forming method and bump bonder
US6237833B1 (en) * 1998-06-15 2001-05-29 Rohm Co., Ltd. Method of checking wirebond condition

Also Published As

Publication number Publication date
KR100628706B1 (ko) 2006-09-29
JP2005251919A (ja) 2005-09-15
US20050194422A1 (en) 2005-09-08
KR20060043245A (ko) 2006-05-15

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