KR100628706B1 - 범프 본딩장치 및 범프 불착 검출방법 - Google Patents

범프 본딩장치 및 범프 불착 검출방법 Download PDF

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Publication number
KR100628706B1
KR100628706B1 KR1020050016556A KR20050016556A KR100628706B1 KR 100628706 B1 KR100628706 B1 KR 100628706B1 KR 1020050016556 A KR1020050016556 A KR 1020050016556A KR 20050016556 A KR20050016556 A KR 20050016556A KR 100628706 B1 KR100628706 B1 KR 100628706B1
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KR
South Korea
Prior art keywords
bump
ball
capillary
wire
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020050016556A
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English (en)
Korean (ko)
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KR20060043245A (ko
Inventor
구니유키 다카하시
후미히코 가토
Original Assignee
가부시키가이샤 신가와
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Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20060043245A publication Critical patent/KR20060043245A/ko
Application granted granted Critical
Publication of KR100628706B1 publication Critical patent/KR100628706B1/ko
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Classifications

    • H10W72/075—
    • H10W72/012—
    • H10W72/0711—
    • H10W72/01225—
    • H10W72/07141—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/20—
    • H10W72/50—
    • H10W72/536—
    • H10W72/90—
    • H10W72/9415—

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  • Wire Bonding (AREA)
KR1020050016556A 2004-03-03 2005-02-28 범프 본딩장치 및 범프 불착 검출방법 Expired - Fee Related KR100628706B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004059118A JP2005251919A (ja) 2004-03-03 2004-03-03 バンプボンディング装置及びバンプ不着検出方法
JPJP-P-2004-00059118 2004-03-03

Publications (2)

Publication Number Publication Date
KR20060043245A KR20060043245A (ko) 2006-05-15
KR100628706B1 true KR100628706B1 (ko) 2006-09-29

Family

ID=34909148

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050016556A Expired - Fee Related KR100628706B1 (ko) 2004-03-03 2005-02-28 범프 본딩장치 및 범프 불착 검출방법

Country Status (4)

Country Link
US (1) US20050194422A1 (OSRAM)
JP (1) JP2005251919A (OSRAM)
KR (1) KR100628706B1 (OSRAM)
TW (1) TW200531195A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130196452A1 (en) * 2012-01-30 2013-08-01 Samsung Electronics Co., Ltd. Wire bonding method in circuit device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100720269B1 (ko) * 2006-05-10 2007-05-23 삼성에스디에스 주식회사 Ｒｆｉｄ 태그 라벨 자동 부착시스템 및 그 방법
KR101231192B1 (ko) * 2008-03-19 2013-02-07 삼성테크윈 주식회사 와이어 본딩 모니터링 장치, 와이어 본딩 장비 및 와이어볼의 본딩 높이 값 모니터링 방법
JP2010123817A (ja) * 2008-11-21 2010-06-03 Fujitsu Ltd ワイヤボンディング方法および電子装置とその製造方法
JP2011066191A (ja) * 2009-09-17 2011-03-31 Renesas Electronics Corp 半導体装置の製造方法およびボンディング装置
US9455544B2 (en) * 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
US9604305B2 (en) * 2011-10-26 2017-03-28 GM Global Technology Operations LLC Quality status display for a vibration welding process
TWI649816B (zh) * 2016-08-23 2019-02-01 日商新川股份有限公司 打線方法與打線裝置
CN112400226B (zh) * 2018-06-29 2024-07-30 库利克和索夫工业公司 焊接线材与焊线机上的焊接位置之间的焊接的检测方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3370556B2 (ja) * 1997-05-14 2003-01-27 株式会社新川 ワイヤボンディング装置及びその制御方法
US6098868A (en) * 1997-05-23 2000-08-08 Masushita Electric Industrial Co., Ltd. Bump forming method and bump bonder
US6237833B1 (en) * 1998-06-15 2001-05-29 Rohm Co., Ltd. Method of checking wirebond condition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130196452A1 (en) * 2012-01-30 2013-08-01 Samsung Electronics Co., Ltd. Wire bonding method in circuit device
US8893953B2 (en) * 2012-01-30 2014-11-25 Samsung Electronics Co., Ltd. Wire bonding method in circuit device

Also Published As

Publication number Publication date
TW200531195A (en) 2005-09-16
JP2005251919A (ja) 2005-09-15
US20050194422A1 (en) 2005-09-08
KR20060043245A (ko) 2006-05-15

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