TW200520036A - Heat treatment apparatus and heat treatment method - Google Patents

Heat treatment apparatus and heat treatment method

Info

Publication number
TW200520036A
TW200520036A TW093133010A TW93133010A TW200520036A TW 200520036 A TW200520036 A TW 200520036A TW 093133010 A TW093133010 A TW 093133010A TW 93133010 A TW93133010 A TW 93133010A TW 200520036 A TW200520036 A TW 200520036A
Authority
TW
Taiwan
Prior art keywords
temperature
specified
treated body
recipe
treatment container
Prior art date
Application number
TW093133010A
Other languages
English (en)
Other versions
TWI355014B (zh
Inventor
Young-Chul Park
Kazuhiro Kawamura
Wen-Ling Wang
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200520036A publication Critical patent/TW200520036A/zh
Application granted granted Critical
Publication of TWI355014B publication Critical patent/TWI355014B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
TW093133010A 2003-10-30 2004-10-29 Heat treatment apparatus and heat treatment method TW200520036A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003371291 2003-10-30
JP2004306040A JP4712343B2 (ja) 2003-10-30 2004-10-20 熱処理装置、熱処理方法、プログラム及び記録媒体

Publications (2)

Publication Number Publication Date
TW200520036A true TW200520036A (en) 2005-06-16
TWI355014B TWI355014B (zh) 2011-12-21

Family

ID=34554755

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133010A TW200520036A (en) 2003-10-30 2004-10-29 Heat treatment apparatus and heat treatment method

Country Status (6)

Country Link
US (1) US20070074660A1 (zh)
EP (1) EP1684336A4 (zh)
JP (1) JP4712343B2 (zh)
KR (1) KR100882633B1 (zh)
TW (1) TW200520036A (zh)
WO (1) WO2005043609A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8211235B2 (en) * 2005-03-04 2012-07-03 Picosun Oy Apparatuses and methods for deposition of material on surfaces
KR100684902B1 (ko) 2005-05-30 2007-02-20 삼성전자주식회사 온도 조절 장치 및 이를 가지는 기판 처리 장치, 그리고상기 장치의 온도를 제어하는 방법
JP4658818B2 (ja) * 2006-01-19 2011-03-23 株式会社山武 温度推定方法および装置
US7869888B2 (en) 2006-05-31 2011-01-11 Tokyo Electron Limited Information processing apparatus, semiconductor manufacturing system, information processing method, and storage medium
JP5040213B2 (ja) * 2006-08-15 2012-10-03 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
JP5005388B2 (ja) * 2007-03-01 2012-08-22 東京エレクトロン株式会社 熱処理システム、熱処理方法、及び、プログラム
JP5106932B2 (ja) * 2007-06-28 2012-12-26 日本エア・リキード株式会社 流体供給システム
JP5028352B2 (ja) * 2007-10-19 2012-09-19 株式会社日立国際電気 温度制御方法、温度補正値取得方法、半導体製造方法、基板処理装置
JP5101243B2 (ja) * 2007-10-29 2012-12-19 東京エレクトロン株式会社 基板処理装置，基板処理装置の制御方法，およびプログラム
US8354135B2 (en) * 2008-03-17 2013-01-15 Tokyo Electron Limited Thermal processing apparatus, method for regulating temperature of thermal processing apparatus, and program
JP5766647B2 (ja) * 2012-03-28 2015-08-19 東京エレクトロン株式会社 熱処理システム、熱処理方法、及び、プログラム
JP6280407B2 (ja) * 2014-03-19 2018-02-14 東京エレクトロン株式会社 基板処理方法、プログラム、制御装置、基板処理装置及び基板処理システム
US10254179B2 (en) 2014-12-25 2019-04-09 Fujitsu Limited Enclosure surface temperature estimation method and electronic apparatus
KR101830124B1 (ko) * 2017-04-06 2018-02-20 (주)앤피에스 기판 처리 장치
CN112530826B (zh) * 2020-11-27 2024-05-17 北京北方华创微电子装备有限公司 半导体热处理设备的承载装置及半导体热处理设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5517594A (en) * 1994-10-17 1996-05-14 Relman, Inc. Thermal reactor optimization
JP3423671B2 (ja) 2000-06-19 2003-07-07 上商株式会社 縦葺き型金属屋根板同士間の連結構造
JP3497450B2 (ja) 2000-07-06 2004-02-16 東京エレクトロン株式会社 バッチ式熱処理装置及びその制御方法
JP4468555B2 (ja) * 2000-07-24 2010-05-26 東京エレクトロン株式会社 熱処理装置および熱処理方法
JP4493192B2 (ja) * 2000-09-13 2010-06-30 東京エレクトロン株式会社 バッチ式熱処理装置及びその制御方法
US7135659B2 (en) * 2001-03-05 2006-11-14 Tokyo Electron Limited Heat treatment method and heat treatment system
JP2003031647A (ja) * 2001-07-19 2003-01-31 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP3836696B2 (ja) * 2001-08-31 2006-10-25 株式会社東芝 半導体製造システムおよび半導体装置の製造方法
JP2003209063A (ja) * 2001-11-08 2003-07-25 Tokyo Electron Ltd 熱処理装置および熱処理方法
JP4276813B2 (ja) * 2002-03-26 2009-06-10 株式会社日立国際電気 熱処理装置および半導体製造方法
JP3802889B2 (ja) * 2003-07-01 2006-07-26 東京エレクトロン株式会社 熱処理装置及びその校正方法

Also Published As

Publication number Publication date
EP1684336A1 (en) 2006-07-26
TWI355014B (zh) 2011-12-21
US20070074660A1 (en) 2007-04-05
WO2005043609A1 (ja) 2005-05-12
EP1684336A4 (en) 2008-01-09
JP4712343B2 (ja) 2011-06-29
KR20060114284A (ko) 2006-11-06
JP2005159317A (ja) 2005-06-16
KR100882633B1 (ko) 2009-02-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees