TW200519978A - Laser-based termination of passive electronic components - Google Patents

Laser-based termination of passive electronic components

Info

Publication number
TW200519978A
TW200519978A TW093133603A TW93133603A TW200519978A TW 200519978 A TW200519978 A TW 200519978A TW 093133603 A TW093133603 A TW 093133603A TW 93133603 A TW93133603 A TW 93133603A TW 200519978 A TW200519978 A TW 200519978A
Authority
TW
Taiwan
Prior art keywords
laser
substrate
major surfaces
selected regions
electronic components
Prior art date
Application number
TW093133603A
Other languages
English (en)
Inventor
Edward J Swenson
Douglas J Garcia
Bruce Stuart Goldwater
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW200519978A publication Critical patent/TW200519978A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)
TW093133603A 2003-11-04 2004-11-04 Laser-based termination of passive electronic components TW200519978A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US51837803P 2003-11-04 2003-11-04

Publications (1)

Publication Number Publication Date
TW200519978A true TW200519978A (en) 2005-06-16

Family

ID=34572993

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133603A TW200519978A (en) 2003-11-04 2004-11-04 Laser-based termination of passive electronic components

Country Status (9)

Country Link
US (1) US7053011B2 (zh)
JP (1) JP2007522644A (zh)
KR (1) KR20060098370A (zh)
CN (1) CN101091225A (zh)
CA (1) CA2544854A1 (zh)
DE (1) DE112004002064T5 (zh)
GB (1) GB2422801B (zh)
TW (1) TW200519978A (zh)
WO (1) WO2005045521A2 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7378337B2 (en) * 2003-11-04 2008-05-27 Electro Scientific Industries, Inc. Laser-based termination of miniature passive electronic components
US20060261924A1 (en) * 2005-05-20 2006-11-23 Swenson Edward J Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam
US8497449B1 (en) * 2006-05-26 2013-07-30 Synchron Laser Service Inc. Micro-machining of ceramics using an ytterbium fiber-laser
US8496866B2 (en) * 2007-04-25 2013-07-30 Ceramtec Gmbh Chip resistor substrate
US7602562B2 (en) 2007-05-21 2009-10-13 Electro Scientific Industries, Inc. Fluid counterbalance for a laser lens used to scribe an electronic component substrate
JP5537081B2 (ja) 2009-07-28 2014-07-02 浜松ホトニクス株式会社 加工対象物切断方法
KR101141457B1 (ko) * 2010-12-08 2012-05-04 삼성전기주식회사 적층 세라믹 콘덴서 및 그 제조방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53146157A (en) * 1977-05-26 1978-12-19 Toyo Dengu Seisakushiyo Kk Method of manufacturing chip resistor
JPS56104407A (en) * 1980-01-24 1981-08-20 Mitsubishi Electric Corp Method of manufacturing chip resistor
ATE56050T1 (de) * 1987-04-24 1990-09-15 Siemens Ag Verfahren zur herstellung von leiterplatten.
US4928254A (en) * 1988-04-28 1990-05-22 Knudsen Arne K Laser flash thermal conductivity apparatus and method
US5245751A (en) * 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
JPH06132182A (ja) * 1992-10-19 1994-05-13 Tdk Corp 微小電子部品の製造方法
JP3196519B2 (ja) * 1994-09-05 2001-08-06 松下電器産業株式会社 角形薄膜チップ抵抗器の製造方法
US5884391A (en) * 1996-01-22 1999-03-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
US5863331A (en) 1996-07-11 1999-01-26 Braden; Denver IPC (Chip) termination machine
US5896081A (en) * 1997-06-10 1999-04-20 Cyntec Company Resistance temperature detector (RTD) formed with a surface-mount-device (SMD) structure
US6555447B2 (en) * 1999-06-08 2003-04-29 Kulicke & Soffa Investments, Inc. Method for laser scribing of wafers
JP4007798B2 (ja) * 2001-11-15 2007-11-14 三洋電機株式会社 板状体の製造方法およびそれを用いた回路装置の製造方法
US6960366B2 (en) 2002-04-15 2005-11-01 Avx Corporation Plated terminations
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations

Also Published As

Publication number Publication date
CN101091225A (zh) 2007-12-19
DE112004002064T5 (de) 2006-10-05
GB2422801B (en) 2007-03-14
GB0609321D0 (en) 2006-06-21
JP2007522644A (ja) 2007-08-09
US20050099835A1 (en) 2005-05-12
GB2422801A (en) 2006-08-09
KR20060098370A (ko) 2006-09-18
CA2544854A1 (en) 2005-05-19
WO2005045521A2 (en) 2005-05-19
WO2005045521A3 (en) 2007-05-10
US7053011B2 (en) 2006-05-30

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