PL1641572T3 - Laserowe usuwanie warstwy lub powłoki z podłoża - Google Patents

Laserowe usuwanie warstwy lub powłoki z podłoża

Info

Publication number
PL1641572T3
PL1641572T3 PL04743293T PL04743293T PL1641572T3 PL 1641572 T3 PL1641572 T3 PL 1641572T3 PL 04743293 T PL04743293 T PL 04743293T PL 04743293 T PL04743293 T PL 04743293T PL 1641572 T3 PL1641572 T3 PL 1641572T3
Authority
PL
Poland
Prior art keywords
coating
layer
substrate
interface
laser removal
Prior art date
Application number
PL04743293T
Other languages
English (en)
Inventor
Adrian Thomas
Jonathan Davies
Peter Hugh Dickinson
Original Assignee
Spectrum Tech Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0315947A external-priority patent/GB0315947D0/en
Priority claimed from GB0316347A external-priority patent/GB0316347D0/en
Application filed by Spectrum Tech Plc filed Critical Spectrum Tech Plc
Publication of PL1641572T3 publication Critical patent/PL1641572T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning In General (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
PL04743293T 2003-07-08 2004-07-08 Laserowe usuwanie warstwy lub powłoki z podłoża PL1641572T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB0315947A GB0315947D0 (en) 2003-07-08 2003-07-08 Laser removal of layer or coating from a substrate
GB0316347A GB0316347D0 (en) 2003-07-12 2003-07-12 Laser removal of layer or coating from a substrate
PCT/GB2004/002950 WO2005005065A1 (en) 2003-07-08 2004-07-08 Laser removal of layer or coating from a substrate
EP04743293A EP1641572B1 (en) 2003-07-08 2004-07-08 Laser removal of layer or coating from a substrate

Publications (1)

Publication Number Publication Date
PL1641572T3 true PL1641572T3 (pl) 2012-05-31

Family

ID=33566551

Family Applications (1)

Application Number Title Priority Date Filing Date
PL04743293T PL1641572T3 (pl) 2003-07-08 2004-07-08 Laserowe usuwanie warstwy lub powłoki z podłoża

Country Status (10)

Country Link
US (1) US7632420B2 (pl)
EP (1) EP1641572B1 (pl)
JP (1) JP5074026B2 (pl)
KR (1) KR20060036076A (pl)
AT (1) ATE538880T1 (pl)
DK (1) DK1641572T3 (pl)
ES (1) ES2379342T3 (pl)
PL (1) PL1641572T3 (pl)
PT (1) PT1641572E (pl)
WO (1) WO2005005065A1 (pl)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4990057B2 (ja) * 2007-07-30 2012-08-01 中央精機株式会社 車両用ホイールの表面処理方法
DE102008006241A1 (de) * 2008-01-25 2009-07-30 Thyssenkrupp Steel Ag Verfahren und Vorrichtung zum Abtragen einer metallischen Beschichtung
US20100224602A1 (en) * 2009-03-06 2010-09-09 General Electric Company Method and system for removing thermal barrier coating
US10112257B1 (en) * 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
US10100650B2 (en) 2012-06-30 2018-10-16 General Electric Company Process for selectively producing thermal barrier coatings on turbine hardware
KR101433596B1 (ko) * 2012-10-19 2014-08-27 한일튜브 주식회사 자동차용 브레이크 튜브의 코팅층 제거 장치
US10404028B2 (en) 2013-07-22 2019-09-03 Frisimos, Ltd. System for automatic robotic cable connector assembly using a cartridge
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method
EP3111525B1 (en) * 2014-02-24 2020-11-18 Frisimos Ltd. Removing a metal shield from electrical cable
JP6287929B2 (ja) * 2015-03-30 2018-03-07 ブラザー工業株式会社 レーザ加工データ作成装置
EP3455085B1 (en) 2016-05-31 2021-12-01 Corning Incorporated Anti-counterfeiting measures for glass articles
CN106346146B (zh) * 2016-11-04 2018-01-19 中国航空工业集团公司北京航空材料研究院 一种去除金属表面陶瓷涂层的高能短脉冲激光加工方法
RS63750B1 (sr) 2017-08-23 2022-12-30 Komax Holding Ag Postupak za uklanjanje dela zaštitne folije kabla sa izolacijom i plaštom i uređaj za uklanjanje folije za uklanjanje dela zaštitne folije kabla sa izolacijom i plaštom na unapred određenom mestu preloma sa kabla sa izolacijom i plaštom
US11476628B2 (en) 2019-11-12 2022-10-18 Frisimos, Ltd. System for automatic robotic cable connector assembly using a cartridge
CN113927170B (zh) * 2020-07-13 2023-09-12 大族激光科技产业集团股份有限公司 去除产品表面漆层的方法
CN114318195A (zh) * 2020-09-30 2022-04-12 中信戴卡股份有限公司 一种无牺牲层的铝合金车轮的激光冲击延寿方法
CN113118631B (zh) * 2021-03-17 2023-01-17 江苏大学 一种基于激光冲击实现厚涂层去除和基体表面改形改性的方法
CN113853063A (zh) * 2021-09-09 2021-12-28 深圳市海目星激光智能装备股份有限公司 介电材料去除方法、激光去除设备与电子器件
KR102536286B1 (ko) 2022-12-20 2023-05-26 ㈜ 엘에이티 레이저를 이용한 코팅층 제거방법

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JP2683926B2 (ja) * 1988-01-25 1997-12-03 三菱電機株式会社 絶縁被覆電線の被覆剥離方法及びその装置
FR2641718B1 (fr) * 1989-01-17 1992-03-20 Ardt Procede de nettoyage de la surface de matieres solides et dispositif de mise en oeuvre de ce procede, utilisant un laser impulsionnel de puissance, a impulsions courtes, dont on focalise le faisceau sur la surface a nettoyer
FR2692822B1 (fr) 1992-06-25 1997-08-29 Bm Ind Source laser pour l'eradication photonique a ondes multiples.
JPH0638330A (ja) * 1992-07-17 1994-02-10 Furukawa Electric Co Ltd:The 絶縁電線のエナメル皮膜の剥離方法
JPH06114413A (ja) * 1992-10-07 1994-04-26 Kawasaki Steel Corp 圧延用ロールの製造方法
US5620754A (en) * 1994-01-21 1997-04-15 Qqc, Inc. Method of treating and coating substrates
JPH07240543A (ja) * 1994-02-25 1995-09-12 Sumitomo Electric Ind Ltd 成膜用基板に段差を形成する方法
JPH08182142A (ja) * 1994-12-26 1996-07-12 Fujikura Ltd レーザ加工方法
EP0905762A1 (en) * 1997-09-30 1999-03-31 STMicroelectronics S.r.l. Method for removing moulding residues in the fabrication of plastic packages for semiconductor devices
DE19801013B4 (de) 1998-01-14 2005-06-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Abtragung von Oberflächenschichten mittels deckschichtenverstärkter laserinduzierter Schockwellen
US6210514B1 (en) * 1998-02-11 2001-04-03 Xerox Corporation Thin film structure machining and attachment
FR2777810B1 (fr) * 1998-04-28 2000-05-19 Air Liquide Procede et dispositif de traitement de la surface interne d'une bouteille de gaz
JPH11332051A (ja) * 1998-05-12 1999-11-30 Olympus Optical Co Ltd レーザ被覆除去装置
JP4441102B2 (ja) * 1999-11-22 2010-03-31 キヤノン株式会社 光起電力素子及びその製造方法
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JP2002359381A (ja) * 2001-05-31 2002-12-13 Canon Inc 光起電力素子及びその製造方法

Also Published As

Publication number Publication date
EP1641572B1 (en) 2011-12-28
DK1641572T3 (da) 2012-04-02
US20050006345A1 (en) 2005-01-13
PT1641572E (pt) 2012-03-22
ATE538880T1 (de) 2012-01-15
ES2379342T3 (es) 2012-04-25
WO2005005065A1 (en) 2005-01-20
JP2007516083A (ja) 2007-06-21
KR20060036076A (ko) 2006-04-27
EP1641572A1 (en) 2006-04-05
JP5074026B2 (ja) 2012-11-14
US7632420B2 (en) 2009-12-15

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