JPWO2020222090A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2020222090A5 JPWO2020222090A5 JP2021563721A JP2021563721A JPWO2020222090A5 JP WO2020222090 A5 JPWO2020222090 A5 JP WO2020222090A5 JP 2021563721 A JP2021563721 A JP 2021563721A JP 2021563721 A JP2021563721 A JP 2021563721A JP WO2020222090 A5 JPWO2020222090 A5 JP WO2020222090A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive
- conductive material
- printed
- liquid support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962841349P | 2019-05-01 | 2019-05-01 | |
| US62/841,349 | 2019-05-01 | ||
| PCT/IB2020/053827 WO2020222090A1 (en) | 2019-05-01 | 2020-04-22 | Method to electrically connect chip with top connectors using 3d printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022531153A JP2022531153A (ja) | 2022-07-06 |
| JPWO2020222090A5 true JPWO2020222090A5 (zh) | 2023-05-01 |
Family
ID=70617163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021563721A Pending JP2022531153A (ja) | 2019-05-01 | 2020-04-22 | ３ｄ印刷を用いてチップをトップコネクタと電気接続する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20200350275A1 (zh) |
| EP (1) | EP3939394A1 (zh) |
| JP (1) | JP2022531153A (zh) |
| KR (1) | KR20220004975A (zh) |
| CN (1) | CN113906834A (zh) |
| WO (1) | WO2020222090A1 (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11446750B2 (en) | 2020-02-03 | 2022-09-20 | Io Tech Group Ltd. | Systems for printing solder paste and other viscous materials at high resolution |
| US11622451B2 (en) | 2020-02-26 | 2023-04-04 | Io Tech Group Ltd. | Systems and methods for solder paste printing on components |
| US11497124B2 (en) | 2020-06-09 | 2022-11-08 | Io Tech Group Ltd. | Methods for printing conformal materials on component edges at high resolution |
| US11691332B2 (en) | 2020-08-05 | 2023-07-04 | Io Tech Group Ltd. | Systems and methods for 3D printing with vacuum assisted laser printing machine |
| US11877398B2 (en) | 2021-02-11 | 2024-01-16 | Io Tech Group Ltd. | PCB production by laser systems |
| WO2022172200A1 (en) * | 2021-02-11 | 2022-08-18 | Io Tech Group Ltd. | Pcb production by laser systems |
| US20230240022A1 (en) * | 2022-01-27 | 2023-07-27 | Io Tech Group Ltd. | Hybrid process for pcb production by lad system |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01221466A (ja) | 1988-03-01 | 1989-09-04 | Toa Nenryo Kogyo Kk | コーティング用組成物及びコーティング方法 |
| US5204055A (en) | 1989-12-08 | 1993-04-20 | Massachusetts Institute Of Technology | Three-dimensional printing techniques |
| US5506607A (en) | 1991-01-25 | 1996-04-09 | Sanders Prototypes Inc. | 3-D model maker |
| US5740051A (en) | 1991-01-25 | 1998-04-14 | Sanders Prototypes, Inc. | 3-D model making |
| US5436083A (en) | 1994-04-01 | 1995-07-25 | Dow Corning Corporation | Protective electronic coatings using filled polysilazanes |
| NL1008460C2 (nl) | 1998-03-03 | 1999-09-06 | Acheson Colloiden B V | Geleidende inkt of verf. |
| DE10210146A1 (de) | 2002-03-07 | 2003-09-25 | Aurentum Innovationstechnologi | Qualitätsdruckverfahren und Druckmaschine sowie Drucksbustanz hierfür |
| US7030680B2 (en) * | 2003-02-26 | 2006-04-18 | Integrated Discrete Devices, Llc | On chip power supply |
| JP3858902B2 (ja) | 2004-03-03 | 2006-12-20 | 住友電気工業株式会社 | 導電性銀ペーストおよびその製造方法 |
| US7658603B2 (en) | 2005-03-31 | 2010-02-09 | Board Of Regents, The University Of Texas System | Methods and systems for integrating fluid dispensing technology with stereolithography |
| US20090110843A1 (en) * | 2005-08-17 | 2009-04-30 | Izhar Halahmi | Thermosetting ink formulation for ink-jet applications |
| EP1937785A1 (en) * | 2005-08-31 | 2008-07-02 | Printar Ltd. | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
| US7528017B2 (en) * | 2005-12-07 | 2009-05-05 | Kovio, Inc. | Method of manufacturing complementary diodes |
| US8728589B2 (en) | 2007-09-14 | 2014-05-20 | Photon Dynamics, Inc. | Laser decal transfer of electronic materials |
| US8056222B2 (en) * | 2008-02-20 | 2011-11-15 | The United States Of America, As Represented By The Secretary Of The Navy | Laser-based technique for the transfer and embedding of electronic components and devices |
| TWI436699B (zh) * | 2010-07-12 | 2014-05-01 | Princo Corp | 多層導通孔疊構 |
| EP2487215B1 (en) | 2011-02-11 | 2013-07-24 | Henkel AG & Co. KGaA | Electrically conductive adhesives comprising at least one metal precursor |
| WO2012142177A2 (en) * | 2011-04-11 | 2012-10-18 | Ndsu Research Foundation | Selective laser-assisted transfer of discrete components |
| DE102011083627A1 (de) * | 2011-09-28 | 2013-03-28 | Continental Automotive Gmbh | Verfahren zur Kontaktierung eines elektronischen Bauteils und Baugruppe mit einem elektronischen Bauteil auf einem Substrat |
| JP5693515B2 (ja) | 2012-01-10 | 2015-04-01 | エイチズィーオー・インコーポレーテッド | 内部耐水性被覆を備える電子デバイス |
| CN104853693B (zh) | 2012-11-14 | 2018-06-26 | 邓特斯普里国际公司 | 用于生产牙科产品的三维制作材料体系 |
| KR101962749B1 (ko) | 2013-01-23 | 2019-03-28 | 헨켈 아이피 앤드 홀딩 게엠베하 | 가요성 전도성 잉크 |
| US9099575B2 (en) * | 2013-07-16 | 2015-08-04 | Cree, Inc. | Solid state lighting devices and fabrication methods including deposited light-affecting elements |
| JP6665386B2 (ja) * | 2013-12-15 | 2020-03-13 | オーボテック リミテッド | プリント回路配線の修復 |
| WO2015181810A1 (en) | 2014-05-27 | 2015-12-03 | Orbotech Ltd. | Printing of 3d structures by laser-induced forward transfer |
| CN106664803B (zh) | 2014-06-13 | 2019-12-17 | Hzo股份有限公司 | 可以穿过其建立电连接的不渗透保护涂层以及包括不渗透保护涂层的电子设备 |
| EP3177965A4 (en) | 2014-08-07 | 2018-03-14 | Orbotech Ltd. | Lift printing system |
| NZ745229A (en) * | 2016-02-24 | 2019-12-20 | Magic Leap Inc | Low profile interconnect for light emitter |
| CA3019902C (en) * | 2016-03-16 | 2022-06-21 | Ncc Nano, Llc | Method for depositing a functional material on a substrate |
| EP3478034A4 (en) * | 2016-06-28 | 2019-07-03 | Fuji Corporation | SWITCHING PROCESS |
| EP3282453B1 (en) * | 2016-08-11 | 2023-07-12 | Henkel AG & Co. KGaA | Improved processing of polymer based inks and pastes |
| EP3333230A1 (en) * | 2016-12-08 | 2018-06-13 | Henkel AG & Co. KGaA | A composition suitable for application with laser induced forward transfer (lift) |
| WO2018136480A1 (en) * | 2017-01-18 | 2018-07-26 | Sun Chemical Corporation | Uv-led dielectric ink for printed electronics applications |
| TW201901887A (zh) * | 2017-05-24 | 2019-01-01 | 以色列商奧寶科技股份有限公司 | 於未事先圖樣化基板上電器互連電路元件 |
| EP3468312B1 (en) * | 2017-10-06 | 2023-11-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a component carrier having a three dimensionally printed wiring structure |
-
2020
- 2020-04-22 US US15/929,281 patent/US20200350275A1/en active Pending
- 2020-04-22 WO PCT/IB2020/053827 patent/WO2020222090A1/en active Search and Examination
- 2020-04-22 CN CN202080032604.8A patent/CN113906834A/zh active Pending
- 2020-04-22 EP EP20724936.8A patent/EP3939394A1/en active Pending
- 2020-04-22 JP JP2021563721A patent/JP2022531153A/ja active Pending
- 2020-04-22 KR KR1020217033989A patent/KR20220004975A/ko unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI432921B (zh) | 具有圖案指向層之施體膜 | |
| US7713788B2 (en) | Method of manufacturing semiconductor package using redistribution substrate | |
| JP2022531153A (ja) | ３ｄ印刷を用いてチップをトップコネクタと電気接続する方法 | |
| TWI661752B (zh) | 用於製造脈衝模式之直接寫入雷射金屬化之方法及系統 | |
| KR20090082503A (ko) | 페이스트 패턴 형성 방법 및 그에 사용되는 전사 필름 | |
| US7297285B2 (en) | Manufacturing process of emboss type flexible or rigid printed circuit board | |
| KR20120007381A (ko) | 패턴 제조 방법 | |
| JPWO2020222090A5 (zh) | ||
| JP2017501431A (ja) | 基板上にパターン化された構造を形成するための方法およびシステム | |
| JP2010118633A (ja) | 埋込み型ソルダーバンプを持つプリント基板及びその製造方法 | |
| KR100838344B1 (ko) | 펄스 레이저를 이용한 나노입자 패터닝 방법 | |
| US20180240772A1 (en) | Electronic Device By Laser-Induced Forming and Transfer of Shaped Metallic Interconnects | |
| US10622244B2 (en) | Pulsed-mode direct-write laser metallization | |
| CN109830469A (zh) | 半导体封装件及其制造方法 | |
| KR102244094B1 (ko) | 임베디드 경화 영역 내의 열경화성 재료의 경화 | |
| US10658201B2 (en) | Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device | |
| JP2003059969A (ja) | 物質の追加を必要としない溶接による接続サポートに構成部分を付着する方法 | |
| JP2007250619A (ja) | 導電性材料、この導電性材料を用いた電子部品実装構造体および配線基板ならびにそれらの製造方法 | |
| KR20140140188A (ko) | 도너기판 및 이의 제조방법 및 이를 이용한 전사패턴 형성방법 | |
| KR102212422B1 (ko) | 희생층을 이용한 광 유도 전사 방법 | |
| JP5104799B2 (ja) | 感光性レジスト保護用テープと半導パッケージ基板の製造方法および半導体パッケージ基板 | |
| TWI333402B (en) | Method for producing electro-optical circuit board | |
| JP3643636B2 (ja) | 光起電力装置用基板の製造方法及び光起電力装置の製造方法 | |
| KR20230060462A (ko) | 다층의 박막 fpcb 및 히터 제작방법 | |
| JP2004281657A (ja) | 導電層の形成方法 |