TW200519526A - Method and apparatus for performing model based placement of phase-balanced scattering bars for sub-wavelength optical lithography - Google Patents

Method and apparatus for performing model based placement of phase-balanced scattering bars for sub-wavelength optical lithography

Info

Publication number
TW200519526A
TW200519526A TW093126696A TW93126696A TW200519526A TW 200519526 A TW200519526 A TW 200519526A TW 093126696 A TW093126696 A TW 093126696A TW 93126696 A TW93126696 A TW 93126696A TW 200519526 A TW200519526 A TW 200519526A
Authority
TW
Taiwan
Prior art keywords
phase
features
assist features
interference
sub
Prior art date
Application number
TW093126696A
Other languages
English (en)
Inventor
Xuelong Shi
Jang-Fung Chen
Thomas Laidig
Kurt E Wampler
Den Broeke Douglas Van
Original Assignee
Asml Masktools Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Masktools Bv filed Critical Asml Masktools Bv
Publication of TW200519526A publication Critical patent/TW200519526A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW093126696A 2003-09-05 2004-09-03 Method and apparatus for performing model based placement of phase-balanced scattering bars for sub-wavelength optical lithography TW200519526A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50026003P 2003-09-05 2003-09-05

Publications (1)

Publication Number Publication Date
TW200519526A true TW200519526A (en) 2005-06-16

Family

ID=34135370

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093126696A TW200519526A (en) 2003-09-05 2004-09-03 Method and apparatus for performing model based placement of phase-balanced scattering bars for sub-wavelength optical lithography

Country Status (8)

Country Link
US (1) US7550235B2 (zh)
EP (1) EP1513012B1 (zh)
JP (1) JP4659425B2 (zh)
KR (1) KR20050025095A (zh)
CN (1) CN100465789C (zh)
DE (1) DE602004011860T2 (zh)
SG (1) SG109607A1 (zh)
TW (1) TW200519526A (zh)

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US9223911B2 (en) 2014-01-30 2015-12-29 Globalfoundries Inc. Optical model employing phase transmission values for sub-resolution assist features
US9310674B2 (en) 2014-02-20 2016-04-12 International Business Machines Corporation Mask that provides improved focus control using orthogonal edges
KR102238742B1 (ko) * 2014-09-11 2021-04-12 삼성전자주식회사 마스크 패턴의 측정 관심 영역 그룹화 방법 및 이를 이용한 마스크 패턴의 선폭 계측 방법
CN104391425B (zh) * 2014-10-20 2019-01-22 中国科学院微电子研究所 一种小间隙平面电极的制作方法
KR102335186B1 (ko) * 2014-12-24 2021-12-03 삼성전자주식회사 렌즈 조립체, 이를 이용한 장애물 감지유닛, 및 이를 구비한 이동로봇
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Also Published As

Publication number Publication date
SG109607A1 (en) 2005-03-30
DE602004011860D1 (de) 2008-04-03
KR20050025095A (ko) 2005-03-11
JP2005122163A (ja) 2005-05-12
US7550235B2 (en) 2009-06-23
EP1513012A3 (en) 2006-02-22
US20050142449A1 (en) 2005-06-30
EP1513012B1 (en) 2008-02-20
DE602004011860T2 (de) 2009-02-12
CN1664702A (zh) 2005-09-07
JP4659425B2 (ja) 2011-03-30
EP1513012A2 (en) 2005-03-09
CN100465789C (zh) 2009-03-04

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