TW200517024A - Both-sided wiring circuit board - Google Patents
Both-sided wiring circuit boardInfo
- Publication number
- TW200517024A TW200517024A TW093132675A TW93132675A TW200517024A TW 200517024 A TW200517024 A TW 200517024A TW 093132675 A TW093132675 A TW 093132675A TW 93132675 A TW93132675 A TW 93132675A TW 200517024 A TW200517024 A TW 200517024A
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring circuit
- circuit board
- hole
- sided wiring
- electronic component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003383228A JP2005150263A (ja) | 2003-11-13 | 2003-11-13 | 両面配線回路基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200517024A true TW200517024A (en) | 2005-05-16 |
Family
ID=34431467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093132675A TW200517024A (en) | 2003-11-13 | 2004-10-28 | Both-sided wiring circuit board |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050103524A1 (zh) |
EP (1) | EP1531658A1 (zh) |
JP (1) | JP2005150263A (zh) |
KR (1) | KR20050046565A (zh) |
CN (1) | CN1617657A (zh) |
TW (1) | TW200517024A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI506748B (zh) * | 2012-06-20 | 2015-11-01 | Zhen Ding Technology Co Ltd | 封裝基板、其製作方法及封裝結構 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100786156B1 (ko) * | 2004-07-06 | 2007-12-18 | 동경 엘렉트론 주식회사 | 인터포저 및 인터포저의 제조 방법 |
US7404251B2 (en) | 2006-04-18 | 2008-07-29 | International Business Machines Corporation | Manufacture of printed circuit boards with stubless plated through-holes |
US9930789B2 (en) | 2010-04-12 | 2018-03-27 | Seagate Technology Llc | Flexible printed circuit cable with multi-layer interconnection and method of forming the same |
CN101958299B (zh) * | 2010-09-04 | 2011-12-21 | 江苏长电科技股份有限公司 | 双面图形芯片直接置放先镀后刻单颗封装方法 |
CN102573273A (zh) * | 2010-12-27 | 2012-07-11 | 佛山市顺德区顺达电脑厂有限公司 | Pth通孔结构 |
CN113395817B (zh) * | 2020-03-13 | 2023-03-24 | 重庆达方电子有限公司 | 薄膜电路板 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2059425A1 (de) * | 1970-12-02 | 1972-06-22 | Siemens Ag | Partieller Aufbau von gedruckten Mehrlagenschaltungen |
US4991290A (en) * | 1988-07-21 | 1991-02-12 | Microelectronics And Computer Technology | Flexible electrical interconnect and method of making |
US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
US5497546A (en) * | 1992-09-21 | 1996-03-12 | Matsushita Electric Works, Ltd. | Method for mounting lead terminals to circuit board |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US5585675A (en) * | 1994-05-11 | 1996-12-17 | Harris Corporation | Semiconductor die packaging tub having angularly offset pad-to-pad via structure configured to allow three-dimensional stacking and electrical interconnections among multiple identical tubs |
US5621193A (en) * | 1995-05-23 | 1997-04-15 | Northrop Grumman Corporation | Ceramic edge connect process |
EP0918371B1 (en) * | 1996-08-08 | 2007-11-14 | Nitto Denko Corporation | Anisotropic conductive film and method for manufacturing the same |
JPH10275966A (ja) * | 1997-01-30 | 1998-10-13 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
US6620731B1 (en) * | 1997-12-18 | 2003-09-16 | Micron Technology, Inc. | Method for fabricating semiconductor components and interconnects with contacts on opposing sides |
US6197664B1 (en) * | 1999-01-12 | 2001-03-06 | Fujitsu Limited | Method for electroplating vias or through holes in substrates having conductors on both sides |
US6039889A (en) * | 1999-01-12 | 2000-03-21 | Fujitsu Limited | Process flows for formation of fine structure layer pairs on flexible films |
US6774315B1 (en) * | 2000-05-24 | 2004-08-10 | International Business Machines Corporation | Floating interposer |
JP4129971B2 (ja) * | 2000-12-01 | 2008-08-06 | 新光電気工業株式会社 | 配線基板の製造方法 |
JP4052434B2 (ja) * | 2001-02-05 | 2008-02-27 | Tdk株式会社 | 多層基板及びその製造方法 |
JP2003046250A (ja) * | 2001-02-28 | 2003-02-14 | Furukawa Electric Co Ltd:The | ビア付きビルドアップ用多層基板及びその製造方法 |
JP4923336B2 (ja) * | 2001-04-10 | 2012-04-25 | 日本電気株式会社 | 回路基板及び該回路基板を用いた電子機器 |
DE10126655A1 (de) * | 2001-06-01 | 2002-12-05 | Endress & Hauser Gmbh & Co Kg | Leiterplatte mit mindestens einem elektronischen Bauteil |
WO2003007370A1 (en) * | 2001-07-12 | 2003-01-23 | Hitachi, Ltd. | Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor |
TWI256719B (en) * | 2002-03-06 | 2006-06-11 | Via Tech Inc | Semiconductor device package module and manufacturing method thereof |
JP2003283085A (ja) * | 2002-03-26 | 2003-10-03 | Nec Kansai Ltd | 配線基板 |
US6790305B2 (en) * | 2002-10-08 | 2004-09-14 | International Business Machines Corporation | Method and structure for small pitch z-axis electrical interconnections |
-
2003
- 2003-11-13 JP JP2003383228A patent/JP2005150263A/ja active Pending
-
2004
- 2004-10-28 TW TW093132675A patent/TW200517024A/zh unknown
- 2004-11-02 EP EP04025925A patent/EP1531658A1/en not_active Withdrawn
- 2004-11-11 KR KR1020040091687A patent/KR20050046565A/ko not_active Application Discontinuation
- 2004-11-12 CN CNA2004100957940A patent/CN1617657A/zh active Pending
- 2004-11-12 US US10/985,964 patent/US20050103524A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI506748B (zh) * | 2012-06-20 | 2015-11-01 | Zhen Ding Technology Co Ltd | 封裝基板、其製作方法及封裝結構 |
Also Published As
Publication number | Publication date |
---|---|
JP2005150263A (ja) | 2005-06-09 |
KR20050046565A (ko) | 2005-05-18 |
US20050103524A1 (en) | 2005-05-19 |
CN1617657A (zh) | 2005-05-18 |
EP1531658A1 (en) | 2005-05-18 |
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