TW200512921A - Surface mount multichip devices - Google Patents
Surface mount multichip devicesInfo
- Publication number
- TW200512921A TW200512921A TW093120813A TW93120813A TW200512921A TW 200512921 A TW200512921 A TW 200512921A TW 093120813 A TW093120813 A TW 093120813A TW 93120813 A TW93120813 A TW 93120813A TW 200512921 A TW200512921 A TW 200512921A
- Authority
- TW
- Taiwan
- Prior art keywords
- chips
- surface mount
- lead
- header
- multichip devices
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/4005—Shape
- H01L2224/4007—Shape of bonding interfaces, e.g. interlocking features
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/916—Narrow band gap semiconductor material, <<1ev
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/617,343 US6919625B2 (en) | 2003-07-10 | 2003-07-10 | Surface mount multichip devices |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200512921A true TW200512921A (en) | 2005-04-01 |
TWI349356B TWI349356B (en) | 2011-09-21 |
Family
ID=33564944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093120813A TWI349356B (en) | 2003-07-10 | 2004-07-12 | Surface mount multichip devices |
Country Status (4)
Country | Link |
---|---|
US (3) | US6919625B2 (zh) |
CN (1) | CN100418214C (zh) |
TW (1) | TWI349356B (zh) |
WO (1) | WO2005008728A2 (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6992250B2 (en) * | 2004-02-26 | 2006-01-31 | Kyocera Corporation | Electronic component housing package and electronic apparatus |
JP2005294494A (ja) * | 2004-03-31 | 2005-10-20 | Toshiba Corp | 光半導体装置及びその製造方法 |
US20050224925A1 (en) * | 2004-04-01 | 2005-10-13 | Peter Chou | Lead frame having a tilt flap for locking molding compound and semiconductor device having the same |
US7230333B2 (en) | 2005-04-21 | 2007-06-12 | International Rectifier Corporation | Semiconductor package |
US20070130759A1 (en) * | 2005-06-15 | 2007-06-14 | Gem Services, Inc. | Semiconductor device package leadframe formed from multiple metal layers |
JP4471967B2 (ja) * | 2006-12-28 | 2010-06-02 | 株式会社ルネサステクノロジ | 双方向スイッチモジュール |
JP4634498B2 (ja) * | 2008-11-28 | 2011-02-16 | 三菱電機株式会社 | 電力用半導体モジュール |
EP2581937B1 (en) * | 2010-06-11 | 2017-09-06 | Panasonic Intellectual Property Management Co., Ltd. | Resin-sealed semiconductor device and method for manufacturing same |
US8638535B2 (en) * | 2011-01-10 | 2014-01-28 | Hamilton Sundstrand Corporation | Vertical mount transient voltage suppressor array |
CN102693952B (zh) * | 2011-03-24 | 2015-12-09 | 比亚迪股份有限公司 | 一种tvs二极管的封装结构及制作方法 |
US8966868B2 (en) * | 2011-05-09 | 2015-03-03 | Abbott Cardiovascular Systems Inc. | Methods of stabilizing molecular weight of polymer stents after sterilization |
US8835976B2 (en) | 2012-03-14 | 2014-09-16 | General Electric Company | Method and system for ultra miniaturized packages for transient voltage suppressors |
US9042072B2 (en) | 2012-03-30 | 2015-05-26 | General Electric Company | Method and system for lightning protection with distributed transient voltage suppression |
US9041188B2 (en) * | 2012-11-10 | 2015-05-26 | Vishay General Semiconductor Llc | Axial semiconductor package |
KR101407273B1 (ko) * | 2012-12-18 | 2014-06-13 | (주) 알에프세미 | 서지 보호용 반도체 장치 및 그 제조방법 |
CN103137646A (zh) * | 2013-03-15 | 2013-06-05 | 中国科学院微电子研究所 | 用于双极型阻变存储器交叉阵列集成方式的选通器件单元 |
US8987858B2 (en) | 2013-03-18 | 2015-03-24 | General Electric Company | Method and system for transient voltage suppression |
CN104124222B (zh) * | 2013-04-24 | 2017-04-05 | 太仓天宇电子有限公司 | 一种微型超薄单向整流桥器件及其加工工艺 |
CN104465632A (zh) * | 2014-07-21 | 2015-03-25 | 孙巍巍 | 一种新型tvs晶片封装方法 |
CA2914014A1 (en) * | 2014-12-04 | 2016-06-04 | Rehrig Pacific Company | Beverage crate |
TWI564997B (zh) * | 2015-06-12 | 2017-01-01 | 萬國半導體股份有限公司 | 功率半導體裝置及其製備方法 |
CN109565175B (zh) * | 2016-09-05 | 2021-06-11 | 力特半导体(无锡)有限公司 | 具有嵌入式熔断器的浪涌保护装置 |
CN106783782A (zh) * | 2017-01-11 | 2017-05-31 | 广东百圳君耀电子有限公司 | 多引脚贴片元件及其制作方法 |
CN107316859A (zh) * | 2017-08-07 | 2017-11-03 | 捷捷半导体有限公司 | 一种双芯片横向串联型的二极管封装结构和制造方法 |
CN108878270A (zh) * | 2017-11-09 | 2018-11-23 | 上海长园维安微电子有限公司 | 一种高功率密度tvs器件及其制造方法 |
CN108092133B (zh) * | 2017-12-12 | 2020-01-31 | 湖南艾华集团股份有限公司 | 过电压与突波保护元件 |
CN108417566A (zh) * | 2017-12-21 | 2018-08-17 | 上海长园维安微电子有限公司 | 一种两通路tvs器件及其制备方法 |
CN108155129A (zh) * | 2017-12-29 | 2018-06-12 | 山东才聚电子科技有限公司 | 一种焊接模循环使用的合片机构 |
US11349021B2 (en) * | 2020-03-24 | 2022-05-31 | Littelfuse, Inc. | Thyristor assembly |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4807021A (en) * | 1986-03-10 | 1989-02-21 | Kabushiki Kaisha Toshiba | Semiconductor device having stacking structure |
US4794431A (en) * | 1986-04-21 | 1988-12-27 | International Rectifier Corporation | Package for photoactivated semiconductor device |
US5084753A (en) | 1989-01-23 | 1992-01-28 | Analog Devices, Inc. | Packaging for multiple chips on a single leadframe |
US5150271A (en) * | 1990-08-21 | 1992-09-22 | Texas Instruments Incorporated | Telecommunication equipment protector |
JP2850606B2 (ja) * | 1991-11-25 | 1999-01-27 | 富士電機株式会社 | トランジスタモジュール |
US5337216A (en) * | 1992-05-18 | 1994-08-09 | Square D Company | Multichip semiconductor small outline integrated circuit package structure |
US5386627A (en) * | 1992-09-29 | 1995-02-07 | International Business Machines Corporation | Method of fabricating a multi-layer integrated circuit chip interposer |
US5252632A (en) * | 1992-11-19 | 1993-10-12 | Savin Roland R | Low cost cathodic and conductive coating compositions comprising lightweight hollow glass microspheres and a conductive phase |
US5484097A (en) | 1994-07-12 | 1996-01-16 | General Instrument Corp. | Fabrication of hybrid semiconductor devices |
US5506174A (en) | 1994-07-12 | 1996-04-09 | General Instrument Corp. | Automated assembly of semiconductor devices using a pair of lead frames |
US5489800A (en) * | 1994-08-31 | 1996-02-06 | Motorola, Inc. | Dual channel small outline optocoupler package and method thereof |
US5814884C1 (en) * | 1996-10-24 | 2002-01-29 | Int Rectifier Corp | Commonly housed diverse semiconductor die |
US6054754A (en) * | 1997-06-06 | 2000-04-25 | Micron Technology, Inc. | Multi-capacitance lead frame decoupling device |
JPH11233712A (ja) * | 1998-02-12 | 1999-08-27 | Hitachi Ltd | 半導体装置及びその製法とそれを使った電気機器 |
KR20000057810A (ko) * | 1999-01-28 | 2000-09-25 | 가나이 쓰토무 | 반도체 장치 |
US6256200B1 (en) * | 1999-05-27 | 2001-07-03 | Allen K. Lam | Symmetrical package for semiconductor die |
US6307755B1 (en) * | 1999-05-27 | 2001-10-23 | Richard K. Williams | Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die |
JP3654116B2 (ja) * | 2000-03-10 | 2005-06-02 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
US6717260B2 (en) * | 2001-01-22 | 2004-04-06 | International Rectifier Corporation | Clip-type lead frame for source mounted die |
JP4286465B2 (ja) * | 2001-02-09 | 2009-07-01 | 三菱電機株式会社 | 半導体装置とその製造方法 |
DE10216008A1 (de) * | 2001-04-12 | 2002-10-24 | Toyoda Gosei Kk | LED-Lampe |
JP2003110077A (ja) * | 2001-10-02 | 2003-04-11 | Mitsubishi Electric Corp | 半導体装置 |
GB0213094D0 (en) * | 2002-06-07 | 2002-07-17 | Power Innovations Ltd | Lead frame |
US6747341B2 (en) * | 2002-06-27 | 2004-06-08 | Semiconductor Components Industries, L.L.C. | Integrated circuit and laminated leadframe package |
US6747342B1 (en) * | 2002-08-09 | 2004-06-08 | Lovoltech, Inc. | Flip-chip packaging |
JP2004079760A (ja) * | 2002-08-19 | 2004-03-11 | Nec Electronics Corp | 半導体装置及びその組立方法 |
US7061077B2 (en) * | 2002-08-30 | 2006-06-13 | Fairchild Semiconductor Corporation | Substrate based unmolded package including lead frame structure and semiconductor die |
US6867481B2 (en) * | 2003-04-11 | 2005-03-15 | Fairchild Semiconductor Corporation | Lead frame structure with aperture or groove for flip chip in a leaded molded package |
TWI257181B (en) * | 2003-07-28 | 2006-06-21 | Rohm Co Ltd | Semiconductor module |
JP2005302951A (ja) * | 2004-04-09 | 2005-10-27 | Toshiba Corp | 電力用半導体装置パッケージ |
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2003
- 2003-07-10 US US10/617,343 patent/US6919625B2/en not_active Expired - Lifetime
-
2004
- 2004-07-12 WO PCT/US2004/022105 patent/WO2005008728A2/en active Application Filing
- 2004-07-12 TW TW093120813A patent/TWI349356B/zh active
- 2004-07-12 CN CNB2004800197279A patent/CN100418214C/zh active Active
-
2005
- 2005-07-18 US US11/183,504 patent/US7242078B2/en not_active Expired - Lifetime
-
2007
- 2007-07-10 US US11/825,991 patent/US7525183B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN100418214C (zh) | 2008-09-10 |
US20080017959A1 (en) | 2008-01-24 |
US20050006731A1 (en) | 2005-01-13 |
US7242078B2 (en) | 2007-07-10 |
WO2005008728A2 (en) | 2005-01-27 |
CN1820367A (zh) | 2006-08-16 |
US6919625B2 (en) | 2005-07-19 |
US7525183B2 (en) | 2009-04-28 |
TWI349356B (en) | 2011-09-21 |
WO2005008728A3 (en) | 2005-09-01 |
US20050248007A1 (en) | 2005-11-10 |
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