TW200512139A - Processing device - Google Patents

Processing device

Info

Publication number
TW200512139A
TW200512139A TW093119729A TW93119729A TW200512139A TW 200512139 A TW200512139 A TW 200512139A TW 093119729 A TW093119729 A TW 093119729A TW 93119729 A TW93119729 A TW 93119729A TW 200512139 A TW200512139 A TW 200512139A
Authority
TW
Taiwan
Prior art keywords
opening
processed
closing
container package
drive means
Prior art date
Application number
TW093119729A
Other languages
English (en)
Inventor
Katsuhiko Oyama
Shinya Mochiduki
Yasushi Takeuchi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200512139A publication Critical patent/TW200512139A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Prevention Of Fouling (AREA)
TW093119729A 2003-07-03 2004-06-30 Processing device TW200512139A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003191180A JP2005026513A (ja) 2003-07-03 2003-07-03 処理装置

Publications (1)

Publication Number Publication Date
TW200512139A true TW200512139A (en) 2005-04-01

Family

ID=33562351

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119729A TW200512139A (en) 2003-07-03 2004-06-30 Processing device

Country Status (5)

Country Link
US (1) US20070110548A1 (zh)
JP (1) JP2005026513A (zh)
KR (1) KR100850815B1 (zh)
TW (1) TW200512139A (zh)
WO (1) WO2005004228A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9226407B2 (en) * 2002-07-01 2015-12-29 Semigear Inc Reflow treating unit and substrate treating apparatus
JP4891199B2 (ja) * 2006-11-27 2012-03-07 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
KR100918588B1 (ko) * 2007-09-19 2009-09-28 세메스 주식회사 파티클 배출 유닛 및 이를 포함하는 기판 이송 장치
JP5729148B2 (ja) 2011-06-07 2015-06-03 東京エレクトロン株式会社 基板搬送容器の開閉装置、蓋体の開閉装置及び半導体製造装置
JP5727609B2 (ja) 2011-07-06 2015-06-03 平田機工株式会社 容器開閉装置
JP5993252B2 (ja) * 2012-09-06 2016-09-14 東京エレクトロン株式会社 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法
JP6016931B2 (ja) * 2012-09-27 2016-10-26 株式会社日立国際電気 基板処理装置、基板処理方法、及び半導体装置の製造方法
SG11201900801XA (en) * 2016-08-08 2019-02-27 Shin Etsu Handotai Co Ltd Load port and method for carrying wafers
KR102374274B1 (ko) * 2016-08-08 2022-03-15 신에쯔 한도타이 가부시키가이샤 로드포트 및 웨이퍼 반송방법
JP6269788B2 (ja) * 2016-11-22 2018-01-31 シンフォニアテクノロジー株式会社 ロードポート
US10622236B2 (en) 2017-08-30 2020-04-14 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for handling wafer carrier doors
CN110473819B (zh) * 2018-05-11 2020-12-08 北京北方华创微电子装备有限公司 一种开门装置、传输腔室和半导体处理设备

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105743B2 (ja) * 1991-04-04 1994-12-21 株式会社荏原製作所 キャリヤボックスの操作方法及び操作装置
JPH05275512A (ja) * 1992-03-30 1993-10-22 Toshiba Corp 真空装置
JPH08213446A (ja) * 1994-12-08 1996-08-20 Tokyo Electron Ltd 処理装置
JPH08293534A (ja) * 1995-04-20 1996-11-05 Tokyo Electron Ltd 被処理体の搬送装置
US6390754B2 (en) * 1997-05-21 2002-05-21 Tokyo Electron Limited Wafer processing apparatus, method of operating the same and wafer detecting system
JP3827021B2 (ja) * 1997-12-01 2006-09-27 大日商事株式会社 基板のコンテナ及びローダ
JPH11214479A (ja) * 1998-01-23 1999-08-06 Tokyo Electron Ltd 基板処理装置及びその方法並びに基板搬送装置
KR100510433B1 (ko) * 1998-04-06 2006-07-27 다이니치쇼지 가부시키가이샤 컨테이너
JP2000150613A (ja) * 1998-11-17 2000-05-30 Tokyo Electron Ltd 被処理体の搬送装置
WO2000033376A1 (fr) * 1998-12-02 2000-06-08 Dainichi Shoji K.K. Contenant
JP3954287B2 (ja) * 1999-06-28 2007-08-08 東京エレクトロン株式会社 ウェハキャリア用蓋体の着脱装置
JP4260298B2 (ja) * 1999-07-27 2009-04-30 株式会社ルネサステクノロジ 半導体部品の製造方法
US8348583B2 (en) * 1999-10-19 2013-01-08 Rorze Corporation Container and loader for substrate
JP2002093880A (ja) * 2000-09-19 2002-03-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3699348B2 (ja) * 2000-11-30 2005-09-28 平田機工株式会社 駆動部隔離ｆｏｕｐオープナ
US7021882B2 (en) * 2000-11-30 2006-04-04 Hirata Corporation Drive-section-isolated FOUP opener
JP3880343B2 (ja) * 2001-08-01 2007-02-14 株式会社ルネサステクノロジ ロードポート、基板処理装置および雰囲気置換方法
US6869263B2 (en) * 2002-07-22 2005-03-22 Brooks Automation, Inc. Substrate loading and unloading station with buffer
US6984839B2 (en) * 2002-11-22 2006-01-10 Tdk Corporation Wafer processing apparatus capable of mapping wafers

Also Published As

Publication number Publication date
KR20060026851A (ko) 2006-03-24
WO2005004228A1 (ja) 2005-01-13
JP2005026513A (ja) 2005-01-27
US20070110548A1 (en) 2007-05-17
KR100850815B1 (ko) 2008-08-06

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