TW200510943A - Method for manufacturing layer pattern, wiring and electronic equipment - Google Patents

Method for manufacturing layer pattern, wiring and electronic equipment

Info

Publication number
TW200510943A
TW200510943A TW093119213A TW93119213A TW200510943A TW 200510943 A TW200510943 A TW 200510943A TW 093119213 A TW093119213 A TW 093119213A TW 93119213 A TW93119213 A TW 93119213A TW 200510943 A TW200510943 A TW 200510943A
Authority
TW
Taiwan
Prior art keywords
layer
layer pattern
wiring
electronic equipment
manufacturing layer
Prior art date
Application number
TW093119213A
Other languages
English (en)
Chinese (zh)
Other versions
TWI297619B (https=
Inventor
Hirofumi Sakai
Kazuaki Sakurada
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200510943A publication Critical patent/TW200510943A/zh
Application granted granted Critical
Publication of TWI297619B publication Critical patent/TWI297619B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Coating Apparatus (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Ink Jet (AREA)
  • Liquid Crystal (AREA)
TW093119213A 2003-07-15 2004-06-29 Method for manufacturing layer pattern, wiring and electronic equipment TW200510943A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003274705 2003-07-15
JP2003327997A JP4192737B2 (ja) 2003-07-15 2003-09-19 層パターン製造方法、配線製造方法、電子機器の製造方法

Publications (2)

Publication Number Publication Date
TW200510943A true TW200510943A (en) 2005-03-16
TWI297619B TWI297619B (https=) 2008-06-11

Family

ID=34197131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119213A TW200510943A (en) 2003-07-15 2004-06-29 Method for manufacturing layer pattern, wiring and electronic equipment

Country Status (5)

Country Link
US (1) US7387903B2 (https=)
JP (1) JP4192737B2 (https=)
KR (1) KR100613158B1 (https=)
CN (1) CN100479633C (https=)
TW (1) TW200510943A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420569B (zh) * 2005-12-28 2013-12-21 Ａｚ電子材料Ｉｐ股份有限公司 圖案及配線圖案與彼等之製法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179213A (ja) 2004-12-21 2006-07-06 Seiko Epson Corp パターン形成基板、電気光学装置及び電気光学装置の製造方法
JP2007027588A (ja) * 2005-07-20 2007-02-01 Seiko Epson Corp 膜パターンの形成方法、デバイス、電気光学装置、及び電子機器
JP4677937B2 (ja) * 2005-07-20 2011-04-27 セイコーエプソン株式会社 膜パターンの形成方法、デバイス、電気光学装置、電子機器、及びアクティブマトリクス基板の製造方法
JP2007053333A (ja) * 2005-07-20 2007-03-01 Seiko Epson Corp 膜パターンの形成方法、デバイス、電気光学装置、電子機器、及びアクティブマトリクス基板の製造方法
JP4670596B2 (ja) * 2005-11-04 2011-04-13 セイコーエプソン株式会社 膜パターン形成方法、デバイス、電気光学装置、及び電子機器
WO2007103254A2 (en) * 2006-03-02 2007-09-13 Axcess International Inc. System and method for determining location, directionality, and velocity of rfid tags
JP2007286469A (ja) 2006-04-19 2007-11-01 Seiko Epson Corp 膜パターンの形成方法、アクティブマトリクス基板の製造方法、デバイス、電気光学装置、及び電子機器
JP2008016413A (ja) * 2006-07-10 2008-01-24 Canon Inc 配線基板の製造方法、電子源の製造方法、画像表示装置の製造方法、画像再生装置
JP4222390B2 (ja) * 2006-07-25 2009-02-12 セイコーエプソン株式会社 パターンの形成方法、及び液晶表示装置の製造方法
US8211782B2 (en) * 2009-10-23 2012-07-03 Palo Alto Research Center Incorporated Printed material constrained by well structures
US8468680B2 (en) 2010-08-24 2013-06-25 Roche Diagnostics Operations, Inc. Biosensor test member and method for making the same
CN111876020B (zh) * 2020-08-06 2021-11-05 中国科学院长春应用化学研究所 一种有机发光材料墨水及其制备方法和喷墨打印方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216330A (ja) 1999-01-26 2000-08-04 Seiko Epson Corp 積層型半導体装置およびその製造方法
TW490997B (en) 2000-03-31 2002-06-11 Seiko Epson Corp Method of manufacturing organic EL element, and organic EL element
JP2002237383A (ja) 2000-03-31 2002-08-23 Seiko Epson Corp 有機ｅｌ素子の製造方法、有機ｅｌ素子
JP2002023783A (ja) * 2000-07-13 2002-01-25 Fujitsu Ltd 対話処理システム
CN100353548C (zh) * 2000-11-17 2007-12-05 皇家菲利浦电子有限公司 电发光器件及其制造方法
JP2003124210A (ja) 2001-10-15 2003-04-25 Seiko Epson Corp 表面処理方法、半導体デバイス、電気回路、表示体モジュール、カラーフィルタおよび発光素子
JP2003163084A (ja) 2001-11-26 2003-06-06 Seiko Epson Corp 有機ｅｌ装置とその製造方法並びに電子機器
US6677251B1 (en) * 2002-07-29 2004-01-13 Taiwan Semiconductor Manufacturing Co., Ltd Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesion
JP4170049B2 (ja) * 2002-08-30 2008-10-22 シャープ株式会社 パターン形成基材およびパターン形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420569B (zh) * 2005-12-28 2013-12-21 Ａｚ電子材料Ｉｐ股份有限公司 圖案及配線圖案與彼等之製法

Also Published As

Publication number Publication date
TWI297619B (https=) 2008-06-11
US7387903B2 (en) 2008-06-17
JP2005046828A (ja) 2005-02-24
JP4192737B2 (ja) 2008-12-10
KR100613158B1 (ko) 2006-08-17
KR20050008493A (ko) 2005-01-21
CN100479633C (zh) 2009-04-15
CN1578598A (zh) 2005-02-09
US20050042850A1 (en) 2005-02-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees