TW200507034A - Transport method and transport apparatus for semiconductor wafer - Google Patents

Transport method and transport apparatus for semiconductor wafer

Info

Publication number
TW200507034A
TW200507034A TW093118709A TW93118709A TW200507034A TW 200507034 A TW200507034 A TW 200507034A TW 093118709 A TW093118709 A TW 093118709A TW 93118709 A TW93118709 A TW 93118709A TW 200507034 A TW200507034 A TW 200507034A
Authority
TW
Taiwan
Prior art keywords
wafer
transport
semiconductor wafer
chuck table
stage
Prior art date
Application number
TW093118709A
Other languages
English (en)
Other versions
TWI338318B (en
Inventor
Masayuki Yamamoto
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003273276A external-priority patent/JP4243990B2/ja
Priority claimed from JP2003273275A external-priority patent/JP2005033119A/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200507034A publication Critical patent/TW200507034A/zh
Application granted granted Critical
Publication of TWI338318B publication Critical patent/TWI338318B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW093118709A 2003-07-11 2004-06-28 Transport method and transport apparatus for semiconductor wafer TWI338318B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003273276A JP4243990B2 (ja) 2003-07-11 2003-07-11 半導体ウエハ搬送方法および搬送装置
JP2003273275A JP2005033119A (ja) 2003-07-11 2003-07-11 半導体ウエハ搬送方法および搬送装置

Publications (2)

Publication Number Publication Date
TW200507034A true TW200507034A (en) 2005-02-16
TWI338318B TWI338318B (en) 2011-03-01

Family

ID=33566830

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118709A TWI338318B (en) 2003-07-11 2004-06-28 Transport method and transport apparatus for semiconductor wafer

Country Status (5)

Country Link
US (1) US7215407B2 (zh)
KR (1) KR101082619B1 (zh)
CN (1) CN100486879C (zh)
SG (1) SG148017A1 (zh)
TW (1) TWI338318B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100413A (ja) * 2004-09-28 2006-04-13 Tokyo Seimitsu Co Ltd フィルム貼付方法およびフィルム貼付装置
JP2007214357A (ja) * 2006-02-09 2007-08-23 Nitto Denko Corp ワーク貼付け支持方法およびこれを用いたワーク貼付け支持装置
JP4953738B2 (ja) * 2006-09-07 2012-06-13 日東電工株式会社 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置
US9554901B2 (en) * 2010-05-12 2017-01-31 Edwards Lifesciences Corporation Low gradient prosthetic heart valve
JP5914206B2 (ja) * 2012-06-20 2016-05-11 リンテック株式会社 シート貼付装置
JP6007008B2 (ja) * 2012-07-06 2016-10-12 リンテック株式会社 シート貼付装置
JP2014027015A (ja) * 2012-07-24 2014-02-06 Lintec Corp シート貼付装置および貼付方法
JP6122299B2 (ja) 2013-01-15 2017-04-26 キヤノン株式会社 処理装置、処理方法、及びデバイスの製造方法
US9475272B2 (en) 2014-10-09 2016-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. De-bonding and cleaning process and system
CN108044355B (zh) * 2017-12-22 2024-01-23 沈阳芯嘉科技有限公司 一种激光砂轮划片机及复合材料切割方法
CN108336002A (zh) * 2018-03-16 2018-07-27 德淮半导体有限公司 清扫装置及清扫晶圆的方法、机械臂
US10695952B2 (en) * 2018-09-19 2020-06-30 Taiwan Semiconductor Manufacturing Co., Ltd. Cutting apparatus with auto chuck cleaning mechanism
CN110053969B (zh) * 2019-04-23 2020-04-07 浙江金麦特自动化系统有限公司 一种机器人自动搬运清洗系统及方法
CN110436149B (zh) * 2019-08-29 2024-07-02 苏州工业职业技术学院 一种带有除尘功能的上料植入装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960016175B1 (en) * 1987-08-28 1996-12-04 Tokyo Electron Ltd Exposing method and apparatus thereof
US5825470A (en) * 1995-03-14 1998-10-20 Nikon Corporation Exposure apparatus
JP3441956B2 (ja) * 1998-02-16 2003-09-02 キヤノン株式会社 露光装置、クリーニング用砥石およびデバイス製造方法
US6817057B2 (en) * 2001-08-30 2004-11-16 Micron Technology, Inc. Spindle chuck cleaner
JP2003077987A (ja) * 2001-09-06 2003-03-14 Sony Corp 基板保持ステージ清掃装置およびその清掃方法
JP2003086545A (ja) 2001-09-14 2003-03-20 Disco Abrasive Syst Ltd 加工歪除去装置
JP3496008B2 (ja) 2001-09-25 2004-02-09 キヤノン株式会社 露光装置およびデバイスの製造方法
KR100460807B1 (ko) * 2002-07-08 2004-12-09 삼성전자주식회사 반도체소자 제조설비의 웨이퍼 외관 검사장치와 이를이용하는 세정설비 및 그 검사방법
US7568490B2 (en) * 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids

Also Published As

Publication number Publication date
KR20050009133A (ko) 2005-01-24
US20050007571A1 (en) 2005-01-13
SG148017A1 (en) 2008-12-31
CN1576203A (zh) 2005-02-09
TWI338318B (en) 2011-03-01
US7215407B2 (en) 2007-05-08
CN100486879C (zh) 2009-05-13
KR101082619B1 (ko) 2011-11-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees